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    • 33. 发明公开
    • PROCESS FOR CURING THERMOSET RESINS
    • 固化热固性树脂的工艺
    • EP2885348A2
    • 2015-06-24
    • EP13748316.0
    • 2013-08-14
    • Akzo Nobel Chemicals International B.V.
    • KOERS, Frederik Willem KarelTALMA, Auke Gerardus
    • C08K5/14C08K5/17C08K5/29C08F283/01C08L67/06
    • C08J3/247C08F283/01C08J2335/02C08K5/14C08K5/175C08K5/29C08L67/06
    • Process for curing a thermoset resin comprising the step of contacting said resin with (i) an imine of the structure C(R
      2 )(R
      3 )=N-R
      1 wherein R
      1 is selected from hydrogen, hydroxyl, linear or branched alkyl having 1-22 carbon atoms, cycloalkyl having 3-22carbon atoms,aryl having 6 to 15 carbon atoms, andaralkylhaving 7 to 22 carbon atoms, which alkyl, cycloalkyl, aryl, and aralkyl groups may be optionally substituted with one or more groups containing heteroatoms selected from S, O, P, and/or Si. R
      2 is selected from C(R
      6 )(R
      5 )-C(=O)-R
      4 ,-C(R
      6 )(R
      5 )-C(=S)-R
      4 , and -C(R
      6 )(R
      5 )-C(=N)-R
      4 , wherein R
      4 , R
      5 , and R
      6 are selected from hydrogen,linear or branched alkyl having 1-6 carbon atoms, cycloalkyl having 3-12 carbon atoms, aryl, aralkyl, alkoxy having 1-6 carbon atoms, and aryloxy. R
      3 is selected from linear or branched alkyl having 1-22carbon atoms, 1 cycloalkyl having 3-22carbon atoms,aryl having 6 to 15 carbon atoms, and aralkylhaving 7 to 22 carbon atoms, and (ii) methyl isopropyl ketoneperoxide.
    • 固化热固性树脂的方法包括使所述树脂与(i)结构C(R 2)(R 3)= NR 1的亚胺接触的步骤,其中R 1选自氢,羟基,具有1个碳原子的直链或支链烷基 具有3-22个碳原子的环烷基,具有6-15个碳原子的芳基和具有7-22个碳原子的芳烷基,其中烷基,环烷基,芳基和芳烷基可任选地被一个或多个含杂原子的基团取代,所述杂原子选自 S,O,P和/或Si。 R 2选自C(R 6)(R 5)-C(= O)-R 4,-C(R 6)(R 5)-C(= S)-R 4和-C(R 6 )(R 5)-C(= N)-R 4,其中R 4,R 5和R 6选自氢,具有1-6个碳原子的直链或支链烷基,具有3-12个碳原子的环烷基,芳基 ,芳烷基,具有1-6个碳原子的烷氧基和芳氧基。 R 3选自具有1-22个碳原子的直链或支链烷基,具有3-22个碳原子的环烷基,具有6-15个碳原子的芳基和具有7-22个碳原子的芳烷基,和(ii)甲基异丙基酮过氧化物。