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    • 22. 发明公开
    • COMPOSITE MEMBER
    • VERBUNDELEMENT
    • EP2332674A1
    • 2011-06-15
    • EP09817522.7
    • 2009-10-02
    • Sumitomo Electric Industries, Ltd.A.L.M.T. Corp.
    • IWAYAMA, IsaoNAKAI, YoshihiroNISHIKAWA, TaichiroTAKAKI, YoshiyukiKUSAKARI, MisatoIKEDA, Toshiya
    • B22D19/00C22C1/10C22C29/02C22C32/00
    • A composite member suitable for a heat radiation member of a semiconductor element and a method of manufacturing the same are provided. This composite member is a composite of magnesium or a magnesium alloy and SiC, and it has porosity lower than 3 %. This composite member can be manufactured by forming an oxide film on a surface of raw material SiC, arranging coated SiC having the oxide film formed in a cast, and infiltrating this coated SiC aggregate with a molten metal (magnesium or the magnesium alloy). The porosity of the composite member can be lowered by improving wettability between SiC and the molten metal by forming the oxide film. According to this manufacturing method, a composite member having excellent thermal characteristics such as a coefficient of thermal expansion not lower than 4 ppm/K and not higher than 10 ppm/K and thermal conductivity not lower than 180 W/m●K can be manufactured.
    • 提供了适用于半导体元件的散热构件的复合构件及其制造方法。 该复合材料是镁或镁合金与SiC的复合材料,孔隙度低于3%。 该复合部件可以通过在原料SiC的表面上形成氧化膜,配置在铸型中形成有氧化膜的被覆SiC,并用熔融金属(镁或镁合金)渗透该涂覆的SiC集合体来制造。 通过形成氧化膜,可以改善SiC与熔融金属之间的润湿性,可以降低复合构件的孔隙率。 根据该制造方法,具有不低于4ppm / K且不高于10ppm / K的热膨胀系数以及不低于180W / m-K的热导率的热特性优异的复合构件可以是 制造。