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    • 30. 发明公开
    • DEVICE FOR SOLDERING AN ELECTRICAL CONDUCTOR WITH A CONNECTION DEVICE
    • EP3633792A3
    • 2020-05-27
    • EP19201149.2
    • 2019-10-02
    • Tyco Electronics France SAS
    • BEDNAREK, AlainBOILLEAU, PascalFERRIEZ, DanielCOUFFEAU, AntoineALBRIEUX, Pacal
    • H01R4/18H01R43/02H01R43/048B23K11/00H01R43/042H01R43/058
    • The present invention relates to a device for soldering an electrical conductor with a connection device, comprising a base plate (23, 223) on which an anvil (19, 219) is mounted, the anvil (19, 219) making it possible to pass an electrical current (I) through the electrical conductor and/or the connection device (11, 211), such that the anvil (19, 219) is at least partially housed in a through-hole (25, 225) of the base plate (23, 223) and arranged to be electrically insulated from the base plate (23, 223). The present invention also relates to a device for soldering an electrical conductor with a connection device, comprising an anvil (119, 229) with an electrical contact area (115, 215)towards the top (117, 217) of the anvil (119, 219) on which the electrical conductor and the connection device (111, 211) are intended to be placed, the anvil (119, 219) being capable of making an electrical current (I) circulate through the electrical conductor and the connection device (111, 211); and a cutting unit (150, 250) capable of cutting a portion (151, 251) of the connection device (111, 211) towards the top (117, 217) of the anvil (119, 219); such that the anvil (119, 219) and the cutting unit (150, 250) are at least partially distanced from each other at least at the top (117, 217) of the anvil (119, 219) in order to electrically insulate them from each other. The present invention also relates to a device for soldering comprising an anvil (19, 119, 219) and/or a deformation unit (13, 113, 213, 313) at least partially covered with an electrically insulating coating by physical vapour deposition, in particular by a ceramic layer of 12 micrometers thickness.