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    • 20. 发明公开
    • IRREGULAR-SURFACE FORMING METHOD USING PLASMA-ETCHING PROCESS, AND ELECTRODE MEMBER
    • VERFAHREN ZUR FORMUNGIRREGULÄREROBERFLÄCHENMITTELS EINESPLASMAÄTZPROZESSES
    • EP2551893A1
    • 2013-01-30
    • EP11759047.1
    • 2011-01-05
    • LINTEC Corporation
    • NAGANAWA SatoshiKONDO Takeshi
    • H01L21/3065
    • H01L31/02366C01G3/02C01G5/00C01G9/02C01G11/00C01G13/02C01G15/00C01G19/02C01G21/02C01G31/02C01G45/02C01G53/04C01P2002/85C01P2004/03C01P2006/40H01L51/0037H01L51/0096H01L51/441H01L51/447Y02E10/549
    • The present invention is aiming to provide a irregular-surface forming method using a plasma-etching process which could stably and precisely provide a substrate having predetermined surface irregularities, and an electrode component obtained by the forming method therefrom.
      Thus, the present invention relates to method of forming a predetermined irregular-surface pattern on a substrate, wherein a plasma-etching process is carried out using a partly oxidized metal salt film having fine irregular-surface as a resist, comprising the following processes (1) to (3);
      (1)in the first process, a metal salt film is formed on the substrate by coating a liquid material containing a metal salt.
      (2)in the second process, a fine irregular-surface is formed on the metal salt film, and the metal salt film was converted into the resist by the partial oxidization.
      (3)in the third process, a predetermined irregular-surface is formed on the substrate by carrying out the plasma-etching process to the substrate with the resist.
    • 本发明的目的是提供一种使用等离子体蚀刻工艺的不规则表面形成方法,其可以稳定且精确地提供具有预定表面凹凸的基板,以及通过其形成方法获得的电极部件。 因此,本发明涉及在基板上形成预定的不规则表面图案的方法,其中使用具有微细不规则表面的部分氧化的金属盐膜作为抗蚀剂进行等离子体蚀刻工艺,其包括以下方法( 1)至(3); (1)在第一工序中,通过涂布含有金属盐的液体材料,在基板上形成金属盐膜。 (2)在金属盐膜上形成微小的不规则表面,通过部分氧化将金属盐膜转变为抗蚀剂。 (3)在第三工序中,通过用抗蚀剂对基板进行等离子体蚀刻处理,在基板上形成规定的不规则面。