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11. 发明授权

EP1206171B1 Circuit board and method for manufacturing the same 有权
标题翻译：印刷电路板和它们的制备方法
公开(公告)号：EP1206171B1
公开(公告)日：2007-02-14
申请号：EP01126238.3
申请日：2001-11-05
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Suzuki, Takeshi , Nishi, Toshihiro , Tomekawa, Satoru , Echigo, Fumio
IPC分类号： H05K3/40 , H05K3/46
CPC分类号： H05K3/4069 , H05K1/0366 , H05K1/115 , H05K3/0032 , H05K3/0047 , H05K3/4614 , H05K3/4652 , H05K2201/0287 , H05K2201/029 , H05K2201/0355 , H05K2201/094 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T428/24322 , Y10T428/24802 , Y10T428/24917 , Y10T428/24994 , Y10T428/249953

12. 发明授权

EP1307075B1 Prepreg and circuit board and method for manufacturing the same 有权
标题翻译：预浸料和印刷电路板和它们的制备方法
公开(公告)号：EP1307075B1
公开(公告)日：2007-01-24
申请号：EP02023716.0
申请日：2002-10-23
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Nakagiri, Yasushi , Suzuki, Takeshi , Echigo, Fumio
IPC分类号： H05K1/03 , H05K3/40 , B32B27/04 , C08J5/24
CPC分类号： B32B5/26 , B32B3/266 , B32B5/022 , B32B15/14 , B32B2250/05 , B32B2250/40 , H05K1/036 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K2201/0116 , H05K2201/015 , H05K2201/0154 , H05K2201/0355 , H05K2201/0358 , H05K2201/10378 , H05K2203/0759 , H05K2203/1461 , Y10T428/24917 , Y10T428/249971

13. 发明公开

EP1164823A3 Printed circuit board and method of manufacturing the same 审中-公开
标题翻译：印刷电路板和过程及其制备
公开(公告)号：EP1164823A3
公开(公告)日：2003-09-10
申请号：EP01113580.3
申请日：2001-06-13
申请人： Matsushita Electric Industrial Co., Ltd.
发明人： Andoh, Daizo , Echigo, Fumio , Nakamura, Tadashi , Nakatani, Yasuhiro , Ueda, Yoji , Nishiyama, Tousaku , Ochi, Shozo
IPC分类号： H05K3/40 , H05K3/46
CPC分类号： H05K3/4069 , H05K1/0366 , H05K1/0373 , H05K3/4614 , H05K3/462 , H05K3/4652 , H05K2201/0266 , H05K2201/0355 , H05K2201/10378 , H05K2203/0191 , H05K2203/1461 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917
摘要： The present invention provides a printed circuit board, which includes a dielectric substrate (201) having via holes formed in the thickness direction, and a conductor (205) including a conductive filler is filled in the via holes. The dielectric substrate (201) has patterned wiring layers (204, 206, 208) on both surfaces, and the wiring layers (204, 206, 208) are connected electrically with each other by the conductor (205). The dielectric substrate (201) is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor (205) has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate (201) of the printed circuit board has an improved mechanical strength such as flexural rigidity. The present invention also provides a method of manufacturing such a printed circuit board.

14. 发明公开

EP1206171A3 Circuit board and method for manufacturing the same 有权
标题翻译：电路板及其制造方法
公开(公告)号：EP1206171A3
公开(公告)日：2003-05-28
申请号：EP01126238.3
申请日：2001-11-05
申请人： Matsushita Electric Industrial Co., Ltd.
发明人： Suzuki, Takeshi , Nishi, Toshihiro , Tomekawa, Satoru , Echigo, Fumio
IPC分类号： H05K3/40 , H05K3/46
CPC分类号： H05K3/4069 , H05K1/0366 , H05K1/115 , H05K3/0032 , H05K3/0047 , H05K3/4614 , H05K3/4652 , H05K2201/0287 , H05K2201/029 , H05K2201/0355 , H05K2201/094 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T428/24322 , Y10T428/24802 , Y10T428/24917 , Y10T428/24994 , Y10T428/249953
摘要： A circuit board includes an electrical insulator layer formed of a reinforcer sheet (101) with density distribution in its in-plane direction, an electrical conductor filled in a plurality of inner via holes provided in the electrical insulator layer in its thickness direction, and a wiring layer connected to the electrical conductor. The inner via holes (104) provided in a high-density portion of the reinforcer sheet (101) are formed to have a smaller cross-section than the inner via holes (103) provided in a low-density portion of the reinforcer sheet. In this manner, it is possible to provide a circuit board that can achieve a high-density wiring and an inner via connection resistance with less variation, when a base material including a reinforcer sheet with density distribution in its in-plane direction such as a glass cloth formed of warps (102b) and wefts (102a) is used for an insulator layer.
摘要翻译：本发明提供一种电路基板，其包括：电绝缘体层，其由在面内方向上具有密度分布的强化片（101）形成;电导体，其填充于在电绝缘体层的厚度方向上设置的多个内通孔;以及连接到电导体的布线层。设置在加强片101的高密度部分中的内通孔104形成为具有比设置在加强片的低密度部分中的内通孔103更小的横截面。以这种方式，可以提供一种电路板，该电路板能够实现具有较小偏差的高密度布线和内部通路孔连接电阻，当包括在其面内方向上具有密度分布的基底材料由经线（102b）和纬线（102a）形成的玻璃布用于绝缘层。

15. 发明公开

EP1054582A2 Mask film, its manufacturing method, and manufacturing method of circuit board using the same 有权
标题翻译：掩模膜，其生产方法，和用于生产使用相同的电路板
公开(公告)号：EP1054582A2
公开(公告)日：2000-11-22
申请号：EP00110617.8
申请日：2000-05-18
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Takenaka, Toshiaki , Kondo, Toshikazu , Kishimoto, Kunio , Nakamura, Shinji , Echigo, Fumio
IPC分类号： H05K3/40
CPC分类号： H05K3/4069 , H05K2201/0355 , H05K2203/0191 , H05K2203/0522 , H05K2203/1461 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155
摘要： An optimum adhesion strength of the mask film and prepreg sheet is maintained, and peeling between mask film and prepreg sheet is prevented. Further preventing the fusing adhesion between mask film and prepreg sheet due to heat generated when forming penetration holes, a circuit board having an excellent quality is obtained. The mask film used in manufacture of circuit board of the invention includes a base material, and a parting layer and a non-parting portion placed on the base material. The manufacturing method of circuit board of the invention includes the steps of (a) forming a mask film, in which the mask film comprises a base material, a parting layer and a non-parting portion placed on the base material, (b) adhering the mask film to both sides of a prepreg sheet, in which the parting layer and non-parting portion are adhered to the prepreg sheet, (c) forming a penetration hole in specified positions of the prepreg sheet having the mask film, (d) filling the penetration holes with conductive paste from the mask film side, using the mask film as the mask, (e) parting the mask film from the prepreg sheet, (f) overlaying metal foils on both sides of the prepreg sheet, (g) heating and pressing the prepreg sheet having the metal foils, and adhering the prepreg sheet and metal foils mutually, so that the metal foils placed at both sides are connected electrically with each other through the conductive paste filling up the penetration hole, and (h) etching the metal foils selectively to form circuit patterns.
摘要翻译：本发明的电路板的制造方法包括：（a）形成的掩模电影（10），其中，所述掩模电影包括基材（1），脱模层（2）和非脱模部的工序（ 3）放置在基体材料（1），（b）粘接掩模膜（10A，10B），以预浸料坯片材的两面（21），其中，所述脱模层（2）和非脱模部（3）附着在预浸料坯片（21），（c）形成在预浸料坯片材的规定的位置具有所述掩模膜的贯通孔（23）（21）（10A，10B），（d）中填充贯通孔（23）用导电性糊剂（24）从掩模膜侧，使用掩模膜（10A，10B）作为掩模，（e）中剥离屏蔽薄膜（10A，10B）从预成型薄片（21），（F）覆盖金属箔（25A，25B）上的半固化片（21），（G）进行加热加压具有金属箔的预成型薄片（21）（25A，25B）和粘附所述半固化片（21）和金属箔的bothsides （25A，25B）相互，所以没有金属箔（25A，2 图5b）中的bothsides放置通过导电膏（24）填充贯通孔，以及（h）蚀刻所述金属箔电连接witheachother（25A，25B）有选择地形成电路图案（26A，26B）。

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