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11. 发明公开

EP0178051A3 Self-heating lid for soldering to a box 失效
标题翻译：自助包装用于焊接盒子
公开(公告)号：EP0178051A3
公开(公告)日：1987-06-16
申请号：EP85305795
申请日：1985-08-14
申请人： METCAL INC.
发明人： Pursell, Steve
IPC分类号： B23K01/00 , B29C65/36 , H01L23/10
CPC分类号： B23K3/0475 , B23K1/18
摘要： A lid to be bonded to provide a hermetic seal has bonded thereto a thermally autoregulating heater for activating a heat activated sealing and bonding material to produce the desired seal between the lid and box wherein the temperature is regulated to produce heat in a range that does not change delicate objects that may be heated in the box and wherein the energizing element of the heater may be removed or replaced at will.

12. 发明公开

EP0177147A3 Self-heating gasket for hermetically sealing a lid to a box 失效
标题翻译：自动密封用于自动封口的盒子
公开(公告)号：EP0177147A3
公开(公告)日：1987-06-16
申请号：EP85305814
申请日：1985-08-15
申请人： METCAL INC.
发明人： Derbyshire, Rodney L.
IPC分类号： B23K01/00 , B29C65/36 , H01L23/10
CPC分类号： B29C65/3456 , B23K1/0004 , B29C65/3468 , B29C65/348 , B29C66/112 , B29C66/114 , B29C66/24244 , B29C66/53461 , B29C66/91411 , B29C66/91651 , B29C66/91655 , B29C66/919 , B29L2031/3061
摘要： The lid is hermetically sealed to an associated box by a gasket in the form of a sealant covered temperature autoregulating heater.

13. 发明公开

EP0193321A3 Mass soldering system 失效
标题翻译：大型焊接系统
公开(公告)号：EP0193321A3
公开(公告)日：1987-06-03
申请号：EP86301061
申请日：1986-02-17
申请人： HOLLIS AUTOMATION INC.
发明人： Comerford, Matthias F.
IPC分类号： B23K01/08 , B23K01/00 , H05K03/00
CPC分类号： H05K3/3494 , B23K1/085 , H05K3/305 , H05K3/3415 , H05K3/3468 , H05K2203/0776 , H05K2203/087 , H05K2203/1572 , H05K2203/1581 , Y02P70/613
摘要： An improved apparatus and method for mass soldering electrical and electronic components populating both the top and bottom surfaces of substrate circuit boards or the like in a single pass is described.

14. 发明公开

EP0184943A3 Soldering arrangement 失效
标题翻译：焊接安排
公开(公告)号：EP0184943A3
公开(公告)日：1987-06-03
申请号：EP85309104
申请日：1985-12-13
申请人： Hy-Bec Corporation
发明人： Hayakawa, Futomi , Onoda, Kazuo
IPC分类号： B23K01/00 , H05K13/04
CPC分类号： B23K1/005 , H05K13/0465
摘要： A soldering arrangement, for effecting a firm connection of lead pins on IC-packages mounted on a printed circuit board with corresponding lead lines on the printed circuit board with solder, by arresting the IC-package at a predetermined position on the printed circuit board placed on the work table to put the lead pins and the corresponding lead lines, on which the solder has been applied, into contact with each other and irradiating these sites of contact by radiant rays in order to cause soldering of them, which comprises a mounting base provided with a pair of diagonally disposed arms together with, if necessary, another pair of arms disposed also diagonally but rectangularly to the first said pair of arms; head source lamp units producing the radiant rays and focussing them onto said sites of contact of the lead pins with the lead to be soldered, each of said lamp units being hingedly connected to the front end of each of said arms so as to permit each a voluntary adjustment of the angle of inclination of the lamp unit around an axis of angular adjustment; and a support shaft adjustable in its vertical position relative to the work table, said support shaft being arranged passing slidably through said mounting base and supporting a press plate for arresting the IC-package at its lower end.

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