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61. 发明公开

EP1879035A1 Probe Card 有权
标题翻译： Sondenkarte
公开(公告)号：EP1879035A1
公开(公告)日：2008-01-16
申请号：EP07013272.5
申请日：2007-07-06
申请人： TOKYO ELECTRON LIMITED
发明人： Amemiya, Takashi , Tsukada, Syuichi
IPC分类号： G01R1/073 , G01R31/28 , G01R31/319
CPC分类号： G01R1/07314 , G01R1/06716 , G01R31/2831 , G01R31/31905
摘要： In the present invention, an inspection contact structure is attached to a lower surface side of a circuit board of a probe card. The inspection contact structure has a silicon substrate, and sheets attached to upper and lower surfaces of the silicon substrate. Each of the sheets is elastic and has conductive portions in a projecting shape. The silicon substrate is formed with current-carrying paths passing through the substrate in a vertical direction so that the conductive portions of the sheets and the current-carrying paths of the silicon substrate are in contact with each other. The upper and lower sheets are fixed to the silicon substrate, and the sheet on the upper surface is fixed to a circuit board.
摘要翻译：在本发明中，检查接点结构安装在探针卡的电路板的下表面侧。检查接触结构具有硅基板和附着到硅基板的上表面和下表面的片。每个片材是弹性的并且具有突出形状的导电部分。硅衬底形成有沿垂直方向穿过衬底的载流路径，使得片的导电部分和硅衬底的通电路径彼此接触。上下板被固定在硅基板上，上表面的片固定在电路板上。

62. 发明公开

EP1741111A1 COMPLIANT ELECTRICAL CONTACT ASSEMBLY 审中-公开
标题翻译：符合电气紧凑的组件
公开(公告)号：EP1741111A1
公开(公告)日：2007-01-10
申请号：EP05743573.7
申请日：2005-04-28
申请人： Ardent Concepts, Inc.
发明人： VINTHER, Gordon, A.
IPC分类号： H01B11/06 , H05K1/16 , H05K7/10 , H01R12/00 , H01R12/04 , H01R12/16 , G01R1/06 , G01R31/02 , G01R31/26 , H01H31/02 , H01H31/04
CPC分类号： H01R13/2421 , G01R1/06716 , G01R1/06733 , H01R12/52 , H01R2201/20 , H05K7/1069
摘要： A compliant electrical contact assembly (11) for temporarily interfacing two electrical devices. The assembly (11) includes a contact (10) having loops (14) with axes forming with a closed coil with opposed contact points (16, 18). The axes is angled from the direction (17) of the compression force (15) holding the assembly (11) sandwiched between the electrical devices. The electrically shorted loops (14) of the coil slide on the surfaces of one another as the compression force (15) is applied, providing compliance. The contact (16, 18) can be made extremely small such that pitches in the micrometer range can be achieved with very low inductance values. The contact (10) is installed in a through aperture (24) in a dielectric panel (26) such that the contact points (16, 18)extend from opposed openings of the aperture (24). Optionally, the aperture (24) is filled with a compliant, conductive elastomer (36).

63. 发明授权

EP1542023B1 Fingertester 有权
公开(公告)号：EP1542023B1
公开(公告)日：2007-01-03
申请号：EP05002153.4
申请日：2002-11-14
申请人： atg test systems GmbH
发明人： Romanov, Victor
IPC分类号： G01R1/067
CPC分类号： G01R1/06705 , G01R1/067 , G01R1/06711 , G01R1/06716 , G01R1/0675 , G01R1/07392 , G01R31/2805

64. 发明公开

EP1688747A1 Probe assembly with multi-directional freedom of motion 审中-公开
标题翻译： Probenanordnung mit multidirektionaler Bewegungsfreiheit
公开(公告)号：EP1688747A1
公开(公告)日：2006-08-09
申请号：EP05250638.3
申请日：2005-02-04
申请人： Research In Motion Limited
发明人： Loch, Alexander , Ivannikov, Arkady , Toth, Ted
IPC分类号： G01R1/067 , H01R13/426
CPC分类号： G01R1/06772 , G01R1/06716
摘要： An improved test probe assembly has an improved mounting assembly which provides the test probe (102) multi-directional freedom of movement with respect to a base (152) in order to resist damage frequently caused to the test probe. The improved mounting assembly may, for example, include at least a first resilient mount disposed on the base and having at least a first support (156,168) and at least a first resilient element (180,184). The at least a first resilient element, which may, for example, be at least a first spring, is deflectable when the test probe engages a structure, such as a device under testing (DUT) (4). Accordingly, the improved test probe assembly of the invention can be deflected an infinite number of positions, in order to resist damage caused, for example, by misalignment between the probe and the DUT.
摘要翻译：改进的测试探针组件具有改进的安装组件，其提供测试探针（102）相对于基座（152）的多方向运动自由度，以便抵抗经常对测试探针造成的损坏。改进的安装组件可以例如包括设置在基座上并具有至少第一支撑件（156,168）和至少第一弹性元件（180,184）的至少第一弹性支架。当测试探针接合诸如被测设备（DUT）（4）的结构时，至少第一弹性元件例如可以是至少第一弹簧。因此，本发明的改进的测试探针组件可以偏转无限数量的位置，以便抵抗例如通过探头和DUT之间的未对准而引起的损坏。

65. 发明公开

EP1629288A4 BOARD FOR PROBE CARD, INSPECTION APPARATUS, PHOTO-FABRICATION APPARATUS AND PHOTO-FABRICATION METHOD 审中-公开
标题翻译：董事会FÜREINE SONDENKARTE，UNTERSUCHUNGSVORRICHTUNG，FOTOFABRIKATIONSVORRICHTUNG UND FOTOFABRIKATIONSVERFAHREN
公开(公告)号：EP1629288A4
公开(公告)日：2006-07-05
申请号：EP04732020
申请日：2004-05-10
申请人： DAINIPPON SCREEN MFG , JSR CORP
发明人： KOYAGI Y , SHIMOZUMA H , TANABE TAKAYOSHI , YASHIRO TAKAO
IPC分类号： G01R1/073 , G01R3/00 , H01L21/66 , H05K3/00
CPC分类号： G01R3/00 , G01R1/06716 , G01R1/07378
摘要： A photo-fabrication apparatus (1) has a stage (2) for holding a base board (9) thereon, a feeding part (3) for feeding photosensitive material onto the base board (9), a layer forming part (4) for smoothly spreading the fed photosensitive material to form a material layer and a light emitting part (5) for emitting a spatially-modulated light beam onto the material layer. The photo-fabrication apparatus (1) forms a lot of elastic microstructures for fine probe and arranges the microstructures at microscopic intervals in a very small range with high positional accuracy on the base board (9) by repeating formation of a material layer and light emission. The microstructures become elastic probes through plating in a later process.
摘要翻译：光致制造装置（1）具有用于在其上保持基板（9）的载物台（2），用于将感光材料馈送到基板（9）上的馈送部分（3），用于平滑地扩展馈送的感光材料以形成材料层，以及用于将空间调制的光束发射到材料层上的发光部分（5）。光制造装置（1）形成大量用于精细探针的弹性微结构，并且通过重复形成材料层和发光，在基板（9）上以非常小的范围以非常小的范围以高位置精度布置微结构。微结构在后续工艺中通过电镀成为弹性探针。

66. 发明公开

EP1549962A2 CONSTRUCTION STRUCTURES AND MANUFACTURING PROCESSES FOR PROBE CARD ASSEMBLIES AND PACKAGES HAVING WAFER LEVEL SPRINGS 审中-公开
标题翻译：建筑结构和制造工艺的探针板组件和外壳用羽毛在晶片级
公开(公告)号：EP1549962A2
公开(公告)日：2005-07-06
申请号：EP03754376.6
申请日：2003-06-23
申请人： Nanonexus, Inc.
发明人： MOK, Sammy , CHONG, Fu-Chiung , SWIATOWIEC, Frank , LAHIRI, Syamal, Kumar , HAEMER, Joseph, Michael
IPC分类号： G01R31/02
CPC分类号： G01R1/07378 , G01R1/06716 , G01R1/06727 , G01R1/07342 , G01R3/00 , G01R31/2889 , H01L2224/16225 , H01L2924/15311 , H05K3/4092 , H05K7/1061 , Y10S439/912
摘要： Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates. Alternate card assembly structures comprise a compliant carrier structure, such as a decal or screen, which is adhesively attached to the probe chip substrate.

67. 发明公开

EP1542023A3 Fingertester 有权
标题翻译：手指测试仪
公开(公告)号：EP1542023A3
公开(公告)日：2005-06-29
申请号：EP05002153.4
申请日：2002-11-14
申请人： atg test systems GmbH & Co. KG
发明人： Romanov, Victor
IPC分类号： G01R1/067
CPC分类号： G01R1/06705 , G01R1/067 , G01R1/06711 , G01R1/06716 , G01R1/0675 , G01R1/07392 , G01R31/2805
摘要： Die Erfindung betrifft einen Fingertester zum Testen von unbestückten Leiterplatten. Der Fingertester umfasst einen Linearmotor (30) und eine Prüfsonde. Das bewegliche Teil des Linearmotors ist eine Ankerplatte (43), die aus einem nicht-magnetischem Material ausgebildet ist und in regelmäßigen Abständen streifenförmige Ankerelemente (45) aufweist, die aus einem magnetischen Material ausgebildet sind. Die Prüfsonde weist zumindestest zwei elastisch federnde Haltearme auf. Sowohl die Ankerplatte (43) als auch die Prüfsonde können sehr leicht ausgebildet sein, wodurch ein schnelles Kontaktieren der Leiterplattentestpunkte ermöglicht wird.

68. 发明授权

EP1243931B1 "Testing head having vertical probes for semiconductor integrated electronic devices." 有权
标题翻译：测试头具有用于集成半导体部件垂直测试引脚
公开(公告)号：EP1243931B1
公开(公告)日：2004-07-14
申请号：EP02005933.3
申请日：2002-03-15
申请人： Technoprobe S.r.l
发明人： Felici, Stefano , Crippa, Giuseppe
IPC分类号： G01R1/073
CPC分类号： G01R1/07357 , G01R1/06716 , G01R1/06733 , G01R1/07314 , G01R1/07342

69. 发明公开

EP1160576A3 Contact probe and fabrication method thereof 有权
标题翻译：接触式探针，以及它们的制备方法
公开(公告)号：EP1160576A3
公开(公告)日：2003-07-23
申请号：EP01304766.7
申请日：2001-05-31
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Haga, Tsuyoshi, Sumitomo Electr. Ind., Ltd , Okumura, Katsuya , Hayasaka, Nobuo , Shibata, Hideki , Matsunaga, Noriaki
IPC分类号： G01R1/067 , G01R3/00
CPC分类号： G01R1/06716 , G01R1/06722 , G01R1/06733 , G01R1/06738
摘要： A contact probe is fabricated by a method including a lithography step and a plating step. The contact probe includes a plunger unit (1) to form contact with a circuit to be tested, a spring unit (2), and a lead wire connection unit (3), all formed integrally so as to have a three dimensional configuration with uniform thickness with respect to a predetermined plane configuration in a thickness direction perpendicular to the predetermined plane configuration. Preferably, a guide unit (6) parallel to the spring unit (2) is also formed integrally. Further preferably, the contact probe is formed integrally also including a stopper (7) for each unitary configuration of the spring unit (2) constituted by a leaf spring.

70. 发明公开

EP1321978A2 Contact structure 失效
标题翻译： Kontaktstruktur
公开(公告)号：EP1321978A2
公开(公告)日：2003-06-25
申请号：EP03003489.6
申请日：1997-05-15
申请人： FORMFACTOR, INC.
发明人： Khandros, Igor Y. , Pedersen, David V.
IPC分类号： H01L21/48 , H01L21/60 , H05K1/18 , H05K3/34
CPC分类号： H01L23/49811 , G01R1/06716 , G01R1/06744 , G01R1/07342 , G01R3/00 , G01R31/287 , G01R31/2884 , G01R31/2889 , H01H1/0036 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/45144 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01037 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/3011 , H01L2924/3025 , H01L2924/351 , H05K3/20 , H05K3/3421 , H05K3/4015 , H01L2224/13099 , H01L2924/00
摘要： Techniques for performing wafer-level burn-in and test of semiconductor devices include a test substrate (106 and 108) having active electronic components (106a, 106b, 106c, 106d) such as ASICs mounted to an interconnection substrate (108) or incorporated therein, metallic spring contact element (110) effecting interconnections between the ASICs and a plurality of devices-under-test (DUTs) (102a, 102b, 102c, 102d) on a wafer-under-test (WUT), all disposed in a vacuum vessel so that the ASICs can be operated at temperatures independent from and significantly lower than the burn-in temperature of the DUTs. The spring contact elements (110) may be mounted to either the DUTs or to the ASICs, and may fan out to relax tolerance constraints on aligning and interconnecting the ASICs and the DUTs. A significant reduction in interconnect count and consequent simplification of the interconnection substrate (108) is realized because the ASICs are capable of receiving a plurality of signals for testing the DUTs over relatively few signal lines from a host controller (116) and promulgating these signals over the relatively many interconnections between the ASICs and the DUTS.
摘要翻译：用于执行半导体器件的晶片级老化和测试的技术包括具有有源电子部件（106a，106b，106c，106d）的测试基板（106和108），例如安装到互连基板（108）上的或并入其中的ASIC 金属弹簧接触元件（110）在待测晶片（WUT）上实现ASIC与被测试（DUT）（102a，102b，102c，102d）之间的互连之间的互连，全部处于真空中容器，使得ASIC可以在独立于并显着低于DUT的老化温度的温度下操作。弹簧接触元件（110）可以被安装到DUT或ASIC上，并且可以扇出来放松对ASIC和DUT的对准和互连的容限约束。由于ASIC能够通过相对较少的来自主机控制器（116）的信号线来接收用于测试DUT的多个信号，并且将这些信号发布出去，所以实现互连数量的显着减少和互连衬底（108）的随后的简化。 ASIC和DUTS之间的相对多的互连。

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