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    • 41. 发明公开
    • Chip resistor
    • 芯片Widerstand
    • EP0795878A2
    • 1997-09-17
    • EP97104176.9
    • 1997-03-12
    • Kamaya Electric Co., Ltd.
    • Tohyama, Hideshi
    • H01C1/14H01C17/22
    • H01C17/22H01C1/14H05K3/3442H05K2201/09045H05K2201/09954H05K2201/10568H05K2201/10636Y02P70/611Y02P70/613
    • A chip resistor (10, 20, 30, 40, 50) is disclosed including an insulated substrate (11, 21, 31, 41, 51) having two opposed faces and two opposed ends, a resistor portion (12, 22, 32, 42, 52) formed on one of the two faces of the insulated substrate, a pair of electrode portions (13, 23, 33, 43, 53) each formed on one of the two opposed ends and both of the two faces of the insulated substrate, and coupled to opposite ends of the resistor portion, the chip resistor being adapted for mounting on a printed circuit board including a pair of lands and a protective coating therebetween with a raised portion, wherein each of the pair of electrode portions projects on both of the two faces of the insulated substrate so that the difference in height between the electrode portion and the other portions is larger than the difference in height between the land and the raised portion of the protective coating on both of the two faces.
    • 公开了一种片状电阻器(10,20,30,40,50),其包括具有两个相对面和两个相对端的绝缘衬底(11,21,31,41,51),电阻器部分(12,22,32, 42,252),形成在绝缘基板的两个面之一上的一对电极部分(13,23,33,43,53),每对电极部分分别形成在两个相对端中的一个上, 衬底,并且耦合到电阻器部分的相对端,芯片电阻器适于安装在包括一对焊盘的印刷电路板和其间具有凸起部分的保护涂层,其中该对电极部分中的每一个在两者上突出 使得电极部分和其它部分之间的高度差大于两个面上的保护涂层的焊盘和凸起部分之间的高度差。
    • 42. 发明公开
    • An electrically adjustable resistor structure
    • Elektrisch verstellbare Widerstandstruktur
    • EP0780851A1
    • 1997-06-25
    • EP95480179.1
    • 1995-12-20
    • INTERNATIONAL BUSINESS MACHINES CORPORATION
    • Petit, Dominique A.
    • H01C17/22
    • H01C13/02H01C17/22Y10T29/49099
    • The present invention relates to a resistor structure the resistance value of which can be electrically adjusted after fabrication by the tester during the test operation so that its equivalent resistance closely approximates the desired nominal value. In essence, the novel resistor structure consists of a main resistor (R1) and a determined number of trimming resistors (R1-1 to R1-4) that are connected in parallel thereon. Each trimming resistor can be connected in parallel on the main resistor independently of one another thanks to a switch (PG1-1w to PG1-4), typically a pass-gate NFET device, that is serially connected therewith. This switch is enabled or not via a control line (16-1 to 16-4). Each control line is connected to a binary storage cell (17-1 to 17-4) which includes a fuse (F1 to F4) that can be electrically blown by the tester. Because, the resistance value of the main resistor (and trimming resistors as well) changes as a result of the fabrication process variations, these trimming resis tors are designed so that whatever the main resistor value, there is an appropriate combination of trimming resistors to reach the said desired nominal value. This resistor structure is perfectly adapted to the fabrication of semiconductor integrated circuits terminator chips.
    • 本发明涉及一种电阻器结构,其电阻值可以在测试操作期间由测试仪制造后进行电调节,以使其等效电阻接近期望的标称值。 本质上,新型电阻器结构由主电阻器(R1)和确定数量的并联连接的微调电阻器(R1-1至R1-4)组成。 由于与其串联连接的通常是栅极NFET器件的开关(PG1-1w至PG1-4),每个微调电阻器可以彼此并联连接在主电阻上。 该开关通过控制线(16-1至16-4)使能。 每个控制线连接到二进制存储单元(17-1至17-4),该二进制存储单元包括可被测试仪电气熔断的保险丝(F1至F4)。 因为,由于制造工艺的变化,主电阻(和微调电阻)的电阻值也会发生变化,所以这些微调电阻被设计成无论主电阻值如何,都有适当的微调电阻组合来达到 所述期望的标称值。 该电阻结构完全适用于制造半导体集成电路终端芯片。