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51. 发明公开

EP2133398A1 FIRE-RETARDANT ADHESIVE RESIN COMPOSITION, AND ADHESIVE FILM USING THE SAME 有权
标题翻译： FLAMMFESTE KLEBHARZZUSAMMENSETZUNG SOWIE DAVON GEBRAUCH MACHENDER KLEBFILM
公开(公告)号：EP2133398A1
公开(公告)日：2009-12-16
申请号：EP08721481.3
申请日：2008-03-06
申请人： Nippon Steel Chemical Co., Ltd.
发明人： MORI, Akira , TOKUHISA, Kiwamu , NAKAHARA, Kazuhiko , KAJI, Masashi
IPC分类号： C09J179/08 , C08L63/00 , C08L79/08 , C09J7/00 , C09J11/06 , C09J163/00 , C09J183/04
CPC分类号： C08G59/4284 , C08G59/04 , C08G59/245 , C08G73/106 , C08L63/00 , C08L2666/14 , C08L2666/22 , C09J163/00 , C09J179/08 , C09J183/10 , H05K3/386 , H05K2201/0162
摘要： Disclosed is a halogen- and phosphorus-free flame-retardant adhesive resin composition which can be used in heat contact bonding of adherends at or below 250°C and is excellent in heat resistance, solder heat resistance after moisture absorption, and processability. Also disclosed is an adhesive film produced from said composition. The flame-retardant adhesive resin composition comprises 65-98% by weight of a silicone unit-containing polyimide resin and 2-35% by weight of an epoxy resin having an acenaphthylene-substituted naphthalene skeleton. The adhesive film produced from the flame-retardant adhesive resin composition is suitable as an adhesive for a laminate for a multiplayer printed circuit board substrate, an adhesive for a hybrid circuit board substrate, and an adhesive for a coverlay film.
摘要翻译：公开了一种无卤阻燃粘合剂树脂组合物，其可用于250℃以下的被粘物的热接触粘合，耐热性，吸湿后的耐焊锡性，加工性优异。还公开了由所述组合物制备的粘合膜。阻燃性粘合剂树脂组合物包含65-98重量％的含硅氧烷单元的聚酰亚胺树脂和2-35重量％的具有苊烯取代的萘骨架的环氧树脂。由阻燃粘合树脂组合物制成的粘合膜适用于多层印刷电路板基板，混合电路板基板用粘合剂和覆盖膜用粘合剂的粘合剂。

52. 发明公开

EP2083031A1 CRYSTALLINE RESIN CURED PRODUCT, CRYSTALLINE RESIN COMPOSITE BODY AND METHOD FOR PRODUCING THE SAME 审中-公开
标题翻译：结晶性树脂结晶性树脂固化物含复合体及其制造方法
公开(公告)号：EP2083031A1
公开(公告)日：2009-07-29
申请号：EP07831468.9
申请日：2007-11-08
申请人： Nippon Steel Chemical Co., Ltd.
发明人： KAJI, Masashi , OGAMI, Koichiro , NAKAHARA, Kazuhiko , FUKUNAGA, Tomomi
IPC分类号： C08G59/24 , C08G59/62 , C08J5/24
CPC分类号： C08G59/245 , C08G59/5033 , C08G59/621 , C08G63/42
摘要： Provided are a crystalline resin cured product which shows high thermal conductivity, low thermal expansion, high heat resistance, low moisture absorption, and good gas barrier properties and a crystalline resin composite material produced therefrom. Further provided is a method for producing the crystalline resin cured product and the crystalline resin composite material. The crystalline resin cured product is obtained by the reaction of an aromatic diglycidyl compound or a diglycidyl resin with an aromatic dihydroxy compound or with a dihydroxy resin and it shows a heat of melting of 10 J/g or more in differential thermal analysis while the endothermic peak corresponding to the melting appears in the range of 120 to 320°C. The crystalline resin composite material is obtained by combining the crystalline resin cured product with a filler or a base material. The crystalline resin cured product has a unit represented by -A-O-CH 2 -CH(OH)-CH 2 -O-B-, wherein A and B are divalent aromatic groups.
摘要翻译：本发明提供一种结晶性树脂固化物表现出高的导热性，低热膨胀性，高耐热性，低吸湿性和良好的阻气性和由其产生的结晶性树脂复合材料。进一步提供的是用于制备结晶性树脂固化物和结晶性树脂复合材料的方法。结晶性树脂固化物是将芳香族二缩水甘油基化合物的反应或在芳族二羟基化合物或二羟基树脂与二缩水甘油基树脂获得，并且它示出了在同时吸热差热分析的10J / g或更高的熔化的热对应的峰值到熔化出现在120至320℃ 结晶性树脂复合材料是由结晶性树脂固化物与填料或基材组合而获得。结晶性树脂固化物具有由-A-O-CH 2 -CH（OH）-CH 2 -O-B-，worin A和B表示的单元是二价芳族基团。

53. 发明公开

EP1674919A8 SEALANT FOR LIQUID CRYSTAL, LIQUID-CRYSTAL DISPLAY MADE WITH THE SAME, AND PROCESS FOR PRODUCING THE DISPLAY 审中-公开
标题翻译：密封中的液体，这使得液晶显示器和工艺用于生产显示器
公开(公告)号：EP1674919A8
公开(公告)日：2006-08-23
申请号：EP04792449.3
申请日：2004-10-15
申请人： NIPPON KAYAKU KABUSHIKI KAISHA , SHARP KABUSHIKI KAISHA
发明人： SAKANO, Tsunetoshi , HAYASIBARA, Syouichi , AKATUKA, Yasumasa , HIRANO, Masahiro , OKAZAKI, Tsuyoshi , MATSUMOTO, Toshihiro , WAKA, Nobuhiro , NISHIWAKI, Shogo
IPC分类号： G02F1/1339
CPC分类号： G02F1/1339 , C08G59/245 , Y10T428/10 , Y10T428/1059 , Y10T428/1064 , Y10T428/1068 , Y10T428/1073
摘要： A liquid crystal sealant comprising an epoxy resin represented by the following formula (1):

(in the formula, n denotes an average polymerization degree and is a positive number of 0-5) as a resin component, a curing agent, a curing accelerator and an inorganic filler is excellent in screen printability as a liquid crystal sealant in making a liquid crystal display device and can provide excellent reliability in moisture resistance for the liquid crystal display device obtained).

54. 发明授权

EP1116774B1 Flame-retardant resin composition, and prepregs and laminates using such composition 有权
标题翻译：一种阻燃树脂组合物和由其制备的预浸料和层压
公开(公告)号：EP1116774B1
公开(公告)日：2005-07-20
申请号：EP00118672.5
申请日：2000-08-29
申请人： SUMITOMO BAKELITE COMPANY LIMITED
发明人： Tobisawa, Akihiko
IPC分类号： C09K21/14
CPC分类号： B32B5/26 , B32B5/024 , B32B27/04 , B32B2262/101 , B32B2307/3065 , B32B2457/08 , C08G59/245 , C08G59/3218 , C08G59/623 , C08K5/5397 , C09K21/14 , H05K1/0373 , H05K2201/012 , Y10T428/31522 , Y10T428/31525 , C08L63/00

55. 发明授权

EP0944098B1 Thermally conductive electrical insulating composition 有权
标题翻译：导热，非导电的组合物
公开(公告)号：EP0944098B1
公开(公告)日：2005-06-01
申请号：EP99103953.8
申请日：1999-03-09
申请人： Hitachi, Ltd.
发明人： Akatsuka, Masaki , Takezawa, Yoshitaka , Ito, Yuzo
IPC分类号： H01B3/30 , C09K19/38 , C08L101/00 , C08L63/00 , C08L79/08
CPC分类号： H05K1/0313 , C08G59/245 , C08L79/00 , C08L79/02 , C08L101/12 , H01B3/40 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/00

56. 发明公开

EP1411101A1 Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin 有权
标题翻译： Epoxidharzzusammensetzung，Verfahren zur Herstellung desselben sowie neuartige Harze
公开(公告)号：EP1411101A1
公开(公告)日：2004-04-21
申请号：EP03023246.6
申请日：2003-10-14
申请人： DAINIPPON INK AND CHEMICALS, INC.
发明人： OGURA, Ichiro , Nakamura, Nobuya , Imada, Tomoyuki
IPC分类号： C09J163/00 , C09J167/03 , C09J167/00 , C09J167/02 , C08G59/12 , C09D163/00 , C08J3/03 , C08G59/06 , C08L71/02 , C08G65/26 , C08G8/00 , C08L61/04 , C08L61/28
CPC分类号： C08G59/182 , C08G59/066 , C08G59/1455 , C08G59/245 , C08G59/32 , C08G59/502
摘要： In the technical field where a difunctional epoxy resin having increased molecular weight is used to impart flexibility or improving dielectric properties, the present invention has remarkably improved moisture resistance and water resistance when used to produce a cured epoxy resin article. The epoxy resin composition comprises a difunctional epoxy resin (A) having a structure wherein an aromatic hydrocarbon group (a1) having a bonding site in an aromatic nucleus and a hydrocarbon group (a2) having an ether bond or the other hydrocarbon group (a3) are bonded via an acetal bond (a4), and also has a structure wherein a glycidyloxy group is bonded to the aromatic hydrocarbon group (a1); and a curing agent (B) as essential component.
摘要翻译：环氧树脂组合物包含双官能环氧树脂（A）和固化剂（B）。（A）具有通过缩醛键（a4）与芳香族核具有键合位置的芳香族烃基（a1）和具有醚键的烃基（a2）或其他烃基（a3）结合的结构），并且还具有缩合物氧基与（a1）结合的结构。包括以下独立权利要求：（1）生产环氧树脂，其包括使二官能酚化合物（b1）与具有醚键或二乙烯基醚（b3）的烃化合物的二乙烯基醚（b2）反应其他烃类化合物; 并使所得酚化合物与表卤代醇反应; 和（2）式（I）至（IV）的新的环氧和酚醛树脂化合物：[图像] [图像] [图像] [图像] R 1和R 2H或甲基R 3 -R 6，甲基，氯或溴X ：乙烯氧基乙基，二（乙烯氧基）乙基，三（乙烯氧基）乙基，丙烯氧丙基，二（丙烯氧基）丙基，三（丙烯氧基）丙基或具有环烷烃骨架的2-15C亚烷基X'：6-17C脂族烃基Y：-OH或缩水甘油基n：天然数，平均为1.2〜5。

57. 发明授权

EP0698591B1 Alkylierte und aralkylierte Polyhydroxyaromaten und ein Verfahren zu ihrer Herstellung 失效
标题翻译：烷基化和芳烷基化多羟基芳族化合物和它们的制备方法
公开(公告)号：EP0698591B1
公开(公告)日：2002-09-25
申请号：EP95109603.1
申请日：1995-06-21
申请人： Solutia Germany GmbH & Co. KG
发明人： Neumann, Uwe, Dr.
IPC分类号： C07C37/14 , C08G59/24 , C08G59/32
CPC分类号： C09D11/10 , C07C37/14 , C08F283/10 , C08F290/064 , C08F290/144 , C08G18/0814 , C08G18/581 , C08G18/672 , C08G18/8029 , C08G59/066 , C08G59/245 , C08G59/50 , C08G59/56 , C08L51/08 , C08L63/00 , C08G18/64 , C08L2666/22 , C07C39/16

58. 发明公开

EP0944098A3 Thermally conductive electrical insulating composition 有权
标题翻译：导热电绝缘
公开(公告)号：EP0944098A3
公开(公告)日：2001-04-11
申请号：EP99103953.8
申请日：1999-03-09
申请人： Hitachi, Ltd.
发明人： Akatsuka, Masaki , Takezawa, Yoshitaka , Ito, Yuzo
IPC分类号： H01B3/30 , C09K19/38 , C08L101/00 , C08L63/00 , C08L79/08
CPC分类号： H05K1/0313 , C08G59/245 , C08L79/00 , C08L79/02 , C08L101/12 , H01B3/40 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/00
摘要： An insulating material of high electrically insulating properties and high thermal conductivity is provided wherein the high thermal conductivity is attained by having a liquid crystal resin comprising a polymerization product of a resin composition containing a monomer which has a mesogen group. As examples epoxy resins and polyimides are presented.

60. 发明授权

EP0620238B1 Epoxy resin composition 失效
标题翻译： Epoxydharzzusammensetzung
公开(公告)号：EP0620238B1
公开(公告)日：1999-03-03
申请号：EP94105563.4
申请日：1994-04-11
申请人： TOTOKASEI Co., Ltd.
发明人： Asakage, Hideyasu , Aritomi, Michio, No. 5 Inage Haitsu 504 , Li Wu, Xiao
IPC分类号： C08G59/24 , C08G59/38
CPC分类号： C07D303/24 , C08G59/245 , C08G59/38

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