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    • 45. 发明公开
    • Method for manufacturing a layered construction, and construction obtained thereby
    • ,以及通过该方法制造的分层结构的方法制造层压材料。
    • EP0274789A2
    • 1988-07-20
    • EP87202484.9
    • 1987-12-10
    • Koninklijke Nijverdal-Ten Cate N.V.
    • Van Dreumel, Wilhelmus Hendrikus MariaBruns, Frans Bernard
    • B32B3/12B32B31/12B29D24/00
    • B32B3/12B29D24/005B32B27/08B32B27/34B32B37/12B32B37/146B32B2305/024B32B2309/02B32B2309/04B32B2309/12
    • The invention relates to a method for manufacturing a layered construction, for example a laminate or sandwich panel, which construction comprises at least two parts adhered to each other with co-operating contact surfaces and containing thermoplastic material at least in the area of the contact surfaces, in accordance with which method the contact surfaces are pressed toward each other for a period of time while temperature is increased and the thus obtained construction is subsequently allowed to cool.
      The invention has for its object to now perform the said method such that an excellent adhesion is obtained between the co-operating contact surfaces without this being accompanied by degradation of the core material due to high temperatures.
      In order to achieve this aim the invention proposes a method of the type mentioned in the preamble which displays the feature that a quantity of solvent is applied to the contact surfaces of the parts such that some softening occurs locally and that an increase of temperature is caused to occur up to a temperature that is considerably lower than the softening temperature of the relevant thermoplastic material.
    • 本发明涉及一种用于至少在接触表面的面积的制造层状结构,例如层压材料或夹层板,其中构造包括至少两个部件粘合到海誓山盟与配合的接触面和包含热塑性材料 与哪一种方法雅舞蹈的接触表面压向彼此的一段时间,同时温度升高,并且将由此得到的结构随后被允许冷却。 本发明具有的目的是现在执行搜索所述方法做了出色的粘合力的共操作的接触表面之间获得没有这伴随着所述芯材料的降解因高温。 为了实现这个目的,本发明提出在显示所述特征也一定量的溶剂被施加到检查的部件的接触表面的前序部分中提到的类型的方法做了一些软化局部地发生和没有以增加温度引起 到发生达做了温度比有关的热塑性材料的软化温度显着降低。
    • 46. 发明公开
    • PROCESS FOR PRODUCING COPPER-CLAD LAMINATE
    • VERFAHREN ZUR HERSTELLUNG EINES MIT KUPFER PLATTIERTEN LAMINATS。
    • EP0258452A1
    • 1988-03-09
    • EP87901646.7
    • 1987-02-21
    • MEIKO ELECTRONICS CO., LTD.
    • WADA, Tatsuo 4-406, Towdate Bldg.YAMASHITA, Keizo 12-23, Ishida 2-chomeTOUYAMA, Tasuku 127-4, KitawakiYAMAMOTO, Teruaki 11-5, Oguro 2-chome
    • H05K3/02B32B31/12B32B15/08B32B35/00
    • B32B15/20B32B15/01B32B38/0012B32B38/10B32B2307/202B32B2307/206B32B2457/08H05K3/025H05K3/382H05K2203/0152H05K2203/0307H05K2203/0361H05K2203/0723H05K2203/0726
    • A process for producing a copper-clad laminate, which comprises a step (S2) offorming a copper foil of at least several µm on a planar conductive base material by electrolysis, a step (S3) of roughening the surface of the copper foil, a step (S4) of laminating the copper foil together with the conductive base material on an insulating base material and tightly integrating the assembly by applying pressure and heat, and a step (S5) of peeling off only the conductive base material. A highly pure metal film may exist between the conductive base material and the copperfoil. When the highly pure metal film has a thickness of 0.1 to 3 µm, only the conductive material is peeled off with the highly pure metel film being firmly adhered to the copper foil surface and, when the highly pure metal film has a thickness of 70 to 250 µm, it is peeled off together with the conductive base material after the lamina. tion. The copper foil formed by high-speed plating under the conditions of 2.6 to 20.0 m/sec in liquid-contacting speed and 0.15 to 4.0 A/cm 2 in current density has about the same flexibility as that of rolled and annealed copper. Thus extremely thin copper-clad laminates with a copper foil of 10 µm or less suited for flexible circuit boards can be produced in a short time using small equipment.
    • 这个新过程包括以下五个步骤。 (1)平面导电性基材的预处理,(2)通过在至少几微米厚的铜箔表面的平面导电性基材上进行电解而形成,(3)使该表面粗糙化,(4)将铜箔层叠在一起 导电基材在绝缘基材上,通过施加压力和热量紧密地集成组件,(5)剥离导电基材。 对于步骤(2)的电解,负极平面导电基材是分离的。 从正极平面铜箔延伸3-30mm的距离,铜箔的表面在2.6-20.0m / sec的液体接触速度下通过高速电镀形成。 并以0.15-4.0A / cm 2的电流密度进行。 可以看到液体接触速度。 通过流动电解液。 在两个电极之间或通过使负极围绕正极旋转。 在步骤(3)中,箔的表面可以与酸性电解溶液接触。 contg。 铜离子和硝酸根离子。 然后将表面进行铬处理。 可以在导电性基材与铜箔之间设置高纯度金属膜。 当高纯度金属膜的厚度为0.1-3.0微米时,步骤(5)中仅导电基材被剥离。 当高纯金属膜的厚度为70-250微米时,与导电基材一起剥离。