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21. 发明公开

EP2782177A4 COLLECTOR PLATE FOR FUEL CELLS AND METHOD FOR PRODUCING SAME 审中-公开
标题翻译：收集板用于生产燃料电池和方法
公开(公告)号：EP2782177A4
公开(公告)日：2015-09-23
申请号：EP12850407
申请日：2012-10-18
申请人： NIPPON LIGHT METAL CO
发明人： NISHIKAWA YOSUKE , HATAZAWA YOSHIYUKI , TAGUCHI YOSHIHIRO , NAKAGAWA TOSHIHIRO , OOTA ATSUSHI
IPC分类号： H01M8/02 , C23C18/16 , C23C18/36 , C23C18/44 , C23C18/54
CPC分类号： H01M8/0206 , C23C18/1651 , C23C18/36 , C23C18/44 , C23C18/54 , H01M8/0204 , H01M8/0208 , H01M8/0228 , Y02P70/56

22. 发明授权

EP2331727B1 METAL NANOWIRE THIN-FILMS 有权
标题翻译： DÜNNEMETALLNANODRAHTFILME
公开(公告)号：EP2331727B1
公开(公告)日：2013-11-27
申请号：EP09787552.0
申请日：2009-09-01
申请人： Ramot at Tel-Aviv University Ltd.
发明人： MARKOVICH, Gil , AZULAI, Daniel , KRICHEVSKI, Olga
IPC分类号： C23C18/14 , C23C18/16 , C23C18/34 , C23C18/40 , C23C18/44 , C23C18/48 , H05K3/18 , H05K3/10
CPC分类号： H05K1/09 , C23C18/14 , C23C18/166 , C23C18/1667 , C23C18/1676 , C23C18/34 , C23C18/40 , C23C18/44 , C23C18/48 , H01B1/02 , H01L29/786 , H05K1/0274 , H05K3/105 , H05K3/182 , H05K2201/0108 , H05K2201/0257 , H05K2201/026 , H05K2201/10121 , H05K2201/10128 , H05K2201/10166 , H05K2203/013 , H05K2203/1157 , H05K2203/125
摘要： A conductive nanowire film based on a high aspect-ratio metal is disclosed. The nanowire film is produced by inducing metal reduction in a concentrated surfactant solution containing metal precursor ions, a surfactant and a reducing agent. The metal nanostructures demonstrate utility in a great variety of applications.
摘要翻译：描述具有高纵横比金属的导电纳米线膜。通过在含有金属前体离子，表面活性剂和还原剂的浓缩表面活性剂溶液中诱导金属还原来制造纳米线膜。金属纳米结构在各种应用中表现出实用性。

23. 发明授权

EP2067879B1 Method for producing a PLATED MATERIAL HAVING a METAL THIN FILM FORMED BY ELECTROLESS PLATING 有权转让
标题翻译：一种通过化学镀形成金属薄膜的制造的包层材料的方法
公开(公告)号：EP2067879B1
公开(公告)日：2013-09-04
申请号：EP08791333.1
申请日：2008-07-18
申请人： Nippon Mining & Metals Co., Ltd.
发明人： YABE, Atsushi , ITO, Junichi , HISUMI, Yoshiyuki , SEKIGUCHI, Junnosuke , IMORI, Toru
IPC分类号： C23C18/18 , C23C14/34 , C23C18/32 , C23C18/44 , C23C28/02 , H01L21/288 , H01L21/3205 , H01L21/768 , H01L23/532
CPC分类号： H01L21/76843 , C23C14/165 , C23C14/584 , C23C18/1879 , C23C18/31 , C23C18/54 , H01L21/288 , H01L21/76873 , H01L21/76874 , H01L23/53238 , H01L2221/1089 , H01L2924/0002 , Y10T428/12493 , Y10T428/12507 , Y10T428/12514 , Y10T428/24917 , H01L2924/00

24. 发明公开

EP2026961A4 NON-METALLIC NANO/MICRO PARTICLES COATED WITH METAL, PROCESS AND APPLICATIONS THEREOF 审中-公开
标题翻译：涂布金属非金属纳米/微米颗粒，方法和用途
公开(公告)号：EP2026961A4
公开(公告)日：2013-07-24
申请号：EP07795072
申请日：2007-05-21
申请人： NANOMECH LLC
发明人： MALSHE VINOD CHINTAMANI , MALSHE AJAY PRABHAKAR
IPC分类号： B32B15/04 , C08K9/02 , C23C18/16 , C23C18/31 , C23C18/44
CPC分类号： C23C18/1658 , B22F1/025 , B22F2999/00 , C08K9/02 , C08K2201/011 , C23C18/1635 , C23C18/1639 , C23C18/1662 , C23C18/1676 , C23C18/31 , C23C18/34 , C23C18/40 , C23C18/44 , Y10T428/249921 , Y10T428/2991 , Y10T428/2993 , Y10T428/2998 , B22F9/24 , C08L23/04 , C08L23/10 , C08L25/04 , C08L27/06
摘要： The present invention provides a simple and economical process for preparation of metal-coated non-metallic nano/micro particles. The nano/micro particles are composed of a core and metallic coat over the core using silver or other transition/noble metals. The core of the non-metallic nano/micro particles are selected from inorganic material such as silica, calcium carbonate, barium sulfate, or emulsion grade polyvinyl chloride and other polymers prepared by emulsion process including porous polymers. The metal coating is selected from the transition/noble metals such as copper, nickel, silver, palladium, platinum, osmium, ruthenium, rhodium, and such other metals and their combinations that are easily reducible to elemental metal.

25. 发明授权

EP1930472B1 ELECTROLESS PALLADIUM PLATING BATH AND ELECTROLESS PALLADIUM PLATING METHOD 有权
标题翻译： BAD无电解钯和方法的沉积为钯的无电沉积
公开(公告)号：EP1930472B1
公开(公告)日：2013-07-17
申请号：EP06810440.5
申请日：2006-09-22
申请人： C. UYEMURA & CO, LTD
发明人： MURASUMI, Akihiko , KUROSAKA, Seigo , INAGAWA, Hiromu , ODA, Yukinori
IPC分类号： C23C18/54 , C23C18/16 , C23C18/44
CPC分类号： C23C18/44 , C23C18/1651 , C23C18/54 , H01L24/43 , H01L24/745 , H01L2224/45664

26. 发明授权

EP2261396B1 COMPOUND MATERIAL, METHOD OF PRODUCING THE SAME AND APPARATUS FOR PRODUCING THE SAME 有权
标题翻译：复合材料，工艺用于生产和生产设备将其
公开(公告)号：EP2261396B1
公开(公告)日：2013-05-29
申请号：EP09717775.2
申请日：2009-03-02
申请人： Japan Science and Technology Agency
发明人： YAE, Shinji , HIRANO, Tatsuya , MATSUDA, Hitoshi
IPC分类号： C23C18/31 , B82B1/00 , C23C18/16 , C23C18/44 , H01L21/28 , H01L21/288 , C23C18/18 , C23C18/54
CPC分类号： H01L21/288 , C23C18/1619 , C23C18/1644 , C23C18/1889 , C23C18/31 , C23C18/44 , C23C18/54 , Y10T428/249953 , Y10T428/249955 , Y10T428/249977 , Y10T428/249978 , Y10T428/249979 , Y10T428/249986 , Y10T428/249994

27. 发明公开

EP2581470A1 Electroless palladium plating bath composition 有权
标题翻译：无电镀钯电镀液组成
公开(公告)号：EP2581470A1
公开(公告)日：2013-04-17
申请号：EP11184919.6
申请日：2011-10-12
申请人： Atotech Deutschland GmbH
发明人： Hirsekorn, Isabel-Roda , Wegricht, Jens , Kilian, Dr. Arnd
IPC分类号： C23C18/44
CPC分类号： C23C18/44 , C23C18/1637
摘要： The present invention concerns an aqueous plating bath composition for electroless deposition of palladium and/or palladium alloys and a method which utilises such aqueous plating bath compositions. The aqueous plating bath comprises a source of palladium ions, a reducing agent, a nitrogenated complexing agent which is free of phosphorous and an organic stabilising agent comprising 1 to 5 phosphonate residues. The aqueous plating bath and the method are particularly useful if the aqueous plating bath comprises copper ions.
摘要翻译：本发明涉及用于无电沉积钯和/或钯合金的水性镀浴组合物以及使用这种水性镀浴组合物的方法。含水电镀液包含钯离子源，还原剂，不含磷的氮化络合剂和包含1至5个膦酸酯残基的有机稳定剂。如果含水电镀浴包含铜离子，则含水电镀浴和方法特别有用。

28. 发明公开

EP2561117A1 PROCEDE DE REVETEMENT D'UNE SURFACE D'UN SUBSTRAT EN MATERIAU NON METALLIQUE PAR UNE COUCHE METALLIQUE 有权转让
标题翻译：方法用于涂覆基材的表面由不含金属材料有金属层
公开(公告)号：EP2561117A1
公开(公告)日：2013-02-27
申请号：EP11723649.7
申请日：2011-04-19
申请人： Pegastech
发明人： ROUSSEL, Sébastien , GILBERT, Frida
IPC分类号： C23C18/22 , C23C18/30 , C23C18/40 , C23C18/44 , C23C18/54
CPC分类号： C23C18/1886 , C23C18/1639 , C23C18/1653 , C23C18/1658 , C23C18/1855 , C23C18/1896 , C23C18/2013 , C23C18/2073 , C23C18/22 , C23C18/38 , C23C18/40 , C23C28/023 , C25D5/56 , C25D9/02 , Y10T428/31678
摘要： The present invention relates to a process for coating a surface of a substrate made of nonmetallic material with a metal layer. According to this invention, the coating process consists of the following steps: a. a substrate made of nonmetallic material is provided, b. at least part of at least one surface of said substrate is subjected to a physical or chemical treatment for increasing the specific surface area thereof, c. that surface of said substrate which was treated in step b) is subjected to an oxidizing treatment, d. that surface of said substrate which was treated in step c) is brought into contact with a solution containing at least one ion of at least one metal and its counterion, said metal being chosen from the group formed by the metals of groups IB and VIII of the Periodic Table of the Elements, e. a substrate comprising ions of at least one metal that are chemically attached to the nonmetallic material constituting the substrate on at least part of at least one of its surfaces is obtained, f. said ions of at least one metal that are chemically attached to the nonmetallic material constituting the substrate on a surface of said substrate are subjected to a reducing treatment and a substrate comprising atoms of at least one metal that are chemically attached to the nonmetallic material constituting the substrate on at least part of at least one of its surfaces is obtained, g. the surface comprising particles of at least one metal which was obtained in step f) is brought into contact with a solution containing ions of at least one metal, h. a coating formed by a layer of at least one metal is obtained on the treated surface of said substrate, said steps optionally being followed or preceded by one or more rinsing steps. The invention also relates to a substrate made of nonmetallic material, at least one surface of which is coated with a metal activation layer formed by atoms of a metal that are bonded, through metal-ligand interaction, directly to the constituent material of the substrate by carboxyl (-COOH), hydroxyl (-OH), alkoxyl (-OR), carbonyl (-C=O), percarbonic (-CO-O-OH), nitro (N=O) or amide (-CONH) groups, said activation layer being covered with a layer of an identical or different metal deposited by electroless deposition.

29. 发明公开

EP2080822A4 DIRECT PLATING METHOD AND SOLUTION FOR PALLADIUM CONDUCTOR LAYER FORMATION 有权
标题翻译： VERFAHREN ZUR DIREKTEN METALLABSCHEIDUNG UNDLÖSUNGZUR BILDUNG EINER PALLADIUMLEITERSCHICHT
公开(公告)号：EP2080822A4
公开(公告)日：2012-02-22
申请号：EP06823030
申请日：2006-11-06
申请人： UYEMURA C & CO LTD
发明人： YAMAMOTO HISAMITSU
IPC分类号： C25D5/54 , C23C18/16 , C23C18/30 , C23C18/44 , C25D5/02 , C25D5/56 , H05K3/18 , H05K3/42
CPC分类号： C23C18/44 , C23C18/1653 , C23C18/2086 , C23C18/30 , C25D5/02 , C25D5/56 , H05K1/0346 , H05K3/181 , H05K3/422 , H05K3/427 , H05K2201/0344 , H05K2203/124

30. 发明公开

EP2304077A2 METHODS FOR MAKING ANTIMICROBIAL COATINGS 有权
标题翻译：用于生产抗菌涂料
公开(公告)号：EP2304077A2
公开(公告)日：2011-04-06
申请号：EP09773976.7
申请日：2009-05-27
申请人： Baxter International Inc. , Baxter Healthcare SA
发明人： KRONGAUZ, Vadim, V.
IPC分类号： C23C18/16 , C23C18/31 , C23C18/42 , A61L27/54 , A61L29/08 , A61L29/16 , C23C18/44
CPC分类号： C23C18/1689 , A61L29/085 , A61L29/14 , C23C18/1662 , C23C18/1676 , C23C18/31 , C23C18/44
摘要： Methods for forming antimicrobial coatings on substrate surfaces are disclosed. The methods involve providing a mixture comprising a metal salt, a biguanide compound, and a reducing agent, wherein the mixture is free of polymeric binders; and depositing the mixture onto a substrate surface, thereby forming a coated substrate surface.

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