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51. 发明公开

EP0322083A2 Polishing device 失效
标题翻译： Poliereinrichtung。
公开(公告)号：EP0322083A2
公开(公告)日：1989-06-28
申请号：EP88304593.2
申请日：1988-05-20
申请人： SINTOBRATOR, LTD.
发明人： Ishida, Takao 176, Aza-Nakairi , Hagiwara, Hiroshi 287, Aza-bo , Kakumu, Ichizo 13-9, Aibaramachi
IPC分类号： B24B7/16 , B24B53/02
CPC分类号： B24B7/16 , B24B53/02
摘要： On a frame (1) a rotary grindstone (3) is rotatably provided in such a manner that the upper surface of the rotary grindstone serves as a grinding side and a workpiece holding device (7) which holds a workpiece and abuts the workpiece against the grinding side of the rotary grindstone is provided. Furthermore, a truing/dressing device (9) is provided on the frame, the truing/dressing device bringing a rotary grindstone (9a) for truing/dressing into contact with the grinding side of the rotary grindstone for the purpose of conducting truing/dressing of the grinding side of the rotary grindstone while retaining grinding conducted by means of the rotary grindstone.
摘要翻译：在框架（1）上，旋转砂轮（3）可旋转地设置成使得旋转砂轮的上表面用作研磨侧，并且工件保持装置（7）保持工件并抵靠工件提供旋转磨石的研磨面。此外，在框架上设置修整/修整装置（9），该修整/修整装置将用于修整/修整的旋转磨石（9a）与旋转磨石的研磨侧接触以进行修整/修整的磨削面，同时保持通过旋转磨石进行磨削。

52. 发明公开

EP0284343A3 Polishing apparatus 失效
标题翻译：反平面抛光装置反平面抛光装置
公开(公告)号：EP0284343A3
公开(公告)日：1989-01-18
申请号：EP88302496.0
申请日：1988-03-22
申请人： WESTECH SYSTEMS, INC.
发明人： Gill, Gerald L, Jr.
IPC分类号： B24B37/04 , H01L21/302 , H01L21/00 , B24B7/04 , B24B7/16
CPC分类号： B24B37/30 , B24B7/16
摘要： The polishing apparatus includes a polishing head (19) which holds a semiconductor wafer (10) against a polishing surface (11). The apparatus permits the accurate application in small increments of pressure to the semiconductor wafer by means of an inflatable resilient member (46) and provides a polishing head which "floats" and quickly reacts to and compensates for minor variations in the contour of the polishing surface contacting the semiconductor wafer.

53. 发明公开

EP0272531A1 Surface grinding machine 失效
标题翻译：平面磨床
公开(公告)号：EP0272531A1
公开(公告)日：1988-06-29
申请号：EP87118077.4
申请日：1987-12-07
申请人： SUMITOMO ELECTRIC INDUSTRIES LIMITED , ASAHI DIAMOND INDUSTRIAL CO. LTD. , Nissei Industry Corp.
发明人： Nishiguchi, Masanori Yokohama Works , Sekiguchi, Takeshi Yokohama Works , Miyoshi, Ikkeie Asahi Diamond Ind. Co. Ltd. , Nishio, Kiyoshi
IPC分类号： B24B7/16 , B24B49/16
CPC分类号： B24B7/16 , B24B49/16
摘要： A surface grinding machine comprises a wheel head (5) vertically movable supported; a cup-shaped diamond wheel (6) supported by a rotatable wheel shaft (7) at one end of the wheel head and having a abrasive grain layer (13) of Young's modulus (10 - 15) × 10⁴ kgf/cm² at the lower end of the wheel; a wheel shaft driving motor (8) for rotating the cup-shaped diamond wheel supported by the wheel head; a servomotor (10) for vertically moving the wheel head; a suitable number of chuck tables (2) for fixing the surface of a III-V group compound semiconductor wafer (1) on which elements have been fabricated; an index table (3) for rotatably supporting the chuck tables; a chuck table driving motor (4) for turning the chuck tables; a main shaft motor current analysis circuit (30) for detecting the current value of the wheel shaft driving motor; a main shaft rotation number analysis circuit (40) for detecting the number of rotations of the wheel shaft driving motor, and a feed speed control circuit (50) for controlling the servomotor in such a manner as to decrease the feed speed when the grinding resistance is greater than a predetermined resistance value, and increase the feed speed when the grinding resistance is smaller than the predetermined resistance value.
摘要翻译：平面磨床包括可垂直移动支撑的砂轮头（5）一个杯形金刚石砂轮（6），它由砂轮头一端的可转动的砂轮轴（7）支承着，并在下部具有杨氏模量（10-15）×10 4 kgf / cm 2的磨粒层（13）轮子的末端; 轮轴驱动电机（8），用于旋转由轮头支撑的杯形金刚石轮; 一个用于垂直移动砂轮头的伺服马达（10）适合数目的卡盘台（2），用于固定其上已制造有元件的III-V族化合物半导体晶片（1）的表面; 一个用于可转动地支承卡盘台的转位台（3）卡盘台驱动电机（4），用于转动卡盘台; 主轴电机电流分析电路（30），用于检测轮轴驱动电机的电流值; 用于检测轮轴驱动电动机的转数的主轴转数分析电路（40）和用于控制伺服电动机的进给速度控制电路（50），以便当磨削阻力大于预定的电阻值，并且当磨削阻力小于预定的电阻值时增加进给速度。

54. 发明公开

EP0150074A3 Method and apparatus for grinding the surface of a semiconductor wafer 有权
标题翻译：用于研磨半导体表面的方法和装置
公开(公告)号：EP0150074A3
公开(公告)日：1987-05-13
申请号：EP85100672
申请日：1985-01-23
申请人： DISCO ABRASIVE SYSTEMS, LTD.
发明人： Mori, Toshiyuki
IPC分类号： B24B27/00 , B24B07/16 , B24B07/22
CPC分类号： B24B41/061 , B24B7/16
摘要： A method and an apparatus for grinding the surface of a semiconductor wafer by moving a holding table (12) and a grinding wheel 4 A; 4 B; 4 C) relative to each other in a predetermined direction substantially parallel to the surface of the semiconductor wafer (W) held onto the holding table (12) to cause the grinding wheel (4 A; 4 B; 4 C) which is rotated to act on the surface of the semiconductor wafer (W) held onto the holding table (12). The semiconductor wafer (W) is placed on the holding table with its angular position being regulated so as to direct its crystal orientation in a predetermined direction with respect to the holding table (12), and thus the grinding direction of the surface of the semiconductor wafer (W) by the grinding wheel (4 A; 4 B; 4C) is set in a predetermined relationship to the crystal orientation of the semiconductor wafer. At the periphery of the semiconductor wafer (W) is formed a deformed portion (52, 54) arranged at a predetermined angular position with respect to its crystal orientation, and the holding table has a vacuum suction area made of a porous material and shaped substantially correspondingly to the shape of the semiconductor wafer.

55. 发明授权

EP0057859B1 Vorrichtung zum Bearbeiten der Oberfläche magnetischer Aufzeichnungsträger 失效
标题翻译：用于工作磁记录载体表面的装置
公开(公告)号：EP0057859B1
公开(公告)日：1986-05-28
申请号：EP82100574.1
申请日：1982-01-28
申请人： BASF Aktiengesellschaft
发明人： Gehrung, Manfred , Schoettle, Klaus , Kreissler, Helmut , Rudolf, Peter , Hack, Joachim , Anslinger, Friedrich
IPC分类号： B24B21/04 , G11B5/84
CPC分类号： B24B7/13 , B24B7/16 , B24B21/04

56. 发明公开

EP0106057A2 Flachschleifmaschine für Stanzwerkzeuge 失效
标题翻译：平面磨床用于冲压工具。
公开(公告)号：EP0106057A2
公开(公告)日：1984-04-25
申请号：EP83107946.2
申请日：1983-08-11
申请人： Trumpf GmbH & Co
发明人： Klingel, Hans, Dipl.-Ing. (FH) , Brekle, Erich
IPC分类号： B24B19/20 , B24B7/16 , B24B7/04
CPC分类号： B24B19/20 , B24B7/16
摘要： Um eine Flachschleifmaschine für die Bearbeitung von Stanzwerkzeugen, insbesondere Stempel und Matrizen, geeignet zu machen, ist die Werkstückspannvorrichtung drehbar gelagert, wobei ihre Achse parallel im Abstand zur Antriebsachse der Schleifscheibe liegt.
Um eine weitgehend automatische Bearbeitung des Werkstückes zu erreichen, ist eine Steuervorrichtung für die Zustellung der Schleifscheibe vorgesehen, die mit einem Abtastglied für die zu schleifende Fläche des Werkstückes verbunden ist.
摘要翻译：为了使表面研磨机的冲压工具，特别是冲头和冲模，geleignet加工，工件的夹紧装置被可旋转地在该磨轮的驱动轴线的距离搭载有其平行轴线。为了达到所述工件的大部分自动加工，提供一种用于研磨盘的进给控制装置，其是连接到示踪剂构件表面要在工件的地面。

57. 发明公开

EP0082619A1 Tool for grinding brake discs or drums 失效
标题翻译： Werkzeug zum Schleifen von Bremsscheiben oder Bremstrommeln。
公开(公告)号：EP0082619A1
公开(公告)日：1983-06-29
申请号：EP82306399.5
申请日：1982-12-01
申请人： JFK ENGINEERING FIFE LIMITED
发明人： Kenny, John Fulton
IPC分类号： B24B7/16
CPC分类号： B24B23/08 , B24B5/065 , B24B7/16
摘要： his invention relates to a disc or drum grinding apparatus 4 for use in in situ grinding of a brake disc 1 or drum on a wheel hub 2 on a vehicle 3. The apparatus 4 is securely mountable on the hub 2 so as to be supported substantially wholly by the hub and connected substantially rigidly thereto. A first drive transmission means 9,10,12,13 is drivingly engaged with at least one of said disc 1 or drum and hub 2 for rotating said disc 1 or drum about the hub axis, the apparatus 4 being provided with a stop means 15 for engagement with a fixed body 17 so as to prevent rotation of the apparatus 4 with the disc 1 or drum. A second drive transmission means 23,24 is arranged for driving a grinding wheel 25 disposable in contact with the brake disc 1 or drum for grinding a braking surface 29,30 thereof. At least one motor 8,22 is provided for driving said first and second drive transmission means
The invention also provides a method of grinding a brake disc 1 or drum comprising the steps of removing a wheel from the hub 2, attaching a grinding apparatus 4 of the invention to the hub 2 so as to support the apparatus 4 wholly on the hub 2 in rigid connection therewith, operating the first drive transmission means 9,10,12,13 to rotate the hub 2 and disc 1 or drum, operating the second drive transmission means 23, 24 and bring the gnnding means 25 into engagement with the disc 1.
摘要翻译：本发明涉及一种用于在车辆3上的轮毂2上的制动盘1或滚筒的现场磨削中使用的盘或滚筒研磨装置4.装置4可牢固地安装在轮毂2上，以便基本上被支撑完全由毂2并且基本上刚性地连接到其上。第一驱动传动装置9,10,12,13驱动地与所述盘1或滚筒和轮毂2中的至少一个驱动接合，用于围绕轮毂轴线旋转所述盘1或滚筒，所述装置4设置有止动装置15 用于与固定体17接合，以防止装置4与盘1或滚筒的旋转。第二驱动传动装置23,24布置成用于驱动与制动盘1或滚筒接触的砂轮25，用于研磨其制动表面29,30。提供至少一个电动机8,22用于驱动所述第一和第二驱动传动装置本发明还提供了一种研磨制动盘1或滚筒的方法，该方法包括以下步骤：从轮毂2移除车轮，将磨轮装置4 本发明提供到轮毂2，以将设备4完全支撑在与其刚性连接的轮毂2上，操作第一驱动传动装置9,10,12,13以使轮毂2和盘1或滚筒旋转，操作第二驱动传动装置23,24，并使研磨装置25与盘1接合。

58. 发明公开

EP0039209A1 Machine for grinding thin plates such as semiconductor wafers 失效
标题翻译：研磨机为薄板，例如半导体板块。
公开(公告)号：EP0039209A1
公开(公告)日：1981-11-04
申请号：EP81301795.1
申请日：1981-04-23
申请人： FUJITSU LIMITED , DISCO ABRASIVE SYSTEMS, LTD.
发明人： Tabuchi, Shuji
IPC分类号： B24B7/16
CPC分类号： B24B27/0023 , B24B7/16
摘要： A grinding machine for surface grinding thin plate-like workpieces, particularly semiconductor wafers (13) comprises a rotating table (11) provided with at least a workpiece holder (12) on which a workpiece (13) to be ground is supported and a plurality of grinding wheels (14) having different degrees of coarseness ranging from coarse to fine. The wheels (14) are arranged around and above the table (11) so that, as the table (11) rotates, the surface of the workpiece (13) is ground successively by the grinding wheels (14) with the coarsest grinding wheel (14-1) grinding the surface initially, followed by the finer wheel (14-2) and finishing with the finest wheel (14-3). This enables the required quantity of material to be removed from the surface of the workpiece (13) whilst, at the same time enables the final surface of the workpiece (13) to be finished to a high degree of accuracy during a single rotation of the table (11).

59. 发明公开

EP2688702A4 GRINDING TOOL FOR FLANGES 审中-公开
标题翻译：研磨工具法兰
公开(公告)号：EP2688702A4
公开(公告)日：2015-06-03
申请号：EP12760344
申请日：2012-03-21
申请人： SAFETY TOOLS ALLMET AS
发明人： OLSEN REIDAR OTTO
IPC分类号： B23B3/26 , B23C3/00 , B23D67/06 , B24B5/00 , B24B7/16
CPC分类号： B24B7/16 , B23B2215/72 , B23C3/007 , B23C2210/326 , B23D67/06

60. 发明公开

EP2688702A1 GRINDING TOOL FOR FLANGES 审中-公开
标题翻译：研磨工具法兰
公开(公告)号：EP2688702A1
公开(公告)日：2014-01-29
申请号：EP12760344.7
申请日：2012-03-21
申请人： Safety Tools Allmet AS
发明人： OLSEN, Reidar, Otto
IPC分类号： B23B3/26 , B23D67/06 , B24B5/00
CPC分类号： B24B7/16 , B23B2215/72 , B23C3/007 , B23C2210/326 , B23D67/06
摘要： A grinding tool for flanges (12) in a pipe coupling is described, comprising, at least, one first stationary part (14, 24) fastened to the flange, and also a second rotatory part (16) equipped with a grinding tool (20) for grinding the free surface of the flange (12). The grinding tool is shaped as a rotating file (20), and the rotating file (20) lies level with the free surface of the flange (12) and is placed in a holding and adjusting arm (18) that extends diagonally across the flange (12).

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