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    • 62. 发明公开
    • Furnace structure of semiconductor manufacturing apparatus
    • Ofenstruktur einer HerstellungsvorrichtungfürHalbleiter。
    • EP0494783A1
    • 1992-07-15
    • EP92300191.1
    • 1992-01-09
    • NEC CORPORATION
    • Kawase, Yasuyoshi, c/o NEC Corporation
    • H01L21/00F27D9/00
    • H01L21/67115C30B35/00C30B35/005F27B9/028F27B17/0025F27D2019/0084Y10T29/41
    • A furnace structure of a semiconductor manufacturing apparatus includes a process chamber (11), a pair of preliminary chambers (10,12), and shutters (18,19,20,23). The process chamber has a pair of openings in the loading and unloading directions of semiconductor substrates (22) and is designed to perform a predetermined semiconductor manufacturing process. Each of preliminary chambers has a pair of openings and communicates with the process chamber, with one of each pair of openings opposing a corresponding one of the openings of the process chamber. The shutters are respectively arranged between the two openings of the process chamber and the opposing openings of the pair of preliminary chambers and designed to separate the process chamber from the preliminary chambers so as to be opened and closed.
    • 半导体制造装置的炉结构包括处理室(11),一对预备室(10,12)和快门(18,19,20,23)。 处理室在半导体衬底(22)的装载和卸载方向上具有一对开口,并被设计成执行预定的半导体制造工艺。 每个预备室具有一对开口并与处理室连通,每对开口中的一个开口与处理室的对应的一个开口相对。 百叶窗分别布置在处理室的两个开口和一对预备室的相对开口之间,并被设计成将处理室与预备室分开以便打开和关闭。
    • 63. 发明公开
    • Material treatment
    • 材料处理
    • EP0407073A3
    • 1991-03-20
    • EP90306885.6
    • 1990-06-22
    • WOLVERINE CORPORATION
    • Milone, Philip G.
    • B01J8/36
    • F26B17/04F26B3/08F26B21/04F27B9/028F27B9/10
    • The disclosure relates to a multimode thermal treatment system includes a series of particle treatment zones. Perforate conveyor structure (44) for supporting the particulate product to be thermally treated is disposed for movement through the series of treatment zones (A, B). Each treatment zone (66) includes first (upper) distribution plenum structure (80) disposed above the treatment zone and an array of nozzle tubes (78) extending downwardly from the upper distribution plenum into the treatment zone to flow conditioned gas with substantial velocity into the treatment zone for thermal treatment of particulate material being transported by the conveyor (44) structure through the treatment zone; and a second (lower) distribution plenum (92) disposed below the treatment zone for pressurizing the region below the treatment zone and flowing conditioned gas upward through the conveyor structure and the particulate material on the conveyor. The upper and lower distribution plenums are connected to conditioning gas circuit structure, and distribution of gas through the upper and lower distribution plenums to the treatment zone and discharge therefrom is controlled selectively to provide different modes of particulate product treatment.