专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明公开

EP2634066A4 DEVICE FOR CONTROLLING DRIVE OF MOTOR FOR ELECTRIC POWER STEERING DEVICE 有权
标题翻译： VORRICHTUNG ZUR STEUERUNG DES ANTRIEBS EINES MOTORSFÜREINE ELEKTRISCHE SERVOLENKVORRICHTUNG
公开(公告)号：EP2634066A4
公开(公告)日：2017-05-10
申请号：EP11835879
申请日：2011-02-23
申请人： MITSUBISHI ELECTRIC CORP
发明人： NAKANO MASATSUGU , ASAO YOSHIHITO
IPC分类号： B62D5/04
CPC分类号： H05K7/2039 , B62D5/0406 , H02K11/33 , H05K7/06 , H05K7/20445 , H05K7/20854 , H05K7/209
摘要： A device designed to reduce temperature rise in its control board, and to be compact. The device includes a switching element(4); a coil(9); a smoothing capacitor (10); an electrical connection member(7) for electrically connecting the switching element(9) with the smoothing capacitor (10) and the coil(9); a control board(1) that mounts a control element; a control signal line(5) for electrically connecting the switching element(4) with the control board(1); and a switching element placing portion(6) for placing the switching element (4) thereon. The electrical connection member(7) is arranged between the switching element(4) and the control board(1); the smoothing capacitor(10) and the coil(9) are arranged, with respect to the electrical connection member(7), on a side of the switching element(4); and end surfaces of the smoothing capacitor(10) and the coil(9) are positioned, with respect to the electrical connection member(7), apart from a plane where the switching element(4) and the switching element placing portion(6) are adjoined together.
摘要翻译：设计用于降低控制板温度升高并且结构紧凑的设备。该装置包括开关元件（4）; 一个线圈（9）; 平滑电容器（10）; 电连接部件（7），其用于将开关元件（9）与平滑电容器（10）和线圈（9）电连接; 控制板（1），其安装控制元件; 控制信号线（5），用于将开关元件（4）与控制板（1）电连接; 和用于在其上放置开关元件（4）的开关元件放置部分（6）。电连接件（7）设置在开关元件（4）与控制板（1）之间; 平滑电容器（10）和线圈（9）相对于电连接部件（7）布置在开关元件（4）的一侧; 平滑电容器（10）和线圈（9）的端面相对于电连接部件（7）与开关元件（4）和开关元件放置部（6）的平面分开，毗连在一起。

52. 发明公开

EP2282334A4 SUBSTRATE FOR POWER MODULE, POWER MODULE, AND METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE 有权转让
标题翻译：支持电源模块，电源模块和制造方法支持用于电源模块
公开(公告)号：EP2282334A4
公开(公告)日：2014-11-19
申请号：EP09746678
申请日：2009-05-15
申请人： MITSUBISHI MATERIALS CORP
发明人： KUROMITSU YOSHIROU , AKIYAMA KAZUHIRO , KITAHARA TAKESHI , TONOMURA HIROSHI
IPC分类号： H01L23/373 , H05K1/02 , H05K1/05 , H05K7/06
CPC分类号： H05K1/053 , H01L23/3735 , H01L2224/32225 , H05K1/021 , H05K1/0212 , H05K1/18 , H05K1/181 , H05K7/06 , Y10T29/49124 , Y10T428/12576
摘要： A power module substrate includes: a ceramics substrate (11) composed of AlN. having a top face; a metal plate (22, 23) composed of pure aluminum and joined to the top face of the ceramics substrate (11) with a brazing filler metal (24, 25) including silicon interposed therebetween; and a high concentration section (32) formed at a joint interface (30) at which the metal plate (22, 23) is joined to the ceramics substrate (11), having a silicon concentration that is more than five times the silicon concentration in the metal plate (22, 23).

53. 发明公开

EP2713585A1 Electronic apparatus and method for assembling the same 有权转让
标题翻译：电子装置及其组装方法
公开(公告)号：EP2713585A1
公开(公告)日：2014-04-02
申请号：EP13168403.7
申请日：2013-05-20
申请人： HTC Corporation
发明人： Chuang, I-Cheng , Liao, Yu-Jing , Cheng, Ying-Yen , Chen, Yin-Chou
IPC分类号： H04M1/02 , G06F1/16
CPC分类号： H05K7/06 , G06F1/1626 , H04M1/0202 , H04M1/0262 , H04M1/0266 , H04M1/0277 , H05K13/0023 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128
摘要： An embodiment of the invention relates to an electronic apparatus including a housing (110), a motherboard (120), a battery module (130) and a display module (140) is provided. The housing has at least an opening and an accommodating space. The motherboard is disposed in the accommodating space. The battery module is disposed in the accommodating space and stacked over the motherboard. The motherboard is located between the housing and the battery module. The display module is disposed in the accommodating space and stacked over the battery module. The battery module is located between the motherboard and the display module. At least one edge of the battery module in a width direction of the battery module is closer to a corresponding side of the housing than a corresponding edge of the motherboard in a width direction of the motherboard.
摘要翻译：本发明实施例涉及一种电子设备，包括壳体（110），主板（120），电池模块（130）和显示模块（140）。外壳至少具有开口和容纳空间。主板设置于容置空间内。电池模块设置于容置空间并堆叠于主板上。主板位于外壳和电池模块之间。显示模块设置于容置空间并堆叠于电池模块上。电池模块位于主板和显示模块之间。电池模块在电池模块的宽度方向上的至少一个边缘在主板的宽度方向上比主板的对应边缘更靠近壳体的对应侧。

54. 发明公开

EP2698880A1 WIRING MODULE 有权
标题翻译： VERKABELUNGSMODUL
公开(公告)号：EP2698880A1
公开(公告)日：2014-02-19
申请号：EP12770673.7
申请日：2012-04-10
申请人： AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , Sumitomo Electric Industries, Ltd.
发明人： OKAMOTO, Ryoya , HIRAMITSU, Hiroomi , HIRAI, Hiroki , KASUGAI, Masakuni
IPC分类号： H01R13/631 , H01R13/514 , H01R13/642
CPC分类号： H05K7/06 , H01R9/2416 , H01R13/518 , H01R13/631 , H01R13/642 , H05K7/1435 , H05K7/1439 , H05K7/1477
摘要： It is aimed to provide a wiring module which can reliably and easily wire a stacked device formed by stacking a plurality of units each including an identically shaped fitting portion for a connector. A wiring module (1) includes a wiring harness (10) including a plurality of wires (11) and connectors (12) fixed to ends of the respective wires (11) and fittable into the fitting portions (91), and a positioning member (20) fixed to the wiring harness (10) and capable of being positioned at a predetermined position with respect to a stacked device (90). The positioning member (20) includes connector fixing portions (21) arranged at the same intervals as the fitting portions (91) of the stacked device (90). Each connector (12) of the wiring harness (10) is fixedly positioned at a position facing the corresponding fitting portion (91) out of a plurality of fitting portions (91) by the connector fixing portion (21) in a state where the positioning member (20) is positioned at the predetermined position with respect to the stacked device (90).
摘要翻译：目的在于提供一种布线模块，该布线模块能够可靠地并且容易地连接通过堆叠多个单元形成的堆叠装置，每个单元包括用于连接器的相同形状的嵌合部分。布线模块（1）包括：线束（10），其包括固定到各个导线（11）的端部并可装配到装配部分（91）中的多个导线（11）和连接器（12），以及定位构件（20）固定到所述线束（10）并且能够相对于堆叠的装置（90）定位在预定位置。定位构件（20）包括以与堆叠装置（90）的装配部分（91）相同的间隔布置的连接器固定部分（21）。线束（10）的每个连接器（12）在定位的状态下通过连接器固定部分（21）固定地定位在与多个配合部分（91）相对的相应配合部分（91）的位置处构件（20）相对于堆叠装置（90）位于预定位置。

55. 发明公开

EP2695493A1 ELEKTRONIKMODUL 审中-公开
公开(公告)号：EP2695493A1
公开(公告)日：2014-02-12
申请号：EP12711353.8
申请日：2012-02-29
申请人： Robert Bosch GmbH
发明人： BUBECK, Helmut , MUELLER, Thomas , SCHINZEL, Ralf , LAUSMANN, Matthias , BRAUN, Holger , VOIGTLAENDER, Klaus , BERTSCH, Benjamin
IPC分类号： H05K1/18 , H05K3/00 , F16H61/00 , H05K5/00
CPC分类号： H05K7/06 , B60Y2400/30 , F16H61/0006 , H05K1/0203 , H05K1/021 , H05K1/0233 , H05K1/182 , H05K3/0061 , H05K5/0082 , H05K7/2039 , H05K7/20509 , H05K2201/10151
摘要： The invention relates to an electronic module comprising at least one electronic or electric component (3), a base plate (4), and a support plate (2), in particular a printed circuit board or a substrate. Said support plate (2) is arranged on the base plate (4) and comprises conductor paths. Said base plate (4) comprises a blind hole-type recess (5) on a side oriented towards the support plate (2). The component (3) is in contact on the support plate (2) and is arranged in the recess (5) of the base plate (4).
摘要翻译：本发明涉及一种电子模块，其包括至少一个电子或电气部件（3），基板（4）和支撑板（2），尤其是印刷电路板或基板。所述支撑板（2）布置在基板（4）上并且包括导体路径。所述基板（4）在朝向支撑板（2）的一侧上包括盲孔型凹部（5）。部件（3）与支撑板（2）接触并且布置在基板（4）的凹部（5）中。

56. 发明公开

EP1830619A3 Fixierelement für elektrische Leiter, Leiterstruktur-Bauteil und Verfahren zu dessen Herstellung 审中-公开
标题翻译：固定其制备为电导体元件，导体结构部件和过程
公开(公告)号：EP1830619A3
公开(公告)日：2009-08-19
申请号：EP07450034.9
申请日：2007-02-21
申请人： Pollmann Austria OHG
发明人： Pollmann, Robert , Weber, Harald , Wimmer, Walter
IPC分类号： H05K7/06
CPC分类号： H05K3/103 , B29C45/14639 , B29K2995/0005 , H05K3/107 , H05K7/06 , H05K2201/10287 , H05K2201/10598
摘要： Für einen Leiterstruktur-Bauteil (1) mit Kunststoff-Umspritzung (5) wird ein Fixierelement (4') für elektrische Leiter eingesetzt, das durch einen vorgefertigten Trägerkörper (4) mit Aufnahmen (3) für die Halterung von einzelnen Drähten (2) als elektrische Leiter gebildet ist.

57. 发明公开

EP1869950A2 SYSTEM AND METHOD FOR ATTACHING A SUBSTANTIALLY THREE DIMENSIONAL STRUCTURE TO A SUBSTANTIALLY TWO DIMENSIONAL STRUCTURE 审中-公开
标题翻译：系统和方法施加基本的三维结构至基本二维结构
公开(公告)号：EP1869950A2
公开(公告)日：2007-12-26
申请号：EP06738703.5
申请日：2006-03-15
申请人： E-Cath, Inc.
发明人： KENT, Harold, B. , KENT, Steven, T.
IPC分类号： H05B3/00
CPC分类号： H05K7/06 , A61M25/0021 , A61M25/0023 , A61M25/0043 , A61M25/0045 , A61M25/005 , A61M2025/0037 , A61M2025/004 , B01L3/5027 , B81B2201/058 , B81C3/008 , H05K1/0272 , H05K1/182 , H05K1/183 , H05K3/341 , H05K3/3447 , H05K3/368 , H05K3/4046 , H05K2201/10265 , Y02P70/613 , Y10T29/4902 , Y10T29/49117 , Y10T137/0318 , Y10T137/8593
摘要： A method and system for transporting a fluid, gas, semi-solid, cryogen, or particulate matter, or combination thereof, between a three-dimensional structure and a substantially two-dimensional structure is disclosed. A system and method for electrically coupling a three-dimensional structure to a substantially two dimensional structure is also disclosed.

58. 发明授权

EP0538432B1 VORRICHTUNG ZUM HERSTELLEN EINER ELEKTRISCHEN SCHALTUNG, INSBESONDERE FÜR EINE MESSONDE UND MESSONDE 失效
标题翻译：设备技术制造电路，特别是对于一个测量探头和测量探头。
公开(公告)号：EP0538432B1
公开(公告)日：1995-09-27
申请号：EP92909450.6
申请日：1992-05-08
申请人： BÖCK, Josef
发明人： BÖCK, Josef
IPC分类号： H05K7/06 , H01H13/70
CPC分类号： H05K7/06 , H01H13/702 , H01H2203/008 , H01H2203/01 , H05K3/10 , H05K3/281 , H05K2201/0281 , H05K2201/029 , H05K2201/0352 , H05K2201/0391
摘要： A measuring probe (30) has an analysis substrate support (A) with a woven fabric (1) consisting of metal warp threads (1a) and insulating plastic weft threads (1b) in the woof direction. Some of the mesh apertures are doped with analysis substrates (32-34) which change their electrical resistance on contact with, for example, a liquid to be measured. The metal threads (1a) passing the doped meshes constitute the electrical connection to the outside or to an evaluation circuit (B) which is preferably an integrated circuit.

59. 发明授权

EP0319827B1 Wiring method and apparatus for electronic circuit boards or the like 失效
标题翻译：电子电路板的布线方法和装置等
公开(公告)号：EP0319827B1
公开(公告)日：1993-08-18
申请号：EP88119876.6
申请日：1988-11-29
申请人： HITACHI, LTD.
发明人： Hasegawa, Hiroshi Ekureru Ninomiya 404 , Amimoto, Toshiyuki , Tani, Mitsukiyo
IPC分类号： H05K7/06 , H05K13/06
CPC分类号： H05K3/222 , H05K7/06 , H05K13/06 , Y10T29/49162 , Y10T29/49167 , Y10T29/49169 , Y10T156/1002 , Y10T156/1007

60. 发明授权

EP0227002B1 Heat activatable adhesives for wire scribed circuit boards 有权转让
标题翻译：用于电线电路板的热活化粘合剂
公开(公告)号：EP0227002B1
公开(公告)日：1992-12-16
申请号：EP86117457.1
申请日：1986-12-16
申请人： Advanced Interconnection Technology, Inc.
发明人： Friedrich, Marju Laube
IPC分类号： C09J167/00 , C09J163/00 , C09J175/00 , H05K3/22
CPC分类号： C09J171/00 , C08G59/18 , C09J163/00 , G02B6/3801 , H05K3/103 , H05K3/386 , H05K7/06 , H05K2201/0145 , H05K2201/10287 , H05K2203/0285 , H05K2203/1105

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式