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24. 发明公开

EP3634093A1 WIRING BOARD 审中-实审转让
公开(公告)号：EP3634093A1
公开(公告)日：2020-04-08
申请号：EP18806598.1
申请日：2018-05-11
申请人： NGK Spark Plug Co., Ltd.
发明人： HAYASHI, Takahiro , HANDO, Takuya
IPC分类号： H05K3/46
摘要： Provided are: a wiring board in which, even when a plurality of via conductors are arranged in parallel for each of a plurality of pads opposing each other with an insulating layer therebetween, a crack is not prone to occur in the insulating layer due to the arrangement of the plurality of via conductors; and a method for manufacturing the same. The wiring board 1 is provided with: a board body 2 which is made up of a plurality of insulating layers c1 to c5 and includes an upper surface 3 and a lower surface 4 opposing each other; a plurality of pads 5 to 7 formed on at least one of the upper surface 3, the lower surface 4, and an inner layer surface 9; and a plurality of via conductors 8 which are respectively connected to the plurality of pads 5 to 7 of the board body 2 and formed in parallel along the thickness of the board body 2. In the board body 2, the plurality of via conductors 8 are connected to a plurality of pads 5 to 7 adjacent to each other on the same surfaces 3, 4, 9 in plan view, wherein the arrangement of the plurality of via conductors 8 differs among the adjacent pads 5 to 7 on the same surfaces 3, 4, 9 in plan view.

25. 发明授权

EP2259395B1 SPARK PLUG 有权转让
公开(公告)号：EP2259395B1
公开(公告)日：2020-04-08
申请号：EP09725375.1
申请日：2009-03-26
申请人： NGK Spark Plug Co., Ltd.
发明人： KURONO, Hirokazu , HONDA, Toshitaka , TAKEUCHI, Hiroki , MITSUOKA, Takeshi , TANAKA, Kuniharu , TAKAOKA, Katsuya
IPC分类号： H01T13/38 , C04B35/111 , H01B1/12

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