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11. 发明公开

EP3411890A1 HERMETICALLY SEALED ELECTROLYTIC CAPACITOR WITH DOUBLE CASE 审中-公开
公开(公告)号：EP3411890A1
公开(公告)日：2018-12-12
申请号：EP17748214.8
申请日：2017-02-03
申请人： Cornell-Dubilier Marketing, Inc.
发明人： KAPLAN, James , LARK, Patrick
IPC分类号： H01G9/10 , H01G2/10 , H01G9/06 , H01G9/08 , H01G4/224 , H01G4/236
CPC分类号： H01G9/10 , H01G9/008 , H01G9/02 , H01G9/045 , H01G9/08 , H01G9/145 , H01G2009/0408
摘要： An electrolytic capacitor is provided having an inner case housing a capacitor element and an electrolyte, which is sealed by an inner cap insulated from the body of the inner case by a gasket, with the anode terminal of the capacitor element connected to the inside face of the inner cap and an anode lead connected to the outside face of the inner cap. The inner case is placed in an outer case having a sleeve surrounding the body of the inner case and an outer cap with a hermetic seal overlaying the inner cap. An insulating spacer is positioned between the inner cap and the outer cap, whereby the spacer resists movement of the inner cap, thereby preventing outward expansion of the inner case, which otherwise might lead to failure, especially at relatively high operating temperatures.

12. 发明公开

EP3216046A4 RELIABILITY IMPROVEMENT OF POLYMER-BASED CAPACITORS BY MOISTURE BARRIER 有权
公开(公告)号：EP3216046A4
公开(公告)日：2018-07-18
申请号：EP15856201
申请日：2015-11-06
申请人： TEXAS INSTRUMENTS INC
发明人： GUO HONGLIN , TAYLOR TIM A , WEST JEFF A , JACKSON RICKY A , WILLIAMS BYRON
IPC分类号： H01L21/02 , H01G4/14 , H01G4/18 , H01G4/224 , H01G4/236 , H01G4/33 , H01L21/033 , H01L23/31
CPC分类号： H01L21/02118 , H01G4/14 , H01G4/18 , H01G4/224 , H01G4/236 , H01G4/33 , H01L21/02164 , H01L21/02178 , H01L21/0228 , H01L23/3121 , H01L23/3135 , H01L23/3192 , H01L23/564 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L28/40 , H01L51/00 , H01L2224/02166 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/04042 , H01L2224/05567 , H01L2224/05568 , H01L2224/05573 , H01L2224/0558 , H01L2224/05624 , H01L2224/05644 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/291 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/8592 , H01L2224/94 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/03 , H01L2924/014 , H01L2224/45099
摘要： It has been discovered that poor TDDB reliability of microelectronic device capacitors with organic polymer material in the capacitor dielectric is due to water molecules infiltrating the organic polymer material when the microelectronic device is exposed to water vapor in the operating ambient. Water molecule infiltration from water vapor in the ambient is effectively reduced by a moisture barrier comprising a layer of aluminum oxide formed by an atomic layer deposition (ALD) process. A microelectronic device includes a capacitor with organic polymer material in the capacitor dielectric and a moisture barrier with a layer of aluminum oxide formed by an ALD process.

13. 发明公开

EP3140839A2 EMBEDDED PACKAGE SUBSTRATE CAPACITOR WITH CONFIGURABLE/CONTROLLABLE EQUIVALENT SERIES RESISTANCE 有权
标题翻译： EPS-KONDENSATOR MIT KONFIGURIERBAREM / STEUERBAREMÄQUIVALENTEMSERIENWIDERSTAND
公开(公告)号：EP3140839A2
公开(公告)日：2017-03-15
申请号：EP15719383.0
申请日：2015-04-16
申请人： Qualcomm Incorporated
发明人： SONG, Young Kyu , HWANG, Kyu-Pyung , KIM, Dong Wook , ZHANG, Xiaonan , LANE, Ryan David
IPC分类号： H01G4/30 , H01G4/33 , H01G4/40 , H01G4/224 , H01G4/236 , H01L49/02 , H05K1/16 , H01G2/10 , H05K1/18
CPC分类号： H01G4/236 , H01G2/02 , H01G2/106 , H01G4/224 , H01G4/30 , H01G4/33 , H01G4/40 , H05K1/0231 , H05K1/115 , H05K1/182 , H05K1/185 , H05K3/4644 , H05K3/4697 , H05K2201/10015 , Y10T29/42
摘要： Some novel features pertain to package substrates that include a substrate having an embedded package substrate (EPS) capacitor with equivalent series resistance (ESR) control. The EPS capacitor includes two conductive electrodes separated by a dielectric or insulative thin film material and an equivalent series resistance (ESR) control structure located on top of each electrode connecting the electrodes to vias. The ESR control structure may include a metal layer, a dielectric layer, and a set of metal pillars which are embedded in the set of metal pillars are embedded in the dielectric layer and extend between the electrode and the metal layer. The EPS capacitor having the ESR control structure form an ESR configurable EPS capacitor which can be embedded in package substrates.
摘要翻译：一些新颖的特征涉及包括具有等效串联电阻（ESR）控制的嵌入式封装衬底（EPS）电容器的衬底的封装衬底。 EPS电容器包括由电介质或绝缘薄膜材料隔开的两个导电电极和位于将电极连接到通孔的每个电极顶部的等效串联电阻（ESR）控制结构。 ESR控制结构可以包括金属层，电介质层和嵌入金属柱组中的一组金属柱，其嵌入电介质层并在电极和金属层之间延伸。具有ESR控制结构的EPS电容器形成可嵌入封装衬底的ESR可配置EPS电容器。

14. 发明授权

EP0931326B1 VERFAHREN ZUR HERSTELLUNG EINES KONDENSATORS MIT KLEINER EIGENINDUKTIVITÄT 失效转让
标题翻译：方法生产具有小的电感电容
公开(公告)号：EP0931326B1
公开(公告)日：2000-05-17
申请号：EP97918903.2
申请日：1997-08-25
申请人： EPCOS AG
发明人： VETTER, Harald , BERG, Ludwig
IPC分类号： H01G4/236
CPC分类号： H01G5/011 , H01G5/014 , Y10T29/435 , Y10T29/49169 , Y10T29/49194
摘要： According to the suggested method for manufacturing a low self-inductance capacitor integrated in a casing, the wiring between the capacitor (1) junction elements and the passages are made with flexible leads (2) preferably of substantially circular section, the periphery of which shall be tightened prior to their insertion through the passages (6), at least at one end situated in said passages (6).

15. 发明公开

EP0731476A1 Elektrischer Kondensator 失效
公开(公告)号：EP0731476A1
公开(公告)日：1996-09-11
申请号：EP96103354.5
申请日：1996-03-04
申请人： SIEMENS MATSUSHITA COMPONENTS GmbH & CO KG
发明人： Vetter, Harald, Dipl.-Ing. (FH)
IPC分类号： H01G4/236
CPC分类号： H01G4/236
摘要： Ein elektrischer Kondensator, insbesondere Leistungskondensator, ist in ein gas- und/oder öldicht verschlossenes Gehäuse eingebaut. Das Gehäuse besitzt für die Kondensatoranschlüsse montierbare Durchführungen (1), die aus gegen das Gehäuse elektrisch isolierten Metallbolzen (3) sowie Isolatoren (4) zur Erhöhung der Kriechstrecke bestehen. Der Isolator (4) der Durchführung (1) besitzt einen in das Innerere des Gehäuses reichenden Abschnitt (8) an dem ein Gegenstück (10) befestigt ist, das die Durchführung (1) durch Verspannung mit dem Gehäuse verbindet.
摘要翻译：电气电容器，特别是电力电容器内置在气密和/或油密封的外壳中。壳体具有用于电容器端子的通道（1）。通道（19）由与壳体电绝缘的金属棒（3）以及绝缘体组成以增加蠕变范围。通道（1）的绝缘体（4）由延伸到壳体内部的部分（8）形成。一个对置构件（10）固定在该区段（8）上。该对置构件（10）通过紧固将通道（1）连接到壳体。

16. 发明公开

EP0487828A2 Metallized film capacitor construction 失效
标题翻译： Metallfilm-Kondensatorkonstruktion。
公开(公告)号：EP0487828A2
公开(公告)日：1992-06-03
申请号：EP91113067.2
申请日：1991-08-02
申请人： MAGNETEK UNIVERSAL MANUFACTURING
发明人： Lobo, Edward
IPC分类号： H01G4/228 , H01G4/236 , H01G1/14
CPC分类号： H01G4/236 , H01G2/103 , H01G4/228
摘要： A metallized film capacitor and method of manufacture in which the tab (48) connected to the bottom end of the wound capacitor section has insulating tape (50) along the part of the length thereof which extends along the section and the section is within an insulating tube in the capacitor can. A second tab (49) has one end connected to the top end of the capacitor section. A liner (60) having a foldable section is attached to the ends of the terminal studs (29) on the inside of the can cover and the uninsulated ends of the tabs which are connected to the terminal studs are insulated and protected from other parts of the capacitor by being sandwiched between the folded sections of the liner.
摘要翻译：一种金属化薄膜电容器及其制造方法，其中连接到卷绕的电容器部分的底端的突片（48）沿其长度部分沿着该部分延伸并具有绝缘带（50），绝缘带管中的电容可以。第二突片（49）的一端连接到电容器部分的顶端。具有可折叠部分的衬套（60）附接到罐盖内侧上的端子柱（29）的端部，并且连接到端子柱的突片的未绝缘端被绝缘和保护以防止其它部分电容器夹在衬里的折叠部分之间。

17. 发明授权

EP2816624B1 Procédé de réalisation d'une liaison électrique traversante et d'un condensateur traversant dans un substrat 有权
公开(公告)号：EP2816624B1
公开(公告)日：2021-12-15
申请号：EP14172883.2
申请日：2014-06-18
发明人： Joblot, Sylvain , Colonna, Jean-Philippe , Guiller, Olivier , Mourier, Thierry
IPC分类号： H01L49/02 , H01L21/768 , H01L23/48 , H01L23/64 , H01G2/10 , H01G4/236 , H01G4/35

18. 发明授权

EP3140839B1 EMBEDDED PACKAGE SUBSTRATE CAPACITOR WITH CONFIGURABLE/CONTROLLABLE EQUIVALENT SERIES RESISTANCE 有权
公开(公告)号：EP3140839B1
公开(公告)日：2018-05-23
申请号：EP15719383.0
申请日：2015-04-16
申请人： Qualcomm Incorporated
发明人： SONG, Young Kyu , HWANG, Kyu-Pyung , KIM, Dong Wook , ZHANG, Xiaonan , LANE, Ryan David
IPC分类号： H01G4/30 , H01G4/33 , H01G4/40 , H01G4/224 , H01G4/236 , H01L49/02 , H05K1/16 , H01G2/10 , H05K1/18 , H05K1/02 , H05K3/46
CPC分类号： H01G4/236 , H01G2/02 , H01G2/106 , H01G4/224 , H01G4/30 , H01G4/33 , H01G4/40 , H05K1/0231 , H05K1/115 , H05K1/182 , H05K1/185 , H05K3/4644 , H05K3/4697 , H05K2201/10015 , Y10T29/42
摘要： Some novel features pertain to package substrates that include a substrate having an embedded package substrate (EPS) capacitor with equivalent series resistance (ESR) control. The EPS capacitor includes two conductive electrodes separated by a dielectric or insulative thin film material and an equivalent series resistance (ESR) control structure located on top of each electrode connecting the electrodes to vias. The ESR control structure may include a metal layer, a dielectric layer, and a set of metal pillars which are embedded in the set of metal pillars are embedded in the dielectric layer and extend between the electrode and the metal layer. The EPS capacitor having the ESR control structure form an ESR configurable EPS capacitor which can be embedded in package substrates.

19. 发明公开

EP2434506A4 SELF-HEALING CAPACITOR WITH SAFETY PROTECTION MEANS 有权
标题翻译：具有安全保护产品自修复电容
公开(公告)号：EP2434506A4
公开(公告)日：2014-12-10
申请号：EP10777283
申请日：2010-03-22
申请人： LIU GUOGUANG
发明人： LIU GUOGUANG
IPC分类号： H01G4/32 , H01G2/16 , H01G4/015 , H01G4/18 , H01G4/224 , H01G4/236
CPC分类号： H01G2/16 , H01G4/015 , H01G4/18 , H01G4/224 , H01G4/236 , H01G4/32

20. 发明授权

EP2205316B1 FILTERED FEEDTHROUGH ASSEMBLIES FOR IMPLANTABLE DEVICES AND METHODS OF MANUFACTURE 有权
标题翻译： FILTERED实施安排用于植入的装置和方法
公开(公告)号：EP2205316B1
公开(公告)日：2014-06-25
申请号：EP08832054.4
申请日：2008-09-10
申请人： MEDTRONIC, INC.
发明人： IYER, Rajesh V. , MILTICH, Thomas P.
IPC分类号： A61N1/375 , B23K35/02 , H05K3/34 , H01L21/48 , H01G4/35 , H01G4/236 , H01G2/10 , H01G4/224 , B23K1/00
CPC分类号： A61N1/3754 , B23K1/0016 , B23K35/02 , B23K35/0233 , B23K35/0244 , B23K2201/36 , H01G4/224 , H01G4/236 , H01G4/35 , H05K3/3447 , H05K3/3478 , Y10T29/435

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