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41. 发明授权

EP0320965B1 Thin-film coating method and apparatus therefor 有权
标题翻译：薄膜涂布方法及其设备
公开(公告)号：EP0320965B1
公开(公告)日：1993-03-17
申请号：EP88121102.3
申请日：1988-12-16
申请人： SOMAR CORPORATION
发明人： Hamamura, Fumio
IPC分类号： B29C67/18 , B32B7/00
CPC分类号： B32B37/226 , B29C31/00 , B29C2791/006 , B29L2031/3425 , B32B37/0038 , B32B38/185 , H05K3/0079

42. 发明授权

EP0269910B1 Laminator 失效
标题翻译：复膜
公开(公告)号：EP0269910B1
公开(公告)日：1992-04-22
申请号：EP87116403.4
申请日：1987-11-06
申请人： SOMAR CORPORATION
发明人： Sumi, Sigeo , Hamamura, Fumio , Sawada, Noriyasu , Fukuda, Ichio
IPC分类号： B29C65/18 , B29C67/18
CPC分类号： B32B37/226 , B29C31/00 , B29C2791/006 , B29L2031/3425 , B32B38/185 , B32B38/1858 , H05K3/0079 , Y10T156/17 , Y10T156/1712

43. 发明公开

EP0401513A3 Thin film bonding method and apparatus having structure for removing wetting agents 失效
标题翻译：薄膜粘合方法及具有去除湿润剂的结构的装置
公开(公告)号：EP0401513A3
公开(公告)日：1991-11-21
申请号：EP90108470.7
申请日：1990-05-04
申请人： SOMAR CORPORATION
发明人： Sumi, Shigeo , Hamamura, Fumio
IPC分类号： B32B31/20 , B29C67/18 , G03F7/16 , B32B31/10
CPC分类号： B32B37/226 , B29L2031/3425 , B32B37/0038 , G03F7/161 , H05K3/0079 , Y10T156/1111 , Y10T156/1928
摘要： A thin film bonding method and apparatus having structure for removing wetting agents applied to a thin film and base plate that are to be bonded by pressure and heat. A spray or rollers (30) apply the wetting agent prior to the initial bonding of a leading edge of the thin film to a leading edge of the base plate. A pressure roller (15) applies heat and pressure to the film and base plate, bonding them together as the roller rotates and drives the plate toward a cleaning position. Suction and agent removal rollers (80) are used to remove the residual excess agent from the bonded film and the pressure roller. The removal rollers are joined together by a link mechanism that has a spring bias and is operation by a gear mechanism that provides a wiping action.

44. 发明授权

EP0222390B1 Apparatus for conveying base with crosswise base sliding device 失效
标题翻译：用于基础滑动装置输送基座的装置
公开(公告)号：EP0222390B1
公开(公告)日：1991-07-24
申请号：EP86115717.0
申请日：1986-11-12
申请人： SOMAR CORPORATION
发明人： Sumi, Shigeo , Hamamura, Fumio
IPC分类号： H05K3/00
CPC分类号： B65H5/062 , B65H2301/331 , H05K13/0061

45. 发明公开

EP0336358A3 Thin film laminating apparatus 失效
标题翻译：薄膜层压方法和装置
公开(公告)号：EP0336358A3
公开(公告)日：1991-07-03
申请号：EP89105866.1
申请日：1989-04-04
申请人： SOMAR CORPORATION
发明人： Hamamura, Fumio , Sumi, Shigeo
IPC分类号： B32B31/10 , B32B31/12 , B32B31/24 , B29C70/00
CPC分类号： B32B15/08 , B32B15/20 , B32B37/0038 , B32B37/226 , B32B38/1833 , B32B2457/08 , Y10T156/1084 , Y10T156/1705 , Y10T156/1734
摘要： An apparatus and method for laminating a thin film (18) to a base plate (11) is disclosed in which the leading edge of the film is tentatively stuck to the surface of the plate at the leading edge of the plate in a base plate conveyance passage. A pair of pressure sticking rollers (16) are put into contact with the leading edge of the film in a tentative sticking position and then rotated so that the plate is conveyed and the film is completely stuck to the plate. A wet roller unit (30) provided on the passage, upstream of the position, to cause an air bubble preventive agent to cling to the plate. The agent is nearly uniformly fed from the interior of the wet roller unit to the outside surface thereof. The agent remaining on the film stuck to the plate is removed from the film, downstream of the pressure sticking roller unit.

46. 发明公开

EP0390130A1 Method and apparatus for bonding continuous thin film to discrete base plates and film cutting apparatus therefor 失效
标题翻译： Verfahren und Vorrichtung zum VerbindendünnerFilme mit Grundplatten und Filmschneidevorrichtung。
公开(公告)号：EP0390130A1
公开(公告)日：1990-10-03
申请号：EP90105990.7
申请日：1990-03-29
申请人： SOMAR CORPORATION
发明人： Nagafuchi, Yasuhiro , Seki, Mitsuhiro , Sumi, Shigeo , Hamamura, Fumio
IPC分类号： B26D1/38
CPC分类号： B32B37/226 , B26D1/385 , B32B38/0004 , B32B38/185 , B32B2457/08 , H05K3/0079 , Y10T83/4711 , Y10T156/1339 , Y10T156/1343 , Y10T156/1734
摘要： A method and apparatus for bonding thin film supplied from a continuous roll to at least one bonding surface along the entire length of a discrete printed surface base plate and efficiently cutting the film to a proper length which covers an entire planar surface of the board. Each board is conveyed to a film bonding position and the leading end of the continuous film is transported to the film bonding position that is held by suction. A compression bonding roller moves across the surface of the board and automatically feeds film and bonds the film to the board while leaving a portion of the film loose over the trailing end of the board. A cutter comprising a rotary blade and a fixed blade disposed across the direction of movement of the film and the board is mounted on a slide bed which is moveable towards and away from the film. The rotary blade is obliquely oriented in order to permit the cutting of the film when the blade is rotated in opposition to the fixed blade. The compression bonding roller then completes the bonding of the loose end of the film through the remaining portion of the board. This structure permits a wide film to be rapidly and positively cut and bonded to the board.
摘要翻译：一种用于将从连续辊提供的薄膜沿着离散印刷表面基板的整个长度粘合到至少一个接合表面并有效地将膜切割成覆盖板的整个平面的适当长度的方法和装置。每个板被输送到胶片粘合位置，并且连续膜的前端被传送到通过抽吸保持的胶片粘合位置。压接辊在板的表面上移动并自动进给胶片并将胶片粘合到纸板上，同时使膜的一部分松动在纸板的尾端上。包括旋转刀片和横跨薄膜和板的移动方向设置的固定刀片的切割器安装在能够朝向和远离薄膜移动的滑动床上。旋转刀片倾斜定向，以便当刀片相对于固定刀片旋转时允许切割胶片。然后，压接辊完成膜的松散端部通过板的剩余部分的结合。这种结构允许宽膜快速且正确地切割并粘合到板上。

47. 发明公开

EP0336358A2 Thin film laminating apparatus 失效
标题翻译： Verfahren und Vorrichtung zum Verbinden vondünnenFilmen。
公开(公告)号：EP0336358A2
公开(公告)日：1989-10-11
申请号：EP89105866.1
申请日：1989-04-04
申请人： SOMAR CORPORATION
发明人： Hamamura, Fumio , Sumi, Shigeo
IPC分类号： B32B31/10 , B32B31/12 , B32B31/24 , B29C70/00
CPC分类号： B32B15/08 , B32B15/20 , B32B37/0038 , B32B37/226 , B32B38/1833 , B32B2457/08 , Y10T156/1084 , Y10T156/1705 , Y10T156/1734
摘要： An apparatus and method for laminating a thin film (18) to a base plate (11) is disclosed in which the leading edge of the film is tentatively stuck to the surface of the plate at the leading edge of the plate in a base plate conveyance passage. A pair of pressure sticking rollers (16) are put into contact with the leading edge of the film in a tentative sticking position and then rotated so that the plate is conveyed and the film is completely stuck to the plate. A wet roller unit (30) provided on the passage, upstream of the position, to cause an air bubble preventive agent to cling to the plate. The agent is nearly uniformly fed from the interior of the wet roller unit to the outside surface thereof. The agent remaining on the film stuck to the plate is removed from the film, downstream of the pressure sticking roller unit.
摘要翻译：公开了一种用于将薄膜（18）层压到基板（11）上的装置和方法，其中在基板传送中，薄膜的前缘暂时粘附在板的前缘处的板的表面通道。一对压力粘贴辊（16）在暂时的粘贴位置与胶片的前缘接触，然后旋转，使得纸板被输送，并且胶片完全粘贴在纸板上。设置在该通道的上游位置的湿辊单元（30），以使气泡防止剂粘附在该板上。试剂几乎从湿辊单元的内部均匀地供给到其外表面。残留在粘贴在板上的膜上的试剂从压片粘合辊单元的下游被从膜上除去。

48. 发明公开

EP0269910A3 Laminator 失效
标题翻译：塑封机
公开(公告)号：EP0269910A3
公开(公告)日：1989-09-06
申请号：EP87116403.4
申请日：1987-11-06
申请人： SOMAR CORPORATION
发明人： Sumi, Sigeo , Hamamura, Fumio , Sawada, Noriyasu , Fukuda, Ichio
IPC分类号： B29C65/18 , B29C67/18
CPC分类号： B32B37/226 , B29C31/00 , B29C2791/006 , B29L2031/3425 , B32B38/185 , B32B38/1858 , H05K3/0079 , Y10T156/17 , Y10T156/1712
摘要： A laminator for bonding a film onto a substrate is disclosed which comprises a film supply plate for supplying the film along a supply path, a film temporary bonding body and a film temporary bonding edge member for temporarily bonding the film in pressing contact with the film. The film temporary bonding edge member is detachably provided on the film temporary bonding body. A first heat insulator is interposed between the film temporary bonding body ad the film temporary bonding edge member. The temporary bonding body is detachably provided at a leading end of the film supply path of the film supply plate. A second insulator is interposed between the film supply plate and the film temporary bonding body.
摘要翻译：公开了一种用于将膜粘合到衬底上的层压机，其包括用于沿供应路径供应膜的膜供应板，膜临时接合体和膜临时接合边缘构件，用于临时接合与膜压接的膜。膜临时粘结边缘构件可拆卸地设置在膜临时粘结体上。在薄膜临时粘合体和薄膜临时粘合边缘部件之间插入第一隔热材料。临时结合体可拆卸地设置在膜供应板的膜供应路径的前端。第二绝缘体介于膜供应板和膜临时结合体之间。

49. 发明公开

EP0326990A2 Thin-film coating apparatus 失效
标题翻译： Vorrichtung zum Beschichten mitDünnfilmen。
公开(公告)号：EP0326990A2
公开(公告)日：1989-08-09
申请号：EP89101544.8
申请日：1989-01-30
申请人： SOMAR CORPORATION
发明人： Hamamura, Fumio
IPC分类号： B29C67/18 , B32B7/00 , G03F7/16
CPC分类号： B32B37/226 , B05C1/0826 , B05C9/04 , B29C31/00 , B29C2791/006 , B29L2031/3425 , B32B37/0038 , Y10T156/1339 , Y10T156/1343 , Y10T156/1734
摘要： A thin-film coating apparatus for coating a surface of a substrate with a thin film wherein the creation of void spaces can be prevented on the contacting surfaces between the laminated film and the electrically conductive layer formed on a substrate. The apparatus includes wet rollers which are arranged along the substrate conveyance path prior to a tacking position where the thin-films are temporarily tacked to the substrate. The wet rollers deposit a void preventing agent on the substrate so as to provide a secure lamination. So as to insure that the agent will be supplied to the wet rollers, the apparatus includes supply pipes, flexible dams, means for suppying the agent to the supply pipes and a plurality of holes formed in the supply pipes.
摘要翻译：一种用薄膜涂覆基板表面的薄膜涂覆装置，其中可以在叠层膜和形成在基板上的导电层之间的接触表面上防止形成空隙。该设备包括湿辊，它们在薄膜临时固定到基底的固定位置之前沿着基底输送路径布置。湿辊在基板上沉积防空剂，以提供牢固的层压。为了确保将试剂供给到湿式辊，该装置包括供给管，柔性坝，用于将试剂置于供给管的装置和在供给管中形成的多个孔。

50. 发明公开

EP0283741A2 Thin film coating method 有权
标题翻译： Verfahren zum Beschichten mit einerdünnenFolie。
公开(公告)号：EP0283741A2
公开(公告)日：1988-09-28
申请号：EP88102642.1
申请日：1988-02-23
申请人： SOMAR CORPORATION
发明人： Hamamura, Fumio , Fukuda, Ichio
IPC分类号： B29C67/18
CPC分类号： B32B37/226 , B29L2031/3425 , B32B38/185 , B32B2457/08 , H05K3/0079 , Y10T156/1343
摘要： In a thin film coating method, tack members are brought close to a surface of a substrate to temporarily tack the forward end portion of a web of thin film to the forward end of the substrate. Compression-bonding rollers are then brought into a tacking position where the forward end portion of the thin film is tacked from a standby position where the compression-bonding rollers do not touch the tack members to make compression-bonding contact with the forward end portion of the tacked thin film after the tack members are moved away from the surface of the substrate. The compression-bonding rollers are then rotated at the tacking position for the double purpose of conveying the substrate and adhering the thin film to the substrate. In this process, the forward end of the substrate is detected to produce a detection signal at a detection position before the substrate is conveyed to the tacking position, the conveyance of the substrate is stopped after the forward end of the substrate has been conveyed from the detection position to the tacking position, and the tack members are brought close to the conveyance passage of the substrate while the forward end of the substrate is being conveyed from the detection position to the tacking position to thereby tack the forward end of the thin film to the surface of the substrate after the forward end of the substrate is stopped at the tacking position.
摘要翻译：在薄膜涂布方法中，使定位构件靠近基板的表面，以将薄膜幅材的前端部临时固定到基板的前端。然后将压接辊进入固定位置，其中薄膜的前端部分从备用位置固定，其中压紧辊不接触粘性构件，以与压粘合辊的前端部压缩接触粘结构件之后的粘合薄膜远离基板的表面移动。压接辊然后在固定位置旋转，用于输送基板并将薄膜粘附到基板上的双重目的。在该过程中，检测基板的前端，以便在将基板输送到固定位置之前的检测位置处产生检测信号，在基板的前端从检测位置到固定位置，并且粘性构件靠近基板的输送通道，同时基板的前端从检测位置传送到固定位置，从而将薄膜的前端固定到在基板的前端之后的基板的表面停止在固定位置。

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