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    • 11. 发明授权
    • TABLET CUTTER
    • 平板切割机
    • EP1820486B1
    • 2011-10-05
    • EP05770321.7
    • 2005-08-08
    • Iwasaki, Azuma
    • Iwasaki, Azuma
    • A61J3/00B26D1/08B26D7/01B26D7/08B26F3/00
    • B26D3/30A61J7/0007B26D1/0006B26D2001/006Y10T225/30Y10T225/371
    • A tablet cutter constructed as below. A blade (1) is attached to the bottom of a hollow column (8) so as to be orthogonal to the bottom surface. A transparent top plate (2) is installed on the top section of the hollow column (8) to close its upper section. A blade fixing head section (6) is formed into a projection having a circular column-like curved surface. The shape of a blade receiving section (4), a recess, formed on a side face of the hollow column (8) is matched to the shape of the blade fixing head section (6). The area of a portion at which the blade fixing head section (6) and the blade receiving head section (4) are in contact with each other and to which impact is transmitted when a tablet is split is increased. The width in the horizontal direction of the blade receiving head section (4) and the blade fixing head section (6) is set greater than the width in the horizontal direction of a blade receiving body section (5) and a blade fixation body section (7). The blade receiving head section (4) of the hollow column (8), blade fixing head section (6), blade receiving body section (5), and blade fixing body section (7) are covered with a cover (9) having the inner diameter same as the outer diameter of the hollow column (8).
    • 如下构造的片剂切割器。 叶片(1)连接到空心柱(8)的底部以垂直于底面。 在空心柱(8)的顶部安装透明的顶板(2)以封闭其上部。 叶片固定头部(6)形成为具有圆柱状曲面的突起。 形成在中空柱8的侧面上的刀片容纳部4的凹部的形状与刀片固定头部6的形状相匹配。 叶片固定头部(6)和叶片接收头部(4)相互接触的部分的面积增加,并且当片剂分裂时传递冲击的部分的面积增大。 叶片接受头部(4)和叶片固定头部(6)在水平方向上的宽度设定为大于叶片接收主体部(5)和叶片固定主体部(5)的水平方向上的宽度 7)。 中空柱8的叶片接收头部4,叶片固定头部6,叶片接收主体部5和叶片固定主体部7由盖9覆盖, 内径与空心柱(8)的外径相同。
    • 19. 发明公开
    • DEVICE AND METHOD FOR CUTTING OFF SUBSTRATE OF FRAGILE MATERIAL
    • VORRICHTUNG UND VERFAHREN ZUM ABTRENNEN EINES SUBSTRATUS AUS ZERBRECHLICHEM MATERIAL
    • EP1886782A1
    • 2008-02-13
    • EP06756641.4
    • 2006-05-26
    • Mitsuboshi Diamond Industrial Co., Ltd.
    • NISHISAKA, Y., MITSUBOSHI DIAMOND IND., CO., LTD.OTODA, K., MITSUBOSHI DIAMOND IND., CO., LTD.INOUE, S., c/o MITSUBOSHI DIAMOND IND., CO., LTD.KUMAGAI, T., MITSUBOSHI DIAMOND IND. CO, LTD.
    • B28D5/00C03B33/033
    • C03B33/033B28D1/222B28D5/0011B28D5/0023B28D5/0029B65G2249/04Y02P40/57Y10T83/0333Y10T225/30Y10T225/325
    • A brittle material substrate cutting method and cutting apparatus are provided, which prevent cut faces of a brittle material substrate from contacting each other after the cutting in a break step of continuously cutting the brittle material substrate, so that a damage or contamination on the brittle material substrate due to the contact can be prevented. A brittle material substrate cutting apparatus includes: a cutting section ( 112, 122 ) for applying a pressing force in a vicinity of a scribe line S formed on a substrate G and cutting the pressed portion of the substrate G; and a holding section moving parallel to the scribe line S while holding the cutting section. The brittle material substrate cutting apparatus continuously cuts the substrate G along the scribe line S. The brittle material substrate cutting apparatus further includes: a cut-face separating section ( 113, 123 ), provided in the holding section, for holding and pressing at least one part of cut substrate portions of the substrate G, wherein the cut substrate portions are generated as a result of the cutting and they oppose each other, and moving cut faces of the cut substrate portions approximately parallel to a main face of the substrate G and in directions to separate the cut faces from each other.
    • 提供一种脆性材料基板切割方法和切割装置,其在连续切割脆性材料基板的断裂步骤中,在脆性材料基板的切割面彼此接触之后彼此接触,从而对脆性材料造成损坏或污染 可以防止由于接触引起的基板。 脆性材料基板切割装置包括:切割部分(112,122),用于在形成在基板G上的划线S附近施加按压力,并切割基板G的按压部分; 以及在保持切割部的同时平行于划线S移动的保持部。 脆性材料基板切断装置沿着切割线S连续切割基板G.脆性材料基板切割装置还包括:切割面分离部(113,123),设置在保持部中,用于至少保持和按压 基板G的切割基板部分的一部分,其中切割的基板部分由于切割而产生并且彼此相对,并且切割的基板部分的切割面大致平行于基板G的主面移动,并且 在将切割面彼此分开的方向上。