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11. 发明公开

EP1758166A3 Interposer and method for producing the same and electronic device 审中-公开
标题翻译：载体及其制造方法和电子装置之间
公开(公告)号：EP1758166A3
公开(公告)日：2011-09-21
申请号：EP06017442.2
申请日：2006-08-22
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Sunohara, Masahiro , Taguchi, Yuichi
IPC分类号： H01L23/498 , H01L23/14 , H01L23/48 , H05K3/40 , H05K1/11 , H01L21/48 , H05K3/44
CPC分类号： H05K3/445 , H01L21/486 , H01L21/4867 , H01L23/49827 , H01L2924/0002 , H05K1/0306 , H05K3/005 , H05K3/4053 , H05K2203/0108 , H01L2924/00
摘要： An interposer includes a substrate (1) made of an inorganicmaterial; a through wiring (5) including conductors embedded in through holes; and an upper wiring (6). The imprint technique is used to form the through wiring.

12. 发明公开

EP2025210A1 SCHALTUNGSTRÄGER 有权
标题翻译：电路载体
公开(公告)号：EP2025210A1
公开(公告)日：2009-02-18
申请号：EP07718465.3
申请日：2007-05-25
申请人： Ab Mikroelektronik Gesellschaft Mit Beschränkter Haftung
发明人： HAEGELE, Bernd
IPC分类号： H05K1/05 , H05K3/28 , H05K3/44
CPC分类号： H05K1/053 , C03C3/064 , C23C4/18 , H05K1/092 , H05K2201/0116 , H05K2201/017 , H05K2201/0179 , H05K2203/1147 , H05K2203/1366 , Y10T29/49126 , Y10T29/49146
摘要： Circuit carrier having a metal support layer, at least some portions of which are covered by a dielectric layer, the latter having a plurality of pores, with the pores being sealed by glass at least on the opposite side of the dielectric layer to the support layer.

13. 发明公开

EP1720390A2 Apparatus and method for making circuitized substrates in a continous manner 审中-公开
标题翻译： Vorrichtung und Verfahren zur ununterbrochenen Herstellung einer Leiterplatte
公开(公告)号：EP1720390A2
公开(公告)日：2006-11-08
申请号：EP06252038.2
申请日：2006-04-12
申请人： Endicott Interconnect Technologies, Inc.
发明人： Lauffer, John M. , Markovich, Voya R. , Orband, James W. , Wilson, William E.
IPC分类号： H05K3/44
CPC分类号： H05K3/44 , H05K3/064 , H05K3/4069 , H05K3/427 , H05K3/445 , H05K3/462 , H05K3/4641 , H05K2201/0355 , H05K2201/09536 , H05K2201/096 , H05K2201/10378 , H05K2203/0143 , H05K2203/068 , H05K2203/1545 , H05K2203/1572 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/53161 , Y10T29/5317 , Y10T29/53204
摘要： Apparatus and method for making circuitized substrates using a continuous roll format in which layers of conductor (33) and dielectric (23, 25) are fed into the apparatus, bonded, and passed on to other nearby work stations (31, 32, 51, 71, 101) in which various processes such as hole formation, circuitization and, finally, segmentation occur. The resulting substrates can then be individually bonded to other, like substrates to form a larger multi-layered substrate with a plurality of conductive thru-holes (57), conductive (33) and dielectric (23, 25) layers as part thereof.
摘要翻译：使用连续辊式制造电路化衬底的装置和方法，其中导体（33）和电介质层（23,25）被馈送到设备中，粘合并传递到其他附近的工作站（31,32,51， 71，101），其中发生诸如孔形成，电路化和最终分段的各种处理。所得到的基板然后可以单独地结合到其它类似的基板，以形成具有多个导电通孔（57），导电（33）和电介质（23,25）层作为其一部分的更大的多层基板。

14. 发明公开

EP1523869A1 PROCESS FOR CREATING VIAS FOR CIRCUIT ASSEMBLIES 有权
标题翻译：用于生产接触孔FOR CIRCUITS
公开(公告)号：EP1523869A1
公开(公告)日：2005-04-20
申请号：EP03762159.6
申请日：2003-06-27
申请人： PPG Industries Ohio, Inc.
发明人： WANG, Alan E. , OLSON, Kevin C.
IPC分类号： H05K3/44 , H05K3/46 , H05K3/00
CPC分类号： H05K3/44 , H05K1/056 , H05K3/002 , H05K3/0052 , H05K3/4641 , H05K3/4644 , H05K2201/0166 , H05K2201/0909 , H05K2201/0919 , H05K2201/09554 , H05K2203/135 , Y10T29/49126 , Y10T29/49156 , Y10T29/49167 , Y10T428/12361 , Y10T428/24322
摘要： Provided is a process for creating vias for a circuit assembly including the steps of (a) applying a curable coating composition to a substrate, some or all of which is electrically conductive, to form an uncured coating thereon; (b) applying a resist over the uncured coating; (c) imaging the resist in predetermined locations; (d) developing the resist to expose predetermined areas of the uncured coating; (e) removing the exposed areas of the uncured coating; and (f) heating the coated substrate of step (e) to a temperature and for a time sufficient to cure the coating. Also disclosed is a process of fabricating a circuit assembly.

15. 发明公开

EP1460889A3 Plastic package with high heat dissipation and method for manufacturing the same 审中-公开
标题翻译：具有用于其制备高散热性和处理的塑料外壳
公开(公告)号：EP1460889A3
公开(公告)日：2005-01-05
申请号：EP04006264.8
申请日：2004-03-16
申请人： SUMITOMO METAL (SMI) ELECTRONICS DEVICES INC.
发明人： Hamano, Akihiro , Tomabechi, Shigehisa
IPC分类号： H05K3/00 , H01L23/36 , H05K3/44 , H05K1/02
CPC分类号： H05K1/021 , H01L21/4857 , H01L23/36 , H01L23/3735 , H01L2924/0002 , H01L2924/3011 , H05K1/0204 , H05K1/056 , H05K1/182 , H05K3/022 , H05K2201/09054 , H05K2201/09745 , H05K2203/063 , Y10S428/901 , Y10T428/24917 , Y10T428/249999 , Y10T428/25 , Y10T428/31529 , H01L2924/00
摘要： The present invention provides a high heat dissipation plastic package (10) and a method for making the same that provides an inexpensive, thin high heat dissipation plastic package (10) with good bonding precision and minimal bleeding of adhesive resin. A Cu foil resin film (11) is formed by bonding an adhesive resin to a Cu foil and pre-forming, at an essentially central position, a cut-out (15) for a cavity used to mount a semiconductor element. The Cu foil resin film (11) is bonded using the adhesive resin directly to a heat dissipation plate (12). A conductor wiring pattern is formed on the Cu foil resin film (11). Furthermore, the heat dissipation plate (12) includes a stopping section used to prevent resin from bleeding onto a cavity when bonding with the adhesive resin of the Cu foil resin film (11).

16. 发明公开

EP1199915A2 Schaltungsstrukturen auf thermisch gespritzten Schichten 审中-公开
公开(公告)号：EP1199915A2
公开(公告)日：2002-04-24
申请号：EP01124554.5
申请日：2001-10-13
申请人： Hella KG Hueck & Co.
发明人： Bolzenius, Rainer , Sellent, Manfred
IPC分类号： H05K3/46 , H05K3/44
CPC分类号： H05K1/053 , H05K3/467
摘要： Die vorliegende Erfindung betrifft verschiedene Verfahren zur Herstellung einer elektrischen Schaltung auf einem Trägerkörper. Auf den Trägerkörper, etwa einen Metallkörper, wird eine erste, elektrisch isolierende Basisschicht durch thermisches Spritzen aufgebracht (220).
Danach wird in einem weiteren Schritt (230) eine zweite, beispielsweise elektrisch leitende Schicht auf die Basisschicht aufgebracht, die dann ihrerseits durch subtraktives Strukturieren (240) gemäß vorbestimmter Schaltstrukturen strukturiert wird. Dadurch, daß die angestrebte Schaltungsstruktur der zweiten Schicht aus dem Vollen abgetragen wird, kann je nach verwendeter Abtragungstechnik eine sehr hohe räumliche Auflösung dieser Strukturen erreicht werden. Ein weiterer Vorteil besteht darin, daß in Großserien fein strukturierte Schaltungen auf Trägerrohlingen wirtschaftlich erzeugbar sind, da kein nennenswerter Verschleiß an Masken stattfindet.
摘要翻译：该方法涉及具有根据电路到承载体上的具有确定的物理特性的第一基层的热注射成型（220），将第二层（230）施加到基底上并根据下述方式对第二层进行减法构造（280）预定义的电路结构。独立权利要求还包括以下内容：承载体，使用承载体和电路。

17. 发明公开

EP1121007A2 Circuit board with a metal substrate 审中-公开
标题翻译： Schaltungsplatte mit Metallkernplatte
公开(公告)号：EP1121007A2
公开(公告)日：2001-08-01
申请号：EP01300291.0
申请日：2001-01-15
申请人： LUCENT TECHNOLOGIES INC.
发明人： Chen, Shiaw-Jong Steve , Hooey, Roger J. , Truong, Thang D.
IPC分类号： H05K3/44
CPC分类号： H05K3/445 , H05K3/403 , H05K3/4608 , H05K2201/10386
摘要： An improved circuit board apparatus configured for mounting electronic components in a circuit arrangement comprises a metal substrate (22) having a first side (24) and a second side (26), a first-side laminar structure and a second-side laminar structure. The first-side laminar structure includes at least one first-side conductive stratum (32) alternated with at least one first-side dielectric stratum (28) affixed at the first side The second-side laminar structure includes at least one second-side conductive stratum (34) alternated with at least one second-side dielectric stratum (30) affixed at the second side of the metal substrate. The apparatus further comprises a plurality of electrically conductive interside courses (46, 48) intermediate selected first-side strata of the at least one first-side conductive stratum and selected second-side strata of the at least one second-side conductive stratum.
摘要翻译：一种被配置用于将电子部件安装在电路装置中的改进的电路板装置包括具有第一侧面（24）和第二侧面（26），第一侧面层状结构和第二侧面层状结构的金属基板（22）。第一侧层状结构包括至少一个与固定在第一侧上的至少一个第一侧介电层（28）交替的第一侧导电层（32）。第二侧层流结构包括至少一个第二侧导电层层（34）与固定在金属基板的第二侧的至少一个第二侧电介质层（30）交替。所述装置还包括位于所述至少一个第一侧导电层的所选择的第一侧层和所述至少一个第二侧导电层的选定的第二侧层之间的多个导电的内侧平台（46,48）。

18. 发明公开

EP1069811A2 Multi-layer wiring board and method for manufacturing the same 有权
标题翻译： Mehrschichtige Leiterplatte und Verfahren zu deren Herstellung
公开(公告)号：EP1069811A2
公开(公告)日：2001-01-17
申请号：EP00115237.0
申请日：2000-07-13
申请人： NITTO DENKO CORPORATION
发明人： Nakamura, Kei , Sugimoto, Masakazu , Inoue, Yasushi , Okeyui, Takuji , Nagasawa, Megumu
IPC分类号： H05K3/46 , H05K3/44
CPC分类号： H05K3/462 , H05K3/4038 , H05K3/445 , H05K2201/0305 , H05K2201/09536 , Y10S428/901 , Y10T156/10 , Y10T428/24273 , Y10T428/24917 , Y10T428/266 , Y10T428/31681
摘要： A plurality of double-sided circuit boards 1 in which a circuit 4 is provided on either side of an insulating layer 3 comprising an organic high molecular resin with an alloy foil 2 as a basic substance, and two circuits 4 are electrically connected by a via with a soldered conductor 5a filled therein are laminated via an adhesive layer 6. The adhesive layer 6 has a bore opened at a predetermined position of a portion in direct contact with the circuits 4 of two double-sided circuit boards 1. A bore portion is provided with a soldered conductor 7. The circuits 4 of the two double-sided circuit boards 1 are electrically connected by the soldered conductor 7.
摘要翻译：多个双面电路板1，其中电路4设置在具有合金箔2作为基本物质的有机高分子树脂的绝缘层3的两侧，以及两个电路4通过通孔其中填充有焊接导体5a经由粘合剂层6层压。粘合剂层6具有在与两个双面电路板1的电路4直接接触的部分的预定位置处开口的孔。孔部分设置有焊接导体7.两个双面电路板1的电路4由焊接导体7电连接。图像

19. 发明授权

EP0393381B1 Lamination method for coating the sidewall or filling a cavity in a substrate 失效
标题翻译：层压，以覆盖在衬底的腔的侧壁，并填补该空腔。
公开(公告)号：EP0393381B1
公开(公告)日：1995-11-08
申请号：EP90105609.3
申请日：1990-03-24
申请人： International Business Machines Corporation
发明人： Davis, Charles Robert , Goldblatt, Ronald Dean
IPC分类号： H05K3/44 , H05K3/00
CPC分类号： B23K26/382 , B23K26/389 , B23K26/40 , B23K2201/35 , B23K2203/08 , B23K2203/10 , B23K2203/12 , B23K2203/166 , B23K2203/172 , B23K2203/18 , B23K2203/42 , B23K2203/50 , B23K2203/52 , B23K2203/54 , B23K2203/56 , H05K1/056 , H05K3/445 , H05K2201/0129 , H05K2201/09581 , H05K2203/0278 , H05K2203/068 , H05K2203/1438

20. 发明公开

EP0393381A3 Lamination method for coating the sidewall or filling a cavity in a substrate 失效
标题翻译：用于涂覆顶板或填充基材中的孔的层压方法
公开(公告)号：EP0393381A3
公开(公告)日：1991-07-03
申请号：EP90105609.3
申请日：1990-03-24
申请人： International Business Machines Corporation
发明人： Davis, Charles Robert , Goldblatt, Ronald Dean
IPC分类号： H05K3/44 , H05K3/00
CPC分类号： B23K26/382 , B23K26/389 , B23K26/40 , B23K2201/35 , B23K2203/08 , B23K2203/10 , B23K2203/12 , B23K2203/166 , B23K2203/172 , B23K2203/18 , B23K2203/42 , B23K2203/50 , B23K2203/52 , B23K2203/54 , B23K2203/56 , H05K1/056 , H05K3/445 , H05K2201/0129 , H05K2201/09581 , H05K2203/0278 , H05K2203/068 , H05K2203/1438
摘要： Method for pressing a material (6,8,84) into a through-hole (12) or blind-hole (80) in a substrate (10,82). The material (6,8,84) is disposed on the surface of the substrate (10,82). An environment is provided permitting the material (6,8,84) to flow for example by heating the material (6,8,84) to the glass transition temperature or above. Thereafter pressure is applied causing the material (6,8,84) to flow, first coating the sidewall (18,92) of the hole (12,80) and on the continued application of pressure the material flows to completely fill the hole (12,80). The resulting substrate (10,82) can have a substantially planar surface having holes (12,80) with the periphery coated with or completely filled with the material (6,8,84). The material (6,8,84) is preferably a thermoplastic polymeric material such as a polyimide and a perfluorinated polymer.
摘要翻译：将材料（6,8,84）压入基板（10,82）中的通孔（12）或盲孔（80）中的方法。材料（6,8,84）设置在基底（10,82）的表面上。提供允许材料（6,8,84）例如通过将材料（6,8,84）加热至玻璃化转变温度或更高温度而流动的环境。此后施加压力导致材料（6,8,84）流动，首先涂覆孔（12,80）的侧壁（18,92），并且在继续施加压力时材料流动以完全填充孔（ 12,80）。所得到的基底（10,82）可以具有基本上平坦的表面，其具有孔（12,80），周边涂有或完全填充材料（6,8,84）。材料（6,8,84）优选为热塑性聚合材料，例如聚酰亚胺和全氟化聚合物。

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