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11. 发明公开

EP3404675A1 LEISTUNGSWIDERSTAND 审中-公开
公开(公告)号：EP3404675A1
公开(公告)日：2018-11-21
申请号：EP17171188.0
申请日：2017-05-15
申请人： EBG Elektronische Bauelemente GmbH
发明人： Lindner, Christian Rene , Praschk, Josef
IPC分类号： H01C1/144 , H05K1/16 , H05K3/40 , H01C7/00
CPC分类号： H01C1/144 , H01C1/012 , H01C1/084 , H01C3/12 , H01C7/003 , H05K1/165 , H05K3/4015 , H05K2201/09263 , H05K2201/10318
摘要： Es wird ein Leistungswiderstand (1) mit mindestens einem elektrischen Anschluss (2.1, 2.2, 2.3), mit einem Trägersubstrat (3), das mindestens ein Widerstandselement (4.1, 4.2) aus einem Dickschichtmaterial und mindestens eine Kontaktelektrode (5.1, 5.2, 5.3) aufweist, an die das Widerstandselement (4.1, 4.2) elektrisch anschließt, mit wenigstens einem elektrischen Leiter (7.1, 7.2, 7.3), der mit der Kontaktelektrode (5.1, 5.2, 5.3) verlötet ist und eine elektrische Verbindung zwischen der Kontaktelektrode (5.1, 5.2, 5.3) und dem elektrischen Anschluss (2.1, 2.2, 2.3) herstellt, und mit einem, zumindest teilweise mit mindestens einer Vergussmasse (17) gefüllten Gehäuse (8), das Widerstandselement (4.1, 4.2) und Kontaktelektrode (5.1, 5.2, 5.3) vergossen aufnimmt, wobei der elektrische Leiter (7.1, 7.2, 7.3) durch die Vergussmasse (17) ragt. Um einen konstruktiv einfachen und leicht handhabbaren Leistungswiderstand (1) zu schaffen, wird vorgeschlagen, dass ein Stift, insbesondere ein Löt- oder Einpressstift, den elektrischen Leiter (7.1, 7.2, 7.3) ausbildet, welcher Stift (9.1, 9.2, 9.3) auf die Kontaktelektrode (5.1, 5.2, 5.3) aufgesetzt und mit dieser verlötet ist sowie den elektrischen Anschluss (2.1, 2.2, 2.3) des Leistungswiderstands (1) ausbildet.

12. 发明授权

EP2732452B1 ELEKTRISCHE VORRICHTUNG 有权转让
公开(公告)号：EP2732452B1
公开(公告)日：2018-09-19
申请号：EP12740087.7
申请日：2012-07-04
申请人： Epcos AG
发明人： ORTNER, Markus , SCHOSSMANN, Michael , KOINI, Markus , ENGEL, Günter , HOFFMANN, Christian
IPC分类号： H01G4/30 , H01C1/148 , H01C7/00 , H01G2/06 , H01G4/232 , H01C1/01 , H01C7/02 , H01C7/04 , H01C7/10
CPC分类号： H01C1/148 , H01C1/01 , H01C7/008 , H01C7/02 , H01C7/04 , H01C7/10 , H01G2/06 , H01G4/232 , H01G4/248 , H01G4/30

13. 发明授权

EP2849190B1 Laminated chip electronic component, board for mounting the same, and packing unit thereof 有权
公开(公告)号：EP2849190B1
公开(公告)日：2018-07-25
申请号：EP14187377.8
申请日：2012-12-10
申请人： Samsung Electro-Mechanics Co., Ltd
发明人： Lee, Sun Cheol , Kim, Woo Sup , Kim, Dong Gun , Kim, Kyeong Jun , Lee, Kyu Ho
IPC分类号： H01G4/00 , H01G4/30 , H01G2/06 , H01G2/24 , H05K1/18 , H01L41/083 , H05K1/03 , H01C7/00 , H01C7/10
CPC分类号： H05K1/181 , H01C7/008 , H01C7/10 , H01G2/06 , H01G2/24 , H01G4/06 , H01G4/12 , H01G4/30 , H01L41/083 , H05K1/0306 , Y02P70/611
摘要： A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer.

14. 发明授权

EP2810033B1 LARGE AREA TEMPERATURE SENSOR 有权
公开(公告)号：EP2810033B1
公开(公告)日：2018-06-20
申请号：EP13743386.8
申请日：2013-01-30
申请人： PST Sensors (Pty) Limited
发明人： BRITTON, David Thomas , HARTING, Margit
IPC分类号： G01K7/24 , G01K3/00 , H01C1/148 , G01K3/06 , H01C1/16 , H01C13/02 , H01C7/00 , H01C7/02 , H01C7/04
CPC分类号： G01K7/24 , G01K1/14 , G01K3/06 , G01K2213/00 , H01C1/16 , H01C7/008 , H01C7/02 , H01C7/04 , H01C13/02
摘要： A sensing device is made up of a network of nominally identical temperature dependent resistors which is topologically equivalent to a square resistor network. The device has terminals at which an average resistance value thereof can be measured. The resistors are supported on a substrate which can be reduced in size from an initial size without substantially changing the average resistance value. In preferred embodiments, a pattern of contacts and conductive tracks joining the contacts are printed on a substrate, and a material having a temperature dependent resistance is applied over the contacts to define a network of interconnected thermistors. Alternatively, the material can be applied to the substrate first and the contacts and tracks printed on it.

15. 发明授权

EP2951134B1 THERMISTOR MATERIAL AND METHOD OF PREPARING THE SAME 有权
标题翻译：热敏材料及其制备方法
公开(公告)号：EP2951134B1
公开(公告)日：2018-01-24
申请号：EP14746818.5
申请日：2014-01-24
申请人： BYD Company Limited
发明人： ZHAO, Yanshuai , ZHOU, Wei
IPC分类号： C04B35/468 , C04B35/622 , C01G23/00 , C04B35/626 , C04B35/462 , C04B35/64 , C04B35/634 , H01C7/00 , H01C7/02 , H01C17/065 , C04B35/653
CPC分类号： H01C7/023 , C01G23/006 , C04B35/462 , C04B35/4682 , C04B35/6261 , C04B35/62685 , C04B35/62695 , C04B35/63416 , C04B35/64 , C04B35/653 , C04B2235/32 , C04B2235/3201 , C04B2235/3203 , C04B2235/3217 , C04B2235/3224 , C04B2235/3232 , C04B2235/3236 , C04B2235/34 , C04B2235/3409 , C04B2235/3418 , C04B2235/449 , C04B2235/5427 , C04B2235/6562 , C04B2235/6565 , C04B2235/6567 , C04B2235/785 , H01C7/008 , H01C7/025 , H01C17/06533
摘要： A thermistor material and a method for preparing a thermistor material are provided. The thermistor material is prepared by mixing and heating a mixture containing BaTiO3, B2O3, SiO2, Li2O, P2O5, Cs2O, Nd2O3, Al2O3 and TiO2.

16. 发明授权

EP2394148B1 WIDERSTANDSTHERMOMETER MIT NICHTLEITFÄHIGEM ZIRCONIUMDIOXID 有权转让
标题翻译：具有非导电性二氧化锆的耐热温度计
公开(公告)号：EP2394148B1
公开(公告)日：2017-11-08
申请号：EP10702032.3
申请日：2010-01-20
申请人： HERAEUS SENSOR TECHNOLOGY GMBH
发明人： WIENAND, Karlheinz , ZINKEVICH, Matsvei
IPC分类号： G01K7/18 , H01C7/00 , H01C7/02 , H01C7/06
CPC分类号： H01C7/02 , G01K7/183 , G01K2205/04 , H01C7/008 , H01C7/06 , Y10T29/49085

17. 发明授权

EP2985767B1 THERMISTOR ELEMENT AND TEMPERATURE SENSOR COMPRISING THE THERMISTOR ELEMENT 有权转让
标题翻译：热电偶和温度传感器MIT DEM热敏电阻
公开(公告)号：EP2985767B1
公开(公告)日：2017-05-03
申请号：EP15183326
申请日：2014-03-11
申请人： NGK SPARK PLUG CO
发明人： WATANABE HIROSHI , OKIMURA YASUYUKI
IPC分类号： H01C1/032 , G01K7/22 , H01C1/02 , H01C7/00 , H01C7/04 , H01C17/02
CPC分类号： H01C1/02 , G01K7/22 , G01K2205/04 , H01C1/032 , H01C7/008 , H01C7/04 , H01C17/02 , Y10T29/49085

18. 发明授权

EP2822001B1 METAL NITRIDE MATERIAL FOR THERMISTOR, METHOD FOR PRODUCING SAME, AND FILM THERMISTOR SENSOR 有权
标题翻译：热敏电阻用金属氮化物材料及其制造方法以及薄膜热敏电阻传感器
公开(公告)号：EP2822001B1
公开(公告)日：2017-03-29
申请号：EP13754162.9
申请日：2013-02-26
申请人： Mitsubishi Materials Corporation
发明人： FUJITA, Toshiaki , TANAKA, Hiroshi , INABA, Hitoshi , FUJIWARA, Kazutaka , NAGATOMO, Noriaki
IPC分类号： H01C7/04 , H01C7/00 , G01K7/22 , C30B25/06 , C30B29/38 , H01C17/12 , H01C7/02
CPC分类号： H01C7/008 , C30B25/06 , C30B29/38 , G01K7/22 , H01C7/023 , H01C7/04 , H01C7/043 , H01C17/12
摘要： Provided are a metal nitride material for a thermistor, which exhibits high reliability and high heat resistance and can be directly deposited on a film or the like without firing, a method for producing the metal nitride material for a thermistor, and a film type thermistor sensor. The metal nitride material for a thermistor consists of a metal nitride represented by the general formula: Ti x Al y N z (where 0.70 ‰¤ y/(x+y) ‰¤ 0.95, 0.4 ‰¤ z ‰¤ 0.5, and x+y+z = 1), and the crystal structure thereof is a hexagonal wurtzite-type single phase.
摘要翻译：本发明提供一种热敏电阻用金属氮化物材料，其具有高可靠性和高耐热性，并且可以不经焙烧而直接沉积在膜等上，用于制造热敏电阻用金属氮化物材料的方法以及膜型热敏电阻传感器。用于热敏电阻的金属氮化物材料由通式：Ti x Al y N z（其中0.70‰y /（x + y）‰0.95,0.4‰z 0.5‰和x + y + z = 1），其晶体结构是六方纤锌矿型单相。

19. 发明公开

EP2985767A1 THERMISTOR ELEMENT AND TEMPERATURE SENSOR COMPRISING THE THERMISTOR ELEMENT 有权转让
标题翻译：温度传感器MIT DEM THERMISTORELEMENT
公开(公告)号：EP2985767A1
公开(公告)日：2016-02-17
申请号：EP15183326.6
申请日：2014-03-11
申请人： NGK Spark Plug Co., Ltd.
发明人： WATANABE, Hiroshi , OKIMURA, Yasuyuki
IPC分类号： H01C1/032 , H01C7/00 , H01C17/02 , G01K7/22 , H01C1/02 , H01C7/04
CPC分类号： H01C1/02 , G01K7/22 , G01K2205/04 , H01C1/032 , H01C7/008 , H01C7/04 , H01C17/02 , Y10T29/49085
摘要： A thermistor element (1) comprising a thermistor main body (10) made of an electrically conductive sintered oxide and having a rectangular parallelepiped shape and a first covering layer which has reduction resistance is disclosed, said first covering layer (20) covering an entire periphery of the thermistor main body (10) and having an outer surface, at least a portion of which is an exposed outer surface exposed to the outside, wherein when a shortest distance in a straight line in the first covering layer (20) extending from a starting point on the thermistor main body (10) to the exposed outer surface is defined as an exposed layer thickness at the starting point, the first covering layer (20) is formed such that the exposed layer thickness measured by using any vertex of the rectangular parallelepiped thermistor main body (10) as a starting point is equal to or greater than the smallest one of exposed layer thicknesses measured by using, as starting points, points which are other than the vertex and are located on three sides and three flat surfaces which form the vertex.
摘要翻译：本发明公开了一种热敏电阻元件（1），包括由导电烧结氧化物制成并具有长方体形状的热敏电阻主体（10）和具有还原性的第一覆盖层，所述第一覆盖层（20）覆盖整个外围并且具有外表面，其外表面的至少一部分是暴露在外部的外表面，其中当从第一覆盖层（20）延伸的直线中的最短距离从将热敏电阻本体（10）上的露出的外表面的起点定义为起始点处的暴露层厚度，形成第一覆盖层（20），使得通过使用矩形的任何顶点测量的暴露层厚度作为起点的平行六面体热敏电阻主体（10）等于或大于通过使用作为其他点的点作为起始点测量的最小曝光层厚度并且位于形成顶点的三个侧面和三个平坦表面上。

20. 发明公开

EP2795688A4 LOW TEMPERATURE RESISTOR FOR SUPERCONDUCTOR CIRCUITS 有权
标题翻译： NIEDRIGTEMPERATURWIDERSTANDFÜRSUPRALEITENDE SCHALTUNGEN
公开(公告)号：EP2795688A4
公开(公告)日：2015-09-02
申请号：EP12870932
申请日：2012-12-17
申请人： NORTHROP GRUMMAN SYSTEMS CORP
发明人： TALVACCHIO JOHN J , FOLK ERICA C , MCLAUGHLIN SEAN R , PHILLIPS DAVID J
IPC分类号： H01L27/18 , H01C7/00
CPC分类号： H01L27/18 , H01C7/006 , H01C13/00 , H01L39/00

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