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11. 发明公开

EP1682444A2 A METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE 审中-公开
标题翻译：方法生产电子器件和电子设备
公开(公告)号：EP1682444A2
公开(公告)日：2006-07-26
申请号：EP04770322.8
申请日：2004-10-26
申请人： Koninklijke Philips Electronics N.V.
发明人： VAN BEEK, Jozef, T., M. , ULENAERS, Mathieu, J., E.
IPC分类号： B81B3/00
CPC分类号： H01G5/18 , B81B3/0078 , B81B2201/016 , B81B2201/038 , B81B2203/04 , B81B2203/053 , H01H59/0009 , H01H2057/006 , H01H2239/01
摘要： 16 ABSTRACT: A method of manufacturing a micro-electromechanical systems (MEMS) device, comprising providing a base layer (10) and a mechanical layer (12) on a substrate (14), providing a sacrificial layer (16) between the base layer (10) and the mechanical layer (12), providing an etch stop layer (18) between the sacrificial layer (16) and the substrate (14), and removing the sacrificial layer (16) by means of dry chemical etching, wherein the dry chemical etching is performed using a fluorine-containing plasma, and the etch stop layer (18) comprises a substantially non-conducting, fluorine chemistry inert material, such as HfO2, ZrO2, Al2O3 or TiO2.

12. 发明公开

EP1436893A2 ELECTRONIC DEVICE AND METHOD OF TESTING AND OF MANUFACTURING 有权
标题翻译：电子元件及其制造方法
公开(公告)号：EP1436893A2
公开(公告)日：2004-07-14
申请号：EP02755466.6
申请日：2002-08-14
申请人： Koninklijke Philips Electronics N.V.
发明人： VAN BEEK, Jozef, T., M. , RIJKS, Theodoor, G., S., M. , MATTERS-KAMMERER, Marion, K. , VAN ESCH, Henricus, A.
IPC分类号： H03H7/01 , H01L23/64 , H01L21/02 , H03H7/42 , H01F17/00 , G01R27/26
CPC分类号： G01R27/2617 , G01R27/26 , H01F17/0006 , H01F17/0013 , H01F27/2804 , H01L27/08 , H01L28/10 , H01L28/40 , H01L2924/0002 , H03H7/0115 , H01L2924/00
摘要： The electronic device (10) comprises a capacitor (12) and an inductor (11) and is present on a substrate (1) with an unplanarized surface (2). This is realized in winding (21) of the inductor (11) has a thickness of at least 1 micron and has a planarized upper surface (81). The upper electrode (32) of the capacitor is present in a second electrode layer (6) and has a lower surface (82) which is spaced from the substrate (1) by a larger distance than the upper surface (81) of the lower electrode (31). The second electrode layer (6) preferably includes a second winding (22) of the inductor (11). The electronic device (10) is suitable for use at high frequencies.

13. 发明公开

EP1177622A1 ELECTRONIC DEVICE 有权
标题翻译：电子设备
公开(公告)号：EP1177622A1
公开(公告)日：2002-02-06
申请号：EP01915158.8
申请日：2001-01-24
申请人： Koninklijke Philips Electronics N.V.
发明人： PULSFORD, Nicolas, J. , VAN BEEK, Jozef, T., M.
IPC分类号： H03H7/01 , H03H3/00
CPC分类号： H03H3/00 , H03H7/0115
摘要： The electronic device (10) of the invention has a first inductor (12) and a first capacitor (11). The capacitor (11) comprises a first capacitor electrode (21) in a first electrically conducting layer (3), a dielectric (26), and a second capacitor electrode (25) in a second electrically conducting layer (7). The second conductive layer (7) also comprises the first inductor (12) and a via (13). In order to get a resonance frequency with a low tolerance, which can be used at high frequencies in RF equipment, the second capacitor electrode (25) has a contour whose projection onto the first conductive layer (3) lies within the first capacitor electrode (21). In this way the decrease in capacitance of the first capacitor (11) due to etching can be leveled out against the increase in inductance of the first inductor (12) due to the same etching. Preferably, the dielectric (26) has a middle zone (24) and edge zones (22, 23). The dielectric consists of a layer of dielectric material (5) in the middle zone (24). In the edge zones (22, 23), the dielectric consists of the layer of dielectric material (5) and a layer of electrically insulating material (4).

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