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11. 发明公开

EP2011842A1 PHOTOSENSITIVE INK COMPOSITION FOR SCREEN PRINTING AND METHOD OF FORMING POSITIVE RELIEF PATTERN WITH USE THEREOF 有权
标题翻译：感光颜色正浮雕图案在其使用生产筛管和方法
公开(公告)号：EP2011842A1
公开(公告)日：2009-01-07
申请号：EP07737655.6
申请日：2007-03-02
申请人： PI R & D Co., Ltd.
发明人： WIN, Maw Soe , GOSHIMA, Toshiyuki , SEGAWA, Sigemasa , NAKAJIMA, Shintaro , KYO, Eika , NISHIKAWA, Yoshikazu , WAKI, Shuzo
IPC分类号： C09D11/10 , H05K3/28
CPC分类号： H05K3/287 , C08G73/106 , C08G77/455 , C08L79/08 , C08L83/10 , C09D11/101
摘要： Disclosed is a photosensitive ink which can form a coated film that is excellent in insulation properties, heat resistance, low warping, low elasticity and adhesion with the substrate, when used as an ink for screen printing, and with which clogging of the screen, bleeding, blur, chipping and the like are unlikely to occur even when the screen printing is repeatedly carried out, so that which has an excellent ease of handling in printing. The ink composition comprises 100 parts by weight of an organic solvent-soluble polyimide block copolymer(s), and 1 to 100 parts by weight of a photoacid generator(s). The polyimide block copolymer(s) and the photoacid generator(s) are dissolved in an organic solvent. The polyimide block copolymer(s) contain(s) in its molecular skeleton a diamine having a siloxane bond, and an aromatic diamine having a hydroxyl group(s) and/or carboxyl group(s) at ortho-position with respect to an amino group.
摘要翻译：本发明提供一种感光性油墨，其可形成薄膜包衣也具有优异的绝缘性，耐热性，低翘曲，低的弹性和粘合性与底物，当用作油墨丝网印刷中使用，并与屏幕的哪个堵塞，出血，模糊，缺损等是不太可能发生，即使丝网印刷重复进行，因为这其中有极好的容易性印刷处理。的油墨组合物（重量）的光酸产生剂（S）的包含100重量份的有机溶剂可溶性聚酰亚胺嵌段共聚物（S）和1至100份的。所述聚酰亚胺嵌段共聚物（S）和光酸产生剂（S）溶解在有机溶剂中。所述聚酰亚胺嵌段共聚物（多个）包含（一个或多个）在其分子骨架中具有硅氧烷键的二胺，和在邻位具有羟基（一个或多个）的芳族二胺和/或羧基基团（一个或多个）相对于与在氨基组。

12. 发明授权

EP1469037B1 SOLVENT-SOLUBLE BLOCK COPOLYIMIDE COMPOSITION AND PROCESS FOR PRODUCING THE SAME 有权
标题翻译：可溶于溶剂的BLOCK COPOLYIMIDZUSAMMENSETZUNG及其制造方法
公开(公告)号：EP1469037B1
公开(公告)日：2008-08-06
申请号：EP03700559.2
申请日：2003-01-15
申请人： PI R & D Co., Ltd.
发明人： JIN, Xingzhou , ISHII, Hiroyuki , MIYAMURA, Masataka , ITATANI, Hiroshi , HORI, Shinichiro , TANIGUCHI, Akihito
IPC分类号： C08L79/08 , C08G73/10 , G03F7/037 , G03F7/039
CPC分类号： C08G73/1021 , C08G73/10 , C08G73/1032 , G03F7/0233 , G03F7/0392
摘要： A block copolyimide composition in which the block copolymide is a polyimide obtained by heating a tetracarboxylic dianhydride and a diamine in a solvent comprising at least one member selected among ketones, ethers, and esters in the presence of a catalyst comprising a lactone and a base; a positive block-copolymerization-type polyimide composition containing a photo-acid generator; an ink; and processes for producing these. The block copolyimide is characterized by suffering no blushing even in the air.

13. 发明授权

EP1262509B1 IMIDE-BENZOXAZOLE POLYCONDENSATE AND PROCESS FOR PRODUCING THE SAME 有权
标题翻译：酰胺 - 苯并恶唑聚缩醛及其制备方法
公开(公告)号：EP1262509B1
公开(公告)日：2007-01-10
申请号：EP00974822.9
申请日：2000-11-08
申请人： PI R & D Co., Ltd.
发明人： ITATANI, Hiroshi , MATSUMOTO, Shunichi
IPC分类号： C08G73/22 , G03F7/037 , H05K1/03 , H05K3/00
CPC分类号： C08G73/22 , G03F7/0233 , G03F7/039 , H05K1/0346 , Y10T428/24802 , Y10T428/24917 , Y10T428/31681
摘要： A polyimide type polycondensate which, when applied to a copper foil and then heated, gives a useful insulating film which does not warp the copper foil. The polycondensate is a solvent-soluble polycondensate which comprises benzoxazole units having a carboxyl group and imide units having a phenolic hydroxyl group, and is obtained by heating one or more tetracarboxylic dianhydrides together with one or more aromatic diamines having an amino group and a phenolic hydroxyl group ortho to the amine group to 150 to 220 DEG C in the presence of an acid catalyst to conduct dehydrating condensation.
摘要翻译：一种聚酰亚胺类缩聚物，当其被应用于铜箔并且随后被加热时，可以得到不会使铜箔翘曲的有用绝缘膜。缩聚物是包含具有羧基的苯并恶唑单元和具有酚羟基的酰亚胺单元的溶剂可溶性缩聚物，并且通过将一种或多种四羧酸二酐与一种或多种具有氨基和酚羟基的芳族二胺在酸性催化剂存在下，将胺基邻位基团在150-220℃进行脱水缩合。

14. 发明公开

EP1640150A1 Polyimide/metal film laminates and process for the production of printed wiring board using the laminate 审中-公开
标题翻译：该聚酰亚胺 - 金属箔层压板，及其制造方法的印刷电路板使用该层压体
公开(公告)号：EP1640150A1
公开(公告)日：2006-03-29
申请号：EP05255690.9
申请日：2005-09-14
申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC. , PI R & D Co., Ltd.
发明人： Omori Takabumi c/o Electronics Material D... , Nozaki Mitsuru, c/o Electronics Material De... , Nagata Eiji, c/o Pi R & D CO., Ltd , Yano Masashi, c/o PI R & D CO., Ltd
IPC分类号： B32B15/08 , B32B15/20 , H05K1/03 , C08G73/10
CPC分类号： B32B15/20 , B32B15/08 , B32B27/281 , B32B2250/02 , B32B2307/202 , B32B2307/75 , B32B2457/08 , C08G73/10 , C08G73/1042 , C08G73/105 , C08G73/1078 , H05K1/0346 , H05K2203/1152 , Y10S428/901 , Y10T428/31721
摘要： A resin composite metal foil comprising a metal foil and a layer of a block copolymer polyimide resin formed on one surface of the metal foil, a metal-foil-clad laminate using the above resin composite metal foil, a printed wiring board using the above metal-foil-clad laminate, and a process for the production of a printed wiring board comprising removing an external layer metal foil of a metal-foil-clad laminate and forming a conductor layer on an external layer insulating layer by plating, wherein the metal-foil-clad laminate comprises a layer of a block copolymer polyimide resin which layer is in contact with the external layer metal foil.
摘要翻译：的树脂复合金属箔，其包括金属箔和形成于该金属箔的一个表面上的嵌段共聚物的聚酰亚胺树脂层，使用上述树脂复合金属箔，使用上述金属的印刷电路板的金属箔的层叠板箔上包覆的层压制品，以及用于制造印刷电路板，包括去除金属箔的覆铜层压板的外层的金属箔上并通过电镀外层绝缘层形成导体层的工艺，worin的金属箔的叠层板包括嵌段共聚物的聚酰亚胺树脂层，其与所述外层的金属箔接触的层。

15. 发明公开

EP1614704A1 CROSSLINKED POLYIMIDE, COMPOSITION COMPRISING THE SAME AND METHOD FOR PRODUCING THE SAME 有权
标题翻译： VERNETZTES POLYAMID，DIESES ENTHALTENDE ZUSAMMENSETZUNG UND HERSTELLUNGSVERFAHRENDAFÜR
公开(公告)号：EP1614704A1
公开(公告)日：2006-01-11
申请号：EP04723799.5
申请日：2004-03-26
申请人： PI R & D Co. Ltd
发明人： ITATANI, Hiroshi, c/o PI R & D CO., LTD.
IPC分类号： C08G73/10 , G03F7/039 , G03F7/037
CPC分类号： C08G73/1067 , C08G73/10 , G03F7/0233 , G03F7/039 , G03F7/0392 , H01L23/29 , H01L2924/0002 , H05K1/0346 , H05K3/4676 , Y10T428/24479 , Y10T428/24802 , Y10T428/31681 , H01L2924/00
摘要： A novel polyimide which retains the characteristics of polyimides, that is, excellent heat resistance, electrical insulation and chemical resistance, of which dielectric constant is lower than those of the known polyimides, as well as a composition containing the same and a process for producing the same, is disclosed. The polyimide of the present invention is a cross-linked polyimide having a dielectric constant of not more than 2,7, which was produced by polycondensing (a) tetramine(s), (a) tetracarboxylic dianhydride(s) and (an) aromatic diamine(s) in the presence of a catalyst.
摘要翻译：保留聚酰亚胺特性的新型聚酰亚胺，即耐热性，电绝缘性和耐化学性优异，其介电常数低于已知聚酰亚胺的介电常数，以及含有该聚酰亚胺的组合物及其制备方法相同，被披露。本发明的聚酰亚胺是通过缩聚（a）四胺，（a）四羧酸二酐和（a）芳族化合物制备的介电常数不大于2.7的交联聚酰亚胺二胺在催化剂存在下反应。

16. 发明公开

EP1561786A1 SOLUTION COMPOSITIONS OF BLOCK COPOLYIMIDES COMPRISING PYROMELLITIC DIANHYDRIDE AND PROCESS FOR PRODUCTION THEREOF 审中-公开
标题翻译： LÖSUNGSZUSAMMENSETZUNGENAUS BLOCKCOPOLYMEREN MIT PYROMELLITH-DIANHYDRID UND HERSTELLUNGSVERFAHRENDAFÜR
公开(公告)号：EP1561786A1
公开(公告)日：2005-08-10
申请号：EP03707181.8
申请日：2003-02-28
申请人： PI R & D Co., Ltd.
发明人： ITATANI, Hiroshi
IPC分类号： C08L79/08 , C08G73/22
CPC分类号： C08G73/1042 , C08G73/1021 , C08G73/1032 , C08L79/08
摘要： Polyimides consisting of PMDA and an aromatic diamine are normally solvent-insoluble. According to the present invention, they are solubilized in solvents to prepare four-component or higher block copolymers containing BTDA. PMDA is reacted with a certain type of aromatic diamine in a molar ratio of 1:2-1.5 to produce a solvent-soluble oligomer. This is combined with an acid dianhydride and an aromatic diamine to produce a four-component or higher solvent-soluble block copolymer.
The molar ratio of the aromatic diamine added with PMDA is 1:2-1.5. A number of solvent-soluble block copolymers containing PMDA can be prepared.
Four-component or higher polyimide block copolymers containing PMDA, BTDA, and DAT are prepared by sequential reactions in the presence of a binary catalyst. This made it possible to prepare various polyimides from many inexpensively available materials. Polyimides containing PMDA-BTDA-DAT can be prepared at high performance, in mass and at low cost by using economical direct imidation, and therefore can be widely used in future.
摘要翻译：由PMDA和芳族二胺组成的聚酰亚胺通常是溶剂不溶性的。根据本发明，将它们溶解在溶剂中以制备含有BTDA的四组分或更高嵌段共聚物。 PMDA与摩尔比为1：2-1.5的某种芳族二胺反应，生成溶剂可溶的低聚物。其与酸二酐和芳族二胺组合以产生四组分或更高的溶剂可溶性嵌段共聚物。加入PMDA的芳族二胺的摩尔比为1：2-1.5。可以制备多种含有PMDA的溶剂可溶性嵌段共聚物。包含PMDA，BTDA和DAT的四组分或更高的聚酰亚胺嵌段共聚物通过在二元催化剂存在下的顺序反应制备。这使得可以从许多廉价的材料制备各种聚酰亚胺。含有PMDA-BTDA-DAT的聚酰亚胺可以通过使用经济的直接酰亚胺化以高性能，质量和成本制备，因此可以在将来被广泛使用。

17. 发明公开

EP1024407A1 POSITIVE PHOTOSENSITIVE POLYIMIDE COMPOSITION 审中-公开
标题翻译： POSITIV ARBITENDE PHOTOEMPFINDLICHE POLYIMIDZUSAMMENSETZUNG
公开(公告)号：EP1024407A1
公开(公告)日：2000-08-02
申请号：EP98947813.6
申请日：1998-10-12
申请人： PI R & D Co Ltd
发明人： ITATANI, Hiroshi , MATSUMOTO, Shunichi
IPC分类号： G03F7/039 , G03F7/022 , G03F7/004 , C08L79/08 , C09D179/08 , C08G73/10 , H05K3/28 , H05K3/46 , H01L21/027
CPC分类号： C08G73/10 , G03F7/0045 , G03F7/039 , Y10S430/106
摘要： A photosensitive polyimide composition which is soluble in an organic solvent, which is excellent in adhesiveness, heat resistance, mechanical properties and flexibility, which shows the property of highly sensitive positive-type photoresist that is soluble in alkali upon irradiation with light is disclosed. The polyimide composition of the present invention contains a photoacid generator and a solvent-soluble polyimide which shows positive-type photosensitivity in the presence of said photoacid generator.
摘要翻译：公开了一种可溶于有机溶剂的感光性聚酰亚胺组合物，其具有优异的粘合性，耐热性，机械性能和柔韧性，其显示了在照射光时可溶于碱的高灵敏度正型光致抗蚀剂的性质。本发明的聚酰亚胺组合物含有在所述光酸产生剂存在下显示正型感光性的光致酸产生剂和溶剂可溶性聚酰亚胺。

18. 发明授权

EP2457725B1 RESIN COMPOSITE ELECTROLYTIC COPPER FOIL, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD 有权
公开(公告)号：EP2457725B1
公开(公告)日：2018-11-28
申请号：EP10802160.1
申请日：2010-06-25
申请人： Mitsubishi Gas Chemical Company, Inc. , PI R & D Co. Ltd
发明人： NOZAKI, Mitsuru , NOMOTO, Akihiro , AKIYAMA, Norikatsu , NAGATA, Eiji , YANO, Masashi
IPC分类号： B32B15/088 , C25D7/00 , C25D7/06 , H05K1/03 , H05K3/38 , C25D5/02 , C25D1/04 , B32B15/08
CPC分类号： H05K1/09 , B32B15/08 , C25D1/04 , C25D5/022 , C25D7/0614 , C25D7/0678 , H05K1/0346 , H05K1/0373 , H05K3/384 , H05K3/4652 , H05K2201/0154 , H05K2201/0355 , H05K2201/0358 , H05K2203/0307 , Y10T428/31681
摘要： The problem of the invention is to provide a resin composite electrolytic copper foil having further improved heat resistance and improved plate adhesion strength when plated after desmear treatment in the work process of an additive method. The solution is to form a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 µm to 3.0 µm and a lightness value of not more than 30 on one surface of an electrolytic copper foil (A), and form a layer of a resin composition (B) containing a block copolymerized polyimide resin (a) having a structure that imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface.

19. 发明授权

EP1326138B1 NEGATIVE PHOTOSENSITIVE POLYIMIDE COMPOSITION AND METHOD OF FORMING IMAGE FROM THE SAME 有权
标题翻译：负型感光性聚酰亚胺和方法教育其图像
公开(公告)号：EP1326138B1
公开(公告)日：2014-11-05
申请号：EP01963583.8
申请日：2001-09-11
申请人： PI R & D Co., Ltd.
发明人： ITATANI, Hiroshi , MATSUMOTO, Shunichi
IPC分类号： C08L79/08 , C08G73/10 , G03F7/004
CPC分类号： C08L79/08 , G03F7/037 , G03F7/0387 , Y10S430/114 , Y10S430/117

20. 发明授权

EP1387415B1 Superconducting integrated circuit and method for fabrication thereof 有权
标题翻译：一种超导集成电路及其制造方法
公开(公告)号：EP1387415B1
公开(公告)日：2014-09-03
申请号：EP03254775.4
申请日：2003-07-31
申请人： National Institute of Advanced Industrial Science and Technology , PI R & D Co., Ltd.
发明人： Aoyagi, Masahiro, , Nakagawa, H. , , Tokoro, Kazuhiko, , Kikuchi, Katsuya, , Itatani, Hiroshi , Segawa, Sigemasa
IPC分类号： H01L39/22 , H01L39/24 , H01L27/18
CPC分类号： H01L39/223 , H01L27/18 , H01L39/2493

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