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61. 发明公开

EP0831981A1 EPOXY-BASED, VOC-FREE SOLDERING FLUX 失效
标题翻译： WEICHLOTFLUSSMITTEL环氧基WITHOUT挥发性有机化合物
公开(公告)号：EP0831981A1
公开(公告)日：1998-04-01
申请号：EP96914783.0
申请日：1996-05-24
申请人： Fry's Metals Inc.
发明人： DIEP-QUANG, Hiep
IPC分类号： B23K35 , H05K3
CPC分类号： H05K3/3484 , B23K35/0227 , B23K35/025 , B23K35/3613 , B23K35/3618 , B23K2201/42
摘要： A resin-based VOC-free soldering flux consists of 40 to 50 wt.% of a liquid epoxy resin, 25 to 30 wt.% of a non-volatile liquid epoxy diluent, 20 to 33 wt.% of a polyfunctional carboxylic acid, and 2.0 to 3.5 wt.% of a thixotropic agent. There are no volatile organic solvents or compounds in the flux which can evaporate during the reflow process. The carboxylic acids are provided in powdered form and are suspended in the epoxy blend wherein they remain as solid particles until heated in the solder reflow process. A VOC-free solder paste formed from the flux consists of 40 to 95 wt.% soldering particles, and 5 to 60 wt.% of the VOC-free soldering flux. The thixotropic agent improves printability of the solder paste onto printed wiring boards. A VOC-free flux-core solder wire includes the VOC-free flux as the inner core of the wire with an outer shell of solder alloy. The VOC-free, epoxy resin based flux effectively activates the solder powder and the copper contact during the reflow process, while at the same time hardens to leave a solid, dry, yet flexible residue on a printed wiring board. No organic compounds are emitted during the reflow process.

62. 发明公开

EP0703846A1 A METHOD OF BRAZING 失效
标题翻译：铜焊
公开(公告)号：EP0703846A1
公开(公告)日：1996-04-03
申请号：EP94917725.0
申请日：1994-06-10
申请人： LEXOR TECHNOLOGIES LIMITED
发明人： PRIGMORE, Robert Marshall
IPC分类号： F28F9 , B23K1 , B23K35 , C23C24
CPC分类号： C23C24/10 , B23K35/0244 , B23K35/286 , B23K35/3605 , B23K35/3613
摘要： A method of brazing is described, the method comprising the steps of applying a layer of particles of an aluminium alloy filler material, said particles having a coating of a flux-type material selected from the group comprising a compound of potassium fluoride and aluminium fluoride together, or other inorganic flux-type material, to at least one of said articles such that said particles are retained at or adjacent at least a part of the joint between said articles; heating to cause the flux-type material and said aluminium alloy filler material to melt and form a brazed joint.

63. 发明公开

EP0696241A1 JOINTS WITH GAPS 失效
标题翻译：使用列链接
公开(公告)号：EP0696241A1
公开(公告)日：1996-02-14
申请号：EP94913181.0
申请日：1994-04-25
申请人： BALL BURNISHING MACHINE TOOLS LIMITED
发明人： LINZELL, Geoffrey, Robert 12 Brookmans Avenue
IPC分类号： B23K20 , B23K35
CPC分类号： B23K20/16 , B23K35/02 , B23K35/0244 , B23K35/22 , B23K35/3613 , Y10T29/49945
摘要： In the Specification of our International Patent Application PCT/GB 91/00950 there is described and claimed a method of securing against lateral motion two bodies held in face to face asperity contact, thereby to make a join between the two bodies, in which methods there is inserted into the interface between the two bodies a material that on minimal initial lateral relative motion of the two surfaces promotes rapid but controllable "galling" between the two surfaces, this galling binding the surfaces against further such motion. However, this method requires the two surfaces to fit well one to the other, and without such a good fit the resultant join may not be entirely satisfactory. The present invention's proposed solution to this gap problem is to use a metal-particle-containing composition comprising the gall enhancing agent loaded with a myriad of small metal particles, which composition can be packed into the gap, and will flow to accommodate a wide range of gap sizes and also to accommodate out-of-round distortion. The composition can take various physical forms, typically those of a free-flowing powder, a viscous liquid, or a stiff paste (and the powders have an additional use in the preparation of preforms for the manufacture of sintered parts).

64. 发明公开

EP0595343A3 Method of forming solder film 失效
标题翻译：形成焊膏膜的方法
公开(公告)号：EP0595343A3
公开(公告)日：1994-06-08
申请号：EP93117573.1
申请日：1993-10-29
申请人： SHOWA DENKO KABUSHIKI KAISHA
发明人： Kuramoto, Takeo , Watabe, Masataka , Noda, Satoshi , Shoji, Takashi c/o Showa Denko K.K., Chichibu Res. , Sakai, Takekazu
IPC分类号： H05K3/34 , B23K35/36 , B23K35/02
CPC分类号： H05K3/3484 , B23K3/0607 , B23K3/0623 , B23K35/0244 , B23K35/3613 , B23K35/3615 , B23K2201/40 , B23K2201/42 , H01L23/49582 , H01L2924/0002 , H05K3/282 , H05K2201/10984 , H05K2203/0425 , H05K2203/043 , H05K2203/0522 , H05K2203/0557 , H05K2203/0591 , H05K2203/124 , H01L2924/00
摘要： A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting tackiness to only a predetermined part of the metallic surface by means of a tacky layer-forming solution containing at least one compound selected from benzotriazole derivatives, naphthotriazole derivatives, imidazole derivatives, benzoimidazole derivatives, mercaptobenzothiazole derivatives, benzothiazole thiofatty acid derivatives, and triazine derivatives, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.
摘要翻译：在诸如印刷电路板的金属电路板的焊盘和电子部件的引线框架的金属表面上形成焊料膜的方法，其能够形成精确和精细的图案，并且包括仅选择性地赋予粘合性通过含有选自苯并三唑衍生物，萘并三唑衍生物，咪唑衍生物，苯并咪唑衍生物，巯基苯并噻唑衍生物，苯并噻唑硫代脂肪酸衍生物和三嗪衍生物中的至少一种化合物的粘性层形成溶液的金属表面的预定部分，将粉末状焊接到所得粘性部分，然后通过加热熔化焊料，从而形成焊料膜。

65. 发明公开

EP0443030A4 SOLDERING FLUX 失效
标题翻译：焊接金属
公开(公告)号：EP0443030A4
公开(公告)日：1993-07-07
申请号：EP90912077
申请日：1990-08-08
申请人： NIPPONDENSO CO., LTD. , HARIMA CHEMICALS, INC.
发明人： TAKEMOTO MASANORI , ONISHI TATSUSHI , AIHARA MASAMI
IPC分类号： B23K35/363 , B23K35/36
CPC分类号： B23K35/3613

66. 发明公开

EP0512489A3 Aluminium brazing paste 失效
标题翻译：铝烧烤膏
公开(公告)号：EP0512489A3
公开(公告)日：1992-12-16
申请号：EP92107612.1
申请日：1992-05-06
申请人： KABUSHIKI KAISHA NIHON GENMA , TOYO ALUMINIUM KABUSHIKI KAISHA
发明人： Ogura, Toshiaki , Takemoto, Tadashi , Ujie, Tatsuyuki
IPC分类号： B23K35/363
CPC分类号： B23K35/3613 , B23K35/36 , B23K35/3605
摘要： Discloses an aluminium brazing paste which not only has excellent preservability and coating performance but also reveals excellent brazing characteristics; Said aluminium brazing paste according to this invention comprises, per 100 parts by weight of aluminum-containing metal powder with 10 to 500 µm of mean particle size for aluminium brazing, of 0.5 to 15 parts by weight of flux and 30 to 80 parts by weight of a liquid polyisobutylene with 300 to 1500 of average molecular weight and/or its hydrogenated product.

67. 发明公开

EP0510539A1 Additive for fluxes and soldering pastes 失效
标题翻译： ZusätzefürFlussmittel undWeichlötpasten。
公开(公告)号：EP0510539A1
公开(公告)日：1992-10-28
申请号：EP92106665.0
申请日：1992-04-16
申请人： YUHO CHEMICALS INC.
发明人： Gomi, Tadashi , Douzaki, Yuji
IPC分类号： B23K35/363
CPC分类号： B23K35/3613 , B23K35/3618
摘要： An additive contains a silicone resin as a deactivation agent which functions at soldering temperature. This novel additive is used for fluxes and soldering pastes. In the course of soldering, the silicone resin in the additive deactivates an activator such as organic acids contained in the flux and the soldering paste in order for removal of an oxide film from a metallic base used for electric circuit. By use of the additive, corrosion of the metallic base with the activator is protected even though the activator remains on the base. The additive enables to omit an unnecessary washing step from a preparation of electric circiut.
摘要翻译：添加剂含有作为钝化剂的硅树脂，其在焊接温度下起作用。这种新型添加剂用于焊剂和焊膏。在焊接过程中，添加剂中的有机硅树脂使助焊剂和焊膏中包含的有机酸的活化剂失活，以从用于电路的金属基底上除去氧化膜。通过使用添加剂，即使活化剂保留在基底上，金属碱与活化剂的腐蚀也得到保护。添加剂能够从电循环的制备中省略不必要的洗涤步骤。

68. 发明公开

EP0488398A3 Soldering flux composition 失效
标题翻译：焊接组合物
公开(公告)号：EP0488398A3
公开(公告)日：1992-10-21
申请号：EP91120582.1
申请日：1991-11-29
申请人： NIPPONDENSO CO., LTD. , HARIMA CHEMICALS, INC.
发明人： Takemoto, Masanori , Onishi, Tatsushi , Aihari, Masami
IPC分类号： B23K35/36
CPC分类号： B23K35/3615 , B23K35/3613
摘要： A soldering flux composition comprising, as a flux base resin, a modified amine compound obtained by reacting (i) at least one member selected from the group consisting of vinyl group-containing compounds, carboxyl group-containing compounds and epoxy group-containing compounds (ii) with an amine compound having an active hydrogen.

69. 发明公开

EP0456409A2 Water soluble soldering flux 失效
标题翻译： WasserlöslichesLotflussmittel。
公开(公告)号：EP0456409A2
公开(公告)日：1991-11-13
申请号：EP91303967.3
申请日：1991-05-01
申请人： International Business Machines Corporation
发明人： Gutierrez, Barbara Larisa , Sickler, Janet
IPC分类号： B23K35/363
CPC分类号： B23K35/3613 , B23K35/3618
摘要： A water soluble soldering flux is shown which includes gum arabic, modified polysaccharides and other natural resins as the carrier, an organic activator and water. The carrier provides a tacky, yet fluid medium capable of holding precisely aligned electrical components during solder reflow and allows aqueous removal of the flux after reflow. The flux composition can be used to solder precisely aligned integrated circuit chips onto a circuit board.
摘要翻译：显示了一种水溶性助焊剂，其包括阿拉伯胶，改性多糖和其它天然树脂作为载体，有机活化剂和水。载体提供了一种粘性而又流体的介质，能够在焊锡回流期间保持精确对准的电气部件，并允许在回流之后水分除去焊剂。焊剂组合物可用于将精确对准的集成电路芯片焊接到电路板上。

70. 发明公开

EP0447666A1 Basische Metall Kernelektrode mit niedrigem Wasserstoffgehalt 失效
标题翻译： Basische Metall Kernelektrode mit Niedrigem Wasserstoffgehalt。
公开(公告)号：EP0447666A1
公开(公告)日：1991-09-25
申请号：EP90125182.7
申请日：1990-12-21
申请人： THE LINCOLN ELECTRIC COMPANY
发明人： Chai, Chang-Shung , Fink, David A. , Gonzalez, John
IPC分类号： B23K35/368
CPC分类号： B23K35/3073 , B23K35/3602 , B23K35/3605 , B23K35/3613 , B23K35/3616 , B23K35/362 , B23K35/368
摘要： Die Erfindung betrifft ein im Schweißbetrieb abschmelzendes Schweißelement für das Lichtbogenschweißen mit einem Stahlmantel (12), der einen kompakten bzw. verdichteten Kern umschließt, der Metallegierungspulver (20) und eine im wesentlichen zu 100 % basische Verbindung in einer Menge unterhalb etwa 1,6 Gew.-% enthält. Diese basische Verbindung besteht aus Calciumfluoridpulver (22), dessen Anteil vorzugsweise im Bereich von etwa 0,1 % bis 0,9 %, bezogen auf das Gesamtgewicht des Schweißelemtentes, beträgt. Nach einem weiteren Merkmal der Erfindung enthält das Kernmaterial ferner ein spezielles Mittel (24) zur Verminderung der Menge an diffundierbarem Wasserstoff im Schweißmetall. Das erfindungsgemäße Schweißelement kann als Füll- oder Zusatzmetall für das TIG-Schweißen verwendet werden. Vorzugsweise wird es als abschmelzende Elektrode beim MIG-Schweißen eingesetzt.
摘要翻译：本发明涉及一种在电弧焊接焊接时消耗的焊接元件。该元件具有包围含有金属合金粉末（20）的紧凑或压实的芯体和小于约1.6重量％的基本上100％碱性化合物的钢护套（12）。所述碱性化合物由优选在焊接元件总重量的约0.1％至0.9％的范围内的氟化钙粉末（22）组成。根据本发明的另一特征，芯材料还包含用于减少焊接金属中的可扩散氢的量的特殊试剂（24）。根据本发明的焊接元件可用作TIG焊接的填充或添加金属。优选地，其用作MIG焊接中的可消耗电极。

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