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31. 发明公开

EP1044751A1 Solder collecting capsule and solder extracting desoldering tool using the same 审中-公开
标题翻译：使用同样的焊料收集胶囊和焊料提取去焊工具
公开(公告)号：EP1044751A1
公开(公告)日：2000-10-18
申请号：EP00107722.1
申请日：2000-04-11
申请人： Pace Incorporated
发明人： Lawrence, David W. , Le, Dung T. , Siegel, William Jordan , Gilbert, David Lee
IPC分类号： B23K1/018 , B23K3/02
CPC分类号： B23K3/029 , B23K1/018
摘要： A disposable solder receiving capsule (1) for a hand held vacuum solder extracting desoldering tool is formed of an outer tube (2) which is closed at one end by a porous filter (4) and has an opening at its opposite end, and a hollow solder collection chamber part (10), having a tubular member with an open end and which is closed with respect to the passage of solder therethrough at an opposite end, forming a solder receiving space within it. The solder collection chamber part (10) is concentrically positioned within the outer tube (2) with an air plenum (14) disposed between the closed end of the chamber part (10) and the filter (4) and with at least one air channel (12) extending the length of solder collection part for providing a path for gases entering the open end of the outer tube (2) to the plenum (14) and the filter (4) that is separated from the solder receiving space. For facilitating solder reclamation, the capsule can be formed entirely of materials which are shape-sustaining when exposed to a temperature of 400°F, are not reactive with either solder and flux, which will burn with little or no residue at a temperature less than 800°F. A desoldering tool for use with the capsule has a detachable, tubular capsule holding part that is open at each of its opposite ends for enabling a solder receiving capsule (1) received in it to be removed from one of the end of the holding tube by pushing another soldering capsule into the opposite end of the holding tube when the detachable holding part is detached from the body of the desoldering tool. In a most preferred embodiment, the tool is designed so that solder cannot be drawn into it if the capsule has not been inserted or has been inserted incorrectly.
摘要翻译：用于手持式真空钎焊脱焊工具的一次性焊料接收舱（1）由一端由多孔过滤器（4）封闭并在其相对端具有开口的外管（2）中空焊料收集室部分（10），其具有带开口端的管状部件，并且在相对端部相对于焊料的通道封闭，从而在其内形成焊料接收空间。所述焊料收集室部件（10）同心地定位在所述外管（2）内，并且在所述室部件（10）的所述封闭端和所述过滤器（4）之间设置有空气室（14）并且具有至少一个空气通道（12）延伸焊料收集部分的长度，用于为进入外部管（2）的开口端的气体提供通向集气室（14）的气体和与焊料接收空间分离的过滤器（4）的路径。为了促进回收焊料，胶囊可以完全由暴露在400°F温度下能够保持形状的材料构成，不会与焊料和助焊剂发生反应，在低于 800°F。与胶囊一起使用的拆焊工具具有可拆卸的管状胶囊保持部件，该胶囊保持部件在其相对端部的每一端处开口，以使得容纳在其中的焊料接收胶囊（1）能够从保持管的一端移除当可拆卸的保持部分从拆焊工具的主体上拆下时，将另一个焊接盒推入保持管的相对端。在一个最优选的实施例中，工具被设计成如果胶囊未被插入或未被错误插入，则焊料不能被吸入。

32. 发明授权

EP0696489B1 Portable electric desoldering tool 失效
标题翻译：便携式电动脱焊
公开(公告)号：EP0696489B1
公开(公告)日：1997-12-17
申请号：EP95305390.7
申请日：1995-08-01
申请人： Cooper Industries, Inc.
发明人： Jacks, David Carl
IPC分类号： B23K1/018
CPC分类号： B23K1/018

33. 发明授权

EP0501649B1 Method for cleaning electrical connectors 失效
标题翻译：一种用于清洁的电连接器的方法
公开(公告)号：EP0501649B1
公开(公告)日：1996-07-17
申请号：EP92301297.5
申请日：1992-02-18
申请人： AT&T Corp.
发明人： Englert, Paul Joseph , Nicholl, Hugh , Read, Peter Hartpence
IPC分类号： B23K1/018 , C11D7/50 , H05K3/26
CPC分类号： H05K3/26 , H01R43/002 , H05K2201/10189 , H05K2203/0783 , H05K2203/127

34. 发明公开

EP0696489A1 Portable electric desoldering tool 失效
标题翻译： Tragbares elektrischesEntlötwerkzeug
公开(公告)号：EP0696489A1
公开(公告)日：1996-02-14
申请号：EP95305390.7
申请日：1995-08-01
申请人： COOPER INDUSTRIES, INC.
发明人： Jacks, David Carl
IPC分类号： B23K1/018
CPC分类号： B23K1/018
摘要： A self contained desoldering gun (10) with a built in vacuum pump (40). Vacuum pump (40) is operated by a low voltage DC electric motor (50) which is connected electrically in series with heating tip (20). Heating tip (20) reduces the voltage in the circuit and reduces the size of the motor required to operated pump (40). A second heating element may be used when motor (50) is energized.
摘要翻译：具有内置真空泵（40）的自装拆焊枪（10）。真空泵（40）由与加热尖端（20）串联连接的低压直流电动机（50）操作。加热尖端（20）降低了电路中的电压并且减小了操作的泵（40）所需的电动机的尺寸。当电动机（50）通电时，可以使用第二加热元件。

35. 发明公开

EP0476912A3 Electronic device manipulating apparatus and method 失效
标题翻译：电子装置操作装置和方法
公开(公告)号：EP0476912A3
公开(公告)日：1992-09-09
申请号：EP91308269.9
申请日：1991-09-11
申请人： AT&T Corp.
发明人： Basavanhally, Nagesh R.
IPC分类号： B23K1/018
CPC分类号： H05K13/0486 , B23K1/018 , H01L24/75 , H01L24/81 , H01L2924/14 , H01L2924/00
摘要： A robotically controlled pick-up tool (11) is modified by connecting to it a load cell (26) that generates a signal indicative of stress on the pick-up tool. The pick-up tool is directed toward a chip (12) to be removed and movement is stopped when the load cell generates a first signal indicative of a first level of stress. In addition to stopping movement of the pick-up tool, the first signal actuates heating of the tool to a temperature sufficient to melt the solder (13) bonding the chip to the substrate (14). The melting of the solder bonds (13) results in a reduction of stress on the tool, which causes the load cell (26) to generate a second signal indicative of the second level of stress. The second signal actuates the vacuum of the pick-up tool to cause adhesion of the chip to the pick-up tool and also initiates movement of the pick-up tool so as remove the chip from the substrate.

36. 发明公开

EP0062692A3 Method for the removal of solder from drill holes of non furnished printed-circuit boards clad with solder 失效
标题翻译：从非金属印刷电路板的钻孔中去除焊锡的方法
公开(公告)号：EP0062692A3
公开(公告)日：1983-08-17
申请号：EP81104295
申请日：1981-06-04
申请人： SIEMENS-ALBIS AKTIENGESELLSCHAFT , SIEMENS AKTIENGESELLSCHAFT
发明人： BAJKA, IMRE , FURRER, ROBERT
IPC分类号： B23K1/018 , H05K3/00 , H05K3/34 , H05K13/00 , H05K13/04 , H05K3/22
CPC分类号： B23K1/018 , B23K2201/42 , H05K3/0088 , H05K3/3468 , H05K13/0061 , H05K2203/0271 , H05K2203/0292 , H05K2203/044 , H05K2203/0445 , H05K2203/045 , H05K2203/1509 , H05K2203/1518

37. 发明授权

EP3919218B1 MULTIBEAM LASER DEBONDING DEVICE 有权
公开(公告)号：EP3919218B1
公开(公告)日：2023-12-13
申请号：EP20749723.1
申请日：2020-02-03
发明人： CHOI, Jae Joon , KIM, Nam Seong , KIM, Byung Roc , YOO, Jong Jae , PARK, Boo Seong
IPC分类号： B23K1/00 , B23K1/005 , B23K1/018 , H01L23/00 , B23K101/42

38. 发明授权

EP3610974B1 AN APPARATUS FOR AUTOMATICALLY CLEARING RESIDUAL SOLDER PASTE WITH A GAS CHANNEL IN THE WORKING PLATFORM BEARING A SOLDER PASTE TUB 有权
公开(公告)号：EP3610974B1
公开(公告)日：2022-02-16
申请号：EP18734284.5
申请日：2018-04-13
发明人： YANG, Ning
IPC分类号： B23K1/00 , B23K1/018 , B23K3/06 , H05K3/34 , B05B15/50 , B23K101/42

39. 发明公开

EP3219816A4 DEVICE AND METHOD FOR RECOVERING TIN-LEAD SOLDER FROM SCRAP 审中-公开
公开(公告)号：EP3219816A4
公开(公告)日：2018-06-27
申请号：EP15858623
申请日：2015-11-11
申请人： VTULKIN DENIS ALEKSANDROVICH
发明人： VTULKIN DENIS ALEKSANDROVICH
IPC分类号： C22B25/06 , B23K1/018 , C22B7/00
CPC分类号： B23K1/018 , C22B7/001 , C22B7/004 , C22B7/005 , C22B7/006 , C22B25/06 , Y02P10/228 , Y02P10/234
摘要： The group of inventions relates to the processing of metal waste, and specifically to the recovery of tin-lead solder from electronic printed circuit board scrap. The technical result of the proposed technical solution is an increase in the productivity of the recovery of solder from scrap. The scrap is placed in a liquid-permeable and/or gas-permeable container, which is placed in a liquid or gaseous heat-transfer medium heated to or above the melting temperature of the tin-lead solder. After the tin-lead solder is melted, the heat-transfer medium is removed from the container, then, by means of rotation of the container, the melted tin-lead solder and the remains of the heat-transfer medium are removed from said container. The device comprises a hollow container, which is mounted in such a way as to be capable of rotation and is designed in the form of a body of revolution, and is liquid-permeable and/or gas-permeable in a radial direction from the axis of rotation. The container can be designed in the form of a drum, which can be vertically displaced and has perforated side walls.

40. 发明授权

EP2831306B1 METHOD FOR SEPARATING A METAL PART FROM A CERAMIC PART 有权转让
标题翻译：从陶瓷零件中分离金属零件的方法
公开(公告)号：EP2831306B1
公开(公告)日：2017-06-28
申请号：EP13711423.7
申请日：2013-03-22
申请人： Ansaldo Energia IP UK Limited
发明人： BECKEL, Daniel , STANKOWSKI, Alexander , DUVAL, Sophie Betty Claire
IPC分类号： C23F1/12 , C23F1/44 , B23P6/00 , B23K1/018 , B23K35/38 , C23G5/00 , B23K35/22
CPC分类号： F01D5/005 , B23K1/018 , B23K35/224 , B23K35/38 , B23K2201/001 , B23P6/005 , C23F1/12 , C23F1/44 , C23G5/00 , F01D5/286 , F05D2230/10 , F05D2230/23 , F05D2230/237 , F05D2230/70 , F05D2230/80 , F05D2300/6033

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