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11. 发明公开

EP2557633A4 PRESS FIT TERMINAL AND SEMICONDUCTOR DEVICE 有权
标题翻译：与AUFPRESSBUCHSE和半导体元素终端
公开(公告)号：EP2557633A4
公开(公告)日：2014-07-02
申请号：EP11765647
申请日：2011-03-30
申请人： MITSUBISHI ELECTRIC CORP
发明人： EGUSA MINORU , SUDO SHINGO , HAYASHI KENICHI
IPC分类号： H01R13/03 , H01R12/58 , H05K3/30
CPC分类号： H01R12/585 , H01R13/03 , H05K3/308 , H05K2201/10295 , H05K2201/1059 , H05K2201/10818 , H05K2201/10856
摘要： The objective of the present invention is to obtain a press-fit terminal that can be worked readily and accurately and can reduce the contact resistance between the press-fit terminal and a through-hole, without increasing the press-fitting force when it is pressed into the through-hole and to obtain a semiconductor module provided with the press-fit terminal. The press-fit terminal is configured in such a way that there are laminated in a thickness direction (y direction) a plurality of press-fit terminal units (10 L ), each of which is made of a plate material and includes a front end portion (14) formed in the shape of a taper and press-contact portion (15) that is formed in such a way to have a pair of portions (15a) branched from the front end portion (14), and respective side faces of the pair of portions (15a) face each other through a predetermined spacing (15s), and that are inserted and press-fitted into the through-hole (31); the press-fit terminal is characterized in that respective board thicknesses (t L ) of the plurality of press-fit terminal units (10 L ) are smaller than width (Ws) of the predetermined spacing (15s) or respective widths (Wa) of the pair of portions (15a) branched from the front end portion.

12. 发明授权

EP1931183B1 Electronic device 有权
公开(公告)号：EP1931183B1
公开(公告)日：2013-11-06
申请号：EP07023165.9
申请日：2007-11-29
申请人： Hitachi, Ltd.
发明人： Yokozuka, Takehide , Ikeda, Ukyo , Harada, Masahide , Yoshinari, Hideto
IPC分类号： H05K1/14 , H05K3/32 , H05K1/05 , H05K3/36 , H05K3/34 , H05K3/40
CPC分类号： H05K1/144 , H01L2924/0002 , H05K1/056 , H05K3/328 , H05K3/3447 , H05K3/368 , H05K3/4015 , H05K2201/042 , H05K2201/0979 , H05K2201/1028 , H05K2201/10303 , H05K2201/10318 , H05K2201/10856 , H05K2201/10924 , H05K2203/0285 , H01L2924/00

13. 发明公开

EP2648492A2 A system provided with a solder joint 审中-公开
标题翻译：系统管理员Lötnaht
公开(公告)号：EP2648492A2
公开(公告)日：2013-10-09
申请号：EP13159887.2
申请日：2013-03-19
申请人： Tellabs Oy
发明人： Holma, Antti , Laihonen, Jari-Pekka
IPC分类号： H05K3/34
CPC分类号： H05K1/11 , H05K1/0201 , H05K3/3447 , H05K13/04 , H05K2201/09781 , H05K2201/10303 , H05K2201/10765 , H05K2201/10856 , H05K2203/044
摘要： A system provided with a solder joint comprises: a circuit board (101) provided with an aperture (102), an electrical component (103) comprising a conductor foot (104) protruding through the aperture, and soldering metal (105) inside the aperture and in contact with the conductor foot. The system further comprises a thermal conductor element (106) comprising a first portion outside the aperture and a second portion inside the aperture and in contact with the soldering metal. The thermal conductor element is capable of conducting heat and thereby it intensifies the heat transfer into the aperture during pre-heating which precedes the process phase when the molten soldering metal is enabled to be absorbed into the aperture. Thus the reliability of the solder joint is improved, i.e. a risk of a faulty "cold" solder is decreased.
摘要翻译：设置有焊接接头的系统包括：设置有孔（102）的电路板（101），包括突出穿过孔的导体脚（104）的电气部件（103）和孔内的焊接金属（105）并与导体脚接触。该系统还包括热导体元件（106），其包括孔外部的第一部分和孔内的第二部分并与焊接金属接触。热导体元件能够传导热量，从而当熔融焊接金属能够被吸收到孔中时，其在预加热之前加热到加工阶段之前的热传递。因此，提高了焊点的可靠性，即，存在故障“冷”焊料的风险降低。

14. 发明公开

EP2557633A1 PRESS FIT TERMINAL AND SEMICONDUCTOR DEVICE 有权
标题翻译： ENDGERÄTMIT AUFPRESSBUCHSE UND HALBLEITERBAUELEMENT
公开(公告)号：EP2557633A1
公开(公告)日：2013-02-13
申请号：EP11765647.0
申请日：2011-03-30
申请人： Mitsubishi Electric Corporation
发明人： EGUSA Minoru , SUDO Shingo , HAYASHI Kenichi
IPC分类号： H01R12/51 , H01R12/55
CPC分类号： H01R12/585 , H01R13/03 , H05K3/308 , H05K2201/10295 , H05K2201/1059 , H05K2201/10818 , H05K2201/10856
摘要： The objective of the present invention is to obtain a press-fit terminal that can be worked readily and accurately and can reduce the contact resistance between the press-fit terminal and a through-hole, without increasing the press-fitting force when it is pressed into the through-hole and to obtain a semiconductor module provided with the press-fit terminal. The press-fit terminal is configured in such a way that there are laminated in a thickness direction (y direction) a plurality of press-fit terminal units (10 L ), each of which is made of a plate material and includes a front end portion (14) formed in the shape of a taper and press-contact portion (15) that is formed in such a way to have a pair of portions (15a) branched from the front end portion (14), and respective side faces of the pair of portions (15a) face each other through a predetermined spacing (15s), and that are inserted and press-fitted into the through-hole (31); the press-fit terminal is characterized in that respective board thicknesses (t L ) of the plurality of press-fit terminal units (10 L ) are smaller than width (Ws) of the predetermined spacing (15s) or respective widths (Wa) of the pair of portions (15a) branched from the front end portion.
摘要翻译：本发明的目的是获得能够容易且精确地加工的压配合端子，并且可以在压配合端子和通孔之间降低接触电阻，而不会在压力下增加压配力并且获得具有压配端子的半导体模块。压配合端子被构造成在厚度方向（y方向）层叠多个压配端子单元（10L），每个压配端子单元由板材制成，并且包括前端形成为锥形形状的部分（14）和压接部分（15），其形成为具有从前端部分（14）分支的一对部分（15a），以及各自的侧面所述一对部分（15a）以预定的间隔（15s）彼此面对，并且被插入并压入所述通孔（31）中。压配合端子的特征在于，多个压入端子单元（10L）的各个板厚度（t L）小于预定间隔（15s）的宽度（Ws）或者相应的宽度（Wa）所述一对部分（15a）从前端部分出。

15. 发明公开

EP2430891A1 STECKBARER VARISTOR 审中-公开
公开(公告)号：EP2430891A1
公开(公告)日：2012-03-21
申请号：EP10716368.5
申请日：2010-05-07
申请人： Würth Elektronik ICS GmbH & Co. KG
发明人： KALLEE, Werner
IPC分类号： H05K3/30 , H05K3/36
CPC分类号： H05K1/141 , H01C1/014 , H01C1/022 , H01C1/14 , H01C7/10 , H05K3/308 , H05K3/3447 , H05K2201/049 , H05K2201/10022 , H05K2201/10181 , H05K2201/10303 , H05K2201/10424 , H05K2201/1059 , H05K2201/10856 , H05K2201/10871
摘要： In order to releasably mount an electronic or electric component, the component is combined in a subassembly along with a support element and a housing. An insulating member that is penetrated by through-holes is mounted on the external face of the support element. Connecting elements are accommodated within said through-holes. The connecting elements are electrically and mechanically connected to the support element on one side and project from the front of the insulating member on the other side, where the connecting elements are designed as contact elements that are to be inserted into plated-through bores of a printed circuit board. This allows the electronic component to be plugged as a subassembly to the housing containing the printed circuit board and be removed again as required. If necessary, multiple components can be arranged on the support element inside the housing if said components form a functional unit.

16. 发明公开

EP1944834A2 Compliant pin 审中-公开
标题翻译：符合的引脚
公开(公告)号：EP1944834A2
公开(公告)日：2008-07-16
申请号：EP07123296.1
申请日：2007-12-14
申请人： Delphi Technologies, Inc.
发明人： Tang, Liang
IPC分类号： H01R12/34
CPC分类号： H01R12/585 , H01R13/02 , H01R43/16 , H05K3/308 , H05K2201/10303 , H05K2201/1059 , H05K2201/10856
摘要： A pin (100) for insertion into a hole (200) includes a compliant zone (Z 2 ) having a first flex-beam (120) and a second flex-beam (122), the first flex-beam (120) being a predetermined distance (210a) from the second flex-beam (122). The pin further includes a lead-in zone (Z 1 ) extending from the compliant zone (Z 2 ), wherein a width of the lead-in zone (Z 1 ) narrows to a tip (112).
摘要翻译：用于插入孔（200）中的销（100）包括具有第一柔性梁（120）和第二柔性梁（122）的柔性区（Z2），第一柔性梁（120）是预定的距第二挠曲梁（122）的距离（210a）。销还包括从柔顺区（Z2）延伸的导入区（Z1），其中导入区（Z1）的宽度变窄到尖端（112）。

17. 发明授权

EP1342294B1 I-CHANNEL SURFACE-MOUNT CONNECTOR 有权
标题翻译： I-CHANNEL表面安装连接器
公开(公告)号：EP1342294B1
公开(公告)日：2007-11-28
申请号：EP01964214.9
申请日：2001-08-20
申请人： Power-One, Inc.
发明人： ROY, Apurba
IPC分类号： H01R13/46
CPC分类号： H01R12/57 , H01L23/49811 , H01L2924/0002 , H01L2924/3011 , H01R12/52 , H05K3/3426 , H05K3/368 , H05K2201/1031 , H05K2201/10666 , H05K2201/10856 , Y02P70/611 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49211 , H01L2924/00
摘要： A low impedance surface mount connector (20) having an I-shaped cross section for connecting between the first and second circuit boards (51, 61).

18. 发明公开

EP1309042A3 Federblech zum Kontaktieren eines Bauteils auf einer Leiterplatte 有权
标题翻译：弹簧板用于在印刷电路板上的接触部件
公开(公告)号：EP1309042A3
公开(公告)日：2004-04-21
申请号：EP02022921.7
申请日：2002-10-10
申请人： Rosenberger Hochfrequenztechnik GmbH & Co.
发明人： Rosenberger, Bernhard
IPC分类号： H01R13/646
CPC分类号： H01R24/50 , H01R13/24 , H01R31/08 , H01R2103/00 , H05K1/0243 , H05K3/308 , H05K3/325 , H05K2201/09809 , H05K2201/10189 , H05K2201/1059 , H05K2201/10856
摘要： Die Erfindung betrifft ein Federblech (10) für ein elektrisches bzw. elektronisches Bauteil (20) mit Federstiften (22, 24) zum Befestigen auf einer Leiterplatte (26). Hierbei ist das Federblech (10) derart ausgebildet, daß es zwischen Bauteil (20) und Leiterplatte (26) angeordnet wenigstens einen elektrischen Kontakt zwischen wenigstens einem Teil (18) des Bauteils (20) und wenigstens einer entsprechenden Kontaktfläche auf der Leiterplatte (26) anstatt wenigstens eines Federstiftes (22) herstellt.

19. 发明公开

EP1137107A2 Andruckverbinder 有权
公开(公告)号：EP1137107A2
公开(公告)日：2001-09-26
申请号：EP01106283.3
申请日：2001-03-15
申请人： W.C. Heraeus GmbH & Co. KG
发明人： Gehlert, Bernd
IPC分类号： H01R12/04
CPC分类号： H01R13/24 , H01R4/64 , H05K3/325 , H05K3/368 , H05K2201/0311 , H05K2201/10424 , H05K2201/10856
摘要： Es wird ein Andruckverbinder zum Kontaktieren von unterschiedlichen Leiterbahnebenen von Leiterrahmen/-platten bereitgestellt, mit: mindestens einem ersten Kontaktelement für eine erste Leiterbahnebene und mindestens einem zweiten Kontaktelement für eine zweite Leiterbahnebene, wobei das erste Kontaktelement über Andruck- und Verbindungselemente mit dem zweiten Kontaktelemenent verbunden ist und sowohl die Kontakt- mit den Andruckelementen als auch die Andruck- mit den Verbindungselementen derart über Biegelinien gelenkig miteinander verbunden sind, dass die Elemente im nicht-kontaktierenden Zustand in einer Ebene anordbar sind.
摘要翻译：连接器具有用于第一平面的至少第一接触元件和用于第二平面的至少第二接触元件。第一接触元件通过按压和连接元件连接到第二接触元件。接触元件（1,2）连接到压力元件（3）上，压力元件通过弯曲线（5）连接到连接元件（4）上，因此当非接触元件（1,2）接触状态

20. 发明公开

EP0825680A2 Deformable pin electrical connector 失效
标题翻译： Verformbarer elektrischer Verbindungsstift
公开(公告)号：EP0825680A2
公开(公告)日：1998-02-25
申请号：EP97306469.4
申请日：1997-08-22
申请人： CTS Corporation
发明人： Archer, Ian
IPC分类号： H01R9/09
CPC分类号： H01R12/585 , H01R12/523 , H05K3/308 , H05K3/368 , H05K2201/10303 , H05K2201/1059 , H05K2201/10856
摘要： A deformable pin electrical connector designed to be inserted into several plated through-holes in printed circuit boards to electrically and mechanically connect two or more printed circuit boards (PCBs), for example a single pin that is both electrically and mechanically connected to two PCBs and extends through a plated through-hole of an intermediate PCB without establishing any electrical or mechanical contact with the intermediate PCB. The pin has at least two compliant sections each for press fitting into a plated through-hole in a PCB or the like, each compliant section having a different size diameter. Specifically, the top compliant section is the smallest, the bottom compliant section is the largest in diameter, and the remaining compliant sections gradually increase in size as they are located from the tip to the base of the pin.
摘要翻译：一种可变形销电连接器，设计成插入印刷电路板中的几个电镀通孔中，以电和机械连接两个或更多个印刷电路板（PCB），例如电气和机械连接到两个PCB的单个引脚，延伸穿过中间PCB的电镀通孔，而不与中间PCB建立任何电气或机械接触。销具有至少两个柔性部分，每个柔性部分用于压配合到PCB等中的电镀通孔中，每个柔顺部分具有不同尺寸的直径。具体地说，顶部柔顺部分是最小的，底部顺应部分的直径是最大的，并且剩余的柔性部分的尺寸随着从销钉的尖端到底部的位置而逐渐增加。

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