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61. 发明公开

EP2795717A1 CAPACITIVE BLIND-MATE MODULE INTERCONNECTION 有权转让
标题翻译： KAPAZITIVE BLIND-MATE-MODULVERNETZUNG
公开(公告)号：EP2795717A1
公开(公告)日：2014-10-29
申请号：EP12816584.2
申请日：2012-12-21
申请人： Andrew LLC
发明人： ZIMMERMAN, Martin
IPC分类号： H01P5/02 , H01L23/48 , H01Q1/24 , H05K3/32
CPC分类号： H03H7/004 , H01L2924/0002 , H01P5/028 , H01Q1/246 , H05K1/0225 , H05K1/0239 , H05K3/28 , H05K3/40 , H05K2201/0175 , H05K2201/09309 , H05K2201/09336 , H05K2201/09618 , H05K2201/09872 , H01L2924/0001
摘要： A blind-mate capacitive coupling interconnection between a main module enclosure one or more sub-module enclosures has coupling surfaces each with a ground portion and an aperture, an inner element provided in the aperture, spaced away from the ground portion. The coupling surfaces may be provided, for example, as traces on a printed circuit board. To accommodate a degree of mis-alignment, one of the inner elements may be provided larger than the other. Capacitive coupling between the coupling surfaces occurs when the coupling surfaces are mated together, retained in position, for example, by a mechanical fixture.
摘要翻译：一个或多个子模块外壳之间的主模块外壳之间的盲配电容耦合互连具有各自具有接地部分和开口的耦合表面，设置在孔中的内部元件，与接地部分间隔开。耦合表面可以例如设置在印刷电路板上的迹线上。为了适应一定程度的不对准，内部元件中的一个可以被提供为大于另一个。耦合表面之间的电容耦合发生在耦合表面配合在一起时，例如通过机械夹具保持在适当位置。

62. 发明公开

EP2642834A3 Printed circuit board 审中-公开
公开(公告)号：EP2642834A3
公开(公告)日：2014-04-09
申请号：EP12165415.6
申请日：2012-04-24
申请人： Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd. , Hon Hai Precision Industry Co., Ltd.
发明人： Gao, Fu-Li , Lin, Kuo-Pin
IPC分类号： H05K1/02 , H05K1/18
CPC分类号： H05K1/0225 , H05K1/0233 , H05K2201/1003 , H05K2201/10636 , Y02P70/611
摘要： A printed circuit board includes an insulating layer and a conductive metal layer attached on the insulating layer. The conductive metal layer is grounded and is configured for providing grounding for electronic components mounted on the printed circuit board. The insulating layer includes an exposed portion free of the conductive metal layer thereon, and two pads are formed on the exposed portion of the insulating layer and are insulated from each other. An inductor is mounted on the exposed portion and is electrically connected to the two pads.

63. 发明公开

EP2590485A4 HIGH-FREQUENCY SIGNAL LINE AND ELECTRONIC DEVICE 有权
标题翻译：伊朗克里姆森大教堂（HCHFREQUENZ-SIGNALLEITUNG）
公开(公告)号：EP2590485A4
公开(公告)日：2014-01-08
申请号：EP11845031
申请日：2011-12-02
申请人： MURATA MANUFACTURING CO
发明人： KATO NOBORU , TAGO SHIGERU , SASAKI JUN , KURITA JUNICHI , SASAKI SATOSHI
IPC分类号： H05K1/02 , H01P1/203 , H01P3/08 , H01P3/12 , H05K1/03 , H05K1/11
CPC分类号： H01P3/085 , H01L2224/16225 , H01L2924/19105 , H01P1/20363 , H01P3/003 , H01P3/026 , H01P3/08 , H01P3/10 , H01P3/121 , H03H7/38 , H04B15/00 , H05K1/0219 , H05K1/0225 , H05K1/0242 , H05K1/025 , H05K1/0253 , H05K1/028 , H05K1/0393 , H05K1/113 , H05K2201/09618 , H05K2201/0969 , H05K2201/09727
摘要： To provide an easily bendable high-frequency signal line and an electronic apparatus which are capable of suppressing the deviation of the characteristic impedance of a signal line from a predetermined characteristic impedance. A dielectric body 12 is obtained by laminating a protection layer 14 and dielectric sheets 18a to 18c, and has a surface and an undersurface. A signal line 20 is a linear conductor disposed in the dielectric body 12. A ground conductor 22 is disposed in the dielectric body 12, faces the signal line 20 via the dielectric sheet 18a, and continuously extends along the signal line 20. A ground conductor 24 is disposed in the dielectric body 12, faces the ground conductor 22 via the signal line 20 sandwiched therebetween, and has a plurality of openings 30 arranged along the signal line 20. The surface of the dielectric body 12 on the side of the ground conductor 22 with respect to the signal line 20 is in contact with a battery pack 206.
摘要翻译：提供能够抑制信号线的特性阻抗与预定特性阻抗的偏差的容易弯曲的高频信号线和电子设备。通过层叠保护层14和电介质片18a至18c获得电介质体12，并且具有表面和下表面。信号线20是布置在电介质体12中的线状导体。接地导体22设置在电介质体12中，经由电介质片18a面向信号线20，并沿着信号线20连续延伸。接地导体 24设置在电介质体12中，经由夹在它们之间的信号线20面对接地导体22，并且具有沿信号线20布置的多个开口30.介电体12的接地导体一侧的表面 22相对于信号线20与电池组206接触。

64. 发明公开

EP2651199A2 Printed circuit board 有权
标题翻译：印刷电路板
公开(公告)号：EP2651199A2
公开(公告)日：2013-10-16
申请号：EP13162441.3
申请日：2013-04-05
申请人： Canon Kabushiki Kaisha
发明人： Murai, Yusuke , Hoshi, Sou , Yamashita, Nobuaki
IPC分类号： H05K1/02
CPC分类号： H05K1/025 , H01L2224/16225 , H05K1/0225 , H05K1/0243 , H05K1/181 , H05K2201/09263 , H05K2201/093 , H05K2201/09709
摘要： Provided is a printed circuit board 100 capable of increasing an inductance value of a power pattern and a ground pattern while keeping a low electric resistance value of the power pattern and the ground pattern. The printed circuit board includes a printed wiring board 101 including: a power layer 113 having a power pattern 131 formed therein; and a ground layer 112 having a ground pattern 121 formed therein. On the printed wiring board, an LSI 102 as a semiconductor device and an LSI 104 as a power supply member are mounted. The ground pattern has a first ground region R that overlaps the power pattern as viewed from the direction perpendicular to the surface of the printed wiring board. In the first ground region, at least one defect portion 122 is formed. In the first ground region, the defect portion forms a region 121a that is narrower than the power pattern.
摘要翻译：提供了一种印刷电路板100，其能够在保持电源图案和接地图案的低电阻值的同时增加电源图案和接地图案的电感值。印刷电路板包括印刷线路板101，印刷线路板101包括：功率层113，其具有形成在其中的功率图案131; 以及其中形成有接地图案121的接地层112。在印刷线路板上安装有作为半导体装置的LSI102和作为电源部件的LSI104。从垂直于印刷线路板表面的方向来看，接地图案具有与电源图案重叠的第一接地区域R. 在第一接地区域中，形成至少一个缺陷部分122。在第一接地区域中，缺陷部分形成比功率图案窄的区域121a。

65. 发明公开

EP2642834A2 Printed circuit board 审中-公开
标题翻译：印刷电路板
公开(公告)号：EP2642834A2
公开(公告)日：2013-09-25
申请号：EP12165415.6
申请日：2012-04-24
申请人： Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd. , Hon Hai Precision Industry Co., Ltd.
发明人： Gao, Fu-Li , Lin, Kuo-Pin
IPC分类号： H05K1/02
CPC分类号： H05K1/0225 , H05K1/0233 , H05K2201/1003 , H05K2201/10636 , Y02P70/611
摘要： A printed circuit board includes an insulating layer and a conductive metal layer attached on the insulating layer. The conductive metal layer is grounded and is configured for providing grounding for electronic components mounted on the printed circuit board. The insulating layer includes an exposed portion free of the conductive metal layer thereon, and two pads are formed on the exposed portion of the insulating layer and are insulated from each other. An inductor is mounted on the exposed portion and is electrically connected to the two pads.
摘要翻译：印刷电路板包括绝缘层和附着在绝缘层上的导电金属层。导电金属层接地并被配置为为安装在印刷电路板上的电子元件提供接地。绝缘层包括其上没有导电金属层的暴露部分，并且两个焊盘形成在绝缘层的暴露部分上并且彼此绝缘。电感器安装在暴露部分上并电连接到两个焊盘。

66. 发明公开

EP2574155A1 HIGH-FREQUENCY SIGNAL LINE 有权
标题翻译： HOCHFREQUENZSIGNALLEITUNG
公开(公告)号：EP2574155A1
公开(公告)日：2013-03-27
申请号：EP11844521.2
申请日：2011-09-30
申请人： Murata Manufacturing Co., Ltd.
发明人： KATO Noboru
IPC分类号： H05K1/02
CPC分类号： H01P3/003 , H01P1/20363 , H01P3/08 , H01P3/085 , H03H7/38 , H05K1/0221 , H05K1/0225 , H05K1/0242 , H05K1/0253 , H05K1/028 , H05K2201/09618 , H05K2201/0969 , H05K2201/09727
摘要： A flexible high-frequency signal transmission line includes a dielectric body including laminated flexible dielectric layers. A signal line is provided in the dielectric body. A grounding conductor is arranged in the dielectric body to be opposed to the signal line via one of the dielectric layers. The grounding conductor is of a ladder structure including a plurality of openings and a plurality of bridges arranged alternately along the signal line. A characteristic impedance of the signal line changes between two adjacent ones of the plurality of bridges such that the characteristic impedance of the signal line rises from a minimum value to an intermediate value and to a maximum value and falls from the maximum value to the intermediate value and to the minimum value in this order.
摘要翻译：柔性高频信号传输线包括包括层叠的柔性电介质层的电介质体。信号线设置在电介质体内。接地导体布置在电介质体中，以经由一个电介质层与信号线相对。接地导体是梯形结构，包括沿着信号线交替布置的多个开口和多个桥。信号线的特征阻抗在多个桥中的两个相邻桥之间变化，使得信号线的特性阻抗从最小值上升到中间值，并从最大值上升到中间值并以此顺序达到最小值。

67. 发明公开

EP0756447A3 Schaltungsanordnung für Kraftfahrzeuge 失效
标题翻译：电路，用于机动车辆
公开(公告)号：EP0756447A3
公开(公告)日：1997-03-26
申请号：EP96117380.4
申请日：1994-08-03
申请人： Hella KG Hueck & Co.
发明人： Klassen, Eugen , Raulf, Manfred , Rehberg, Helmut
IPC分类号： H05K9/00
CPC分类号： H05K9/0039 , H05K1/0218 , H05K1/0219 , H05K1/0225 , H05K1/0231 , H05K1/0239 , H05K2201/0715 , H05K2201/093 , H05K2201/09663 , H05K2201/10522 , H05K2201/10636 , Y02P70/611
摘要： Bei einer Schaltungsanordnung für Kraftfahrzeuge mit einer elektrisch isolierenden Trägerplatte, mit auf der Trägerplatte angeordneten, Störpotential erzeugenden oder empfindlichen Bauteilen und mit auf der Trägerplatte angeordneten Leiterbahnen, die die Bauteile mit anderen Bauteilen elektrisch verbinden, sind die Bauteile zur einfachen und kostengünstigen Herstellung und zum Erreichen einer ausreichenden Abschirmung von mehreren Leiterbahnringen umgeben, die eine Unterbrechung aufweisen und gegeneinander versetzt sind. Diese Lösung ist mit Abschirmbehälterdeckel anwendbar.

68. 发明公开

EP0756447A2 Schaltungsanordnung für Kraftfahrzeuge 失效
标题翻译： SchaltungsanordnungfürKraftfahrzeuge
公开(公告)号：EP0756447A2
公开(公告)日：1997-01-29
申请号：EP96117380.4
申请日：1994-08-03
申请人： Hella KG Hueck & Co.
发明人： Klassen, Eugen , Raulf, Manfred , Rehberg, Helmut
IPC分类号： H05K9/00
CPC分类号： H05K9/0039 , H05K1/0218 , H05K1/0219 , H05K1/0225 , H05K1/0231 , H05K1/0239 , H05K2201/0715 , H05K2201/093 , H05K2201/09663 , H05K2201/10522 , H05K2201/10636 , Y02P70/611
摘要： Bei einer Schaltungsanordnung für Kraftfahrzeuge mit einer elektrisch isolierenden Trägerplatte, mit auf der Trägerplatte angeordneten, Störpotential erzeugenden oder empfindlichen Bauteilen und mit auf der Trägerplatte angeordneten Leiterbahnen, die die Bauteile mit anderen Bauteilen elektrisch verbinden, sind die Bauteile zur einfachen und kostengünstigen Herstellung und zum Erreichen einer ausreichenden Abschirmung von mehreren Leiterbahnringen umgeben, die eine Unterbrechung aufweisen und gegeneinander versetzt sind. Diese Lösung ist mit Abschirmbehälterdeckel anwendbar.
摘要翻译：电路包括绝缘电路板（1），其支撑由HF屏蔽罩（11）包围的产生HF辐射或对HF辐射敏感的部件。这些部件被施加到电路板的相对表面的一对导体环（2,13）围绕，两个环具有轴向偏移的中断点（3,14），该屏蔽盖底部边缘与导体环。

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