专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

91. 发明授权

EP3030056B1 APPARATUS TO FORM A RADIUSED BEND IN A FLAT FLEXIBLE CABLE 有权转让
公开(公告)号：EP3030056B1
公开(公告)日：2018-11-14
申请号：EP15195830.3
申请日：2015-11-23
申请人： Delphi Technologies, Inc.
发明人： BLACKMER, Stephen, C , LIBURDI, Steven, A.
IPC分类号： H05K1/02 , H05K1/14
CPC分类号： H01B13/0036 , H05K1/0281 , H05K1/147 , H05K2201/056 , H05K2201/2027 , Y10T29/532
摘要： An apparatus (10) is configured to shape a flat flexible cable (FFC (12)). The apparatus (10) is configured such that a first end (14) and a second end (16) of the FFC (12) can be positioned, respectively, at a first location (18) and a second location (20) of a circuit board assembly (CBA (22)). The apparatus (10) includes a radiused portion (30) configured to determine a bend radius (28) of the FFC (12) when the FFC (12) is installed into the apparatus (10). The apparatus (10) also includes a clamp portion (32) configured to urge the FFC (12) around the radiused portion (30) when the FFC (12) is installed into the apparatus (10).

92. 发明授权

EP2948090B1 NAVIGATED SURGICAL INSTRUMENT COMPRISING A FLEXIBLE CIRCUIT SHEET 有权
公开(公告)号：EP2948090B1
公开(公告)日：2018-09-12
申请号：EP14703512.5
申请日：2014-01-23
申请人： Medtronic Xomed, Inc.
发明人： JACOBSEN, Brad , BURG, Bruce M. , JAIN, Abhishek , BZOSTEK, Andrew
IPC分类号： A61B34/20 , H05K1/03 , A61B17/24
CPC分类号： H05K1/028 , A61B17/24 , A61B34/20 , A61B2017/00862 , A61B2017/00946 , A61B2034/2051 , A61B2090/376 , H05K1/118 , H05K2201/0154 , H05K2201/051 , H05K2201/056 , H05K2201/09445 , H05K2201/1003 , H05K2201/2027
摘要： A flexible circuit assembly can include a base layer (244), a plurality of circuit traces (350) and an insulative layer (362). The plurality of circuit traces can each be coupled to a pair of circuit pads, and the circuit traces can be formed on an upper side of the base layer. The insulative layer can be formed over the circuit traces to isolate the circuit traces from an external environment. The base layer, plurality of circuit traces and insulative layer can form a flexible circuit sheet (232). The base layer and the insulative layer can include material properties and a thickness configured to facilitate the flexible circuit sheet being flexible such that the flexible circuit sheet is adapted to conform to a non-planar surface of the medical device (100).

93. 发明公开

EP3338519A1 GEGENSTAND MIT EINER ELEKTRONISCHEN EINHEIT UND MIT LEITERSTRUKTUREN AUF EINER TRÄGERSTRUKTUR 审中-公开
公开(公告)号：EP3338519A1
公开(公告)日：2018-06-27
申请号：EP16758108.1
申请日：2016-08-18
申请人： Schreiner Group GmbH & Co. KG
发明人： BECKER, Johannes
IPC分类号： H05K1/02 , H05K1/14 , H05K1/16
CPC分类号： H05K1/028 , A61F13/42 , A61F2013/424 , A61J1/035 , A61J2200/70 , B65D75/367 , G01N27/223 , H05K1/0239 , H05K1/147 , H05K1/162 , H05K1/165 , H05K1/18 , H05K2201/049 , H05K2201/055 , H05K2201/056 , H05K2201/09663 , H05K2201/09672 , H05K2201/10015 , H05K2201/1003 , H05K2201/10098 , H05K2201/10151 , H05K2201/10681
摘要： The invention relates to an object (100) which comprises at least a first conductor structure (1), at least one electronic unit (5), at least a second conductor structure (2), which is galvanically isolated from the first conductor structure (1) and/or from the electronic unit (5), but can be electrically coupled thereto, and a carrier structure (15) having at least a first carrier layer (10), a first carrier layer region (11) of the first carrier layer (10) and a second carrier layer region (21). The carrier structure (15) is designed as a layer stack (16) in a base surface region (G) which comprises at least a part of the base surface of the carrier structure (15). The layer stack (16) comprises at least the first carrier layer region (11) of the first carrier layer (10) and the second carrier layer region (21). Furthermore, at least a part of the first (1) and the second conductor structure (2) is arranged in the base surface region (G). The first conductor structure (1) and/or the electronic unit (5) is soldered or bonded to the first carrier layer region (11) or is otherwise connected to the first carrier layer region (11), whereas the second conductor structure (2) is soldered or bonded to the second carrier layer region (12; 21) or otherwise connected to the second carrier layer region (21).

94. 发明授权

EP3068198B1 FLEXIBLE CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME 有权
公开(公告)号：EP3068198B1
公开(公告)日：2018-05-23
申请号：EP16159776.0
申请日：2016-03-11
申请人： Samsung Display Co., Ltd.
发明人： Ahn, Hyeong-Cheol
IPC分类号： H05K1/02 , H05K1/11 , H05K1/18
CPC分类号： H05K1/189 , G06F3/0412 , G06F3/047 , G06F2203/04102 , H05K1/028 , H05K1/0296 , H05K1/118 , H05K2201/055 , H05K2201/056 , H05K2201/09063 , H05K2201/09781 , H05K2201/10121 , H05K2201/10128 , H05K2201/10136 , H05K2201/10681
摘要： A flexible circuit board and display device including the same are disclosed. In one aspect, the flexible circuit board includes a base film including a bending area and a plurality of signal wires formed over the bending area of the base film. At least one through-hole is defined in the base film.

95. 发明授权

EP2778773B1 Flexible display device 有权
公开(公告)号：EP2778773B1
公开(公告)日：2018-02-28
申请号：EP14158355.9
申请日：2014-03-07
申请人： Samsung Electronics Co., Ltd.
发明人： Eom, Sang-Yong , Kim, Dong-Sub , Kim, Dong-Hui , Lee, Mi-Sun , Lee, Joon-Gyu
IPC分类号： G02F1/1333 , G02F1/1345
CPC分类号： H05K1/0281 , G02F1/133305 , G02F1/13452 , H05K1/028 , H05K3/30 , H05K5/0017 , H05K2201/056 , H05K2201/10128 , Y10T29/49128
摘要： A flexible display device (100) includes a flexible display panel (101), a flexible printed circuit board (103) extending from the display panel, an integrated circuit chip (135, 137) that is mounted on at least one surface of the flexible printed circuit board and is configured to drive the display panel, and a protection member (105) attached to a rear surface of the display panel. When the flexible printed circuit board is flexed to be partially positioned on the rear surface of the display panel, the protection member is positioned between the display panel and the integrated circuit chip. The flexible display device prevents the integrated circuit chip stacked with the display panel from making direct contact with the display panel using the protection member. Thus, even if the display device is deformed into, for example, a flexed or rolled state, it is possible to prevent the display panel from being damaged.

96. 发明公开

EP3192111A1 INTERCONNECT FOR BATTERY PACKS 有权
标题翻译：互连电池组
公开(公告)号：EP3192111A1
公开(公告)日：2017-07-19
申请号：EP15840309.7
申请日：2015-08-31
申请人： CELLINK CORPORATION
发明人： COAKLEY, Kevin Michael , BROWN, Malcolm
IPC分类号： H01M2/20 , H01M2/26 , H01M2/10
CPC分类号： H05K3/0058 , H01L23/5386 , H01M2/202 , H01M2/206 , H01M10/4257 , H01M10/48 , H05K1/0268 , H05K1/118 , H05K1/189 , H05K3/4092 , H05K2201/0397 , H05K2201/056 , H05K2201/09081 , H05K2201/10037
摘要： Provided are interconnect circuits for interconnecting arrays of battery cells and methods of forming these interconnect circuits as well as connecting these circuits to the battery cells. An interconnect circuit may include a conductive layer and one or more insulating layers. The conductive layer may be patterned with openings defining contact pads, such that each pad is used for connecting to a different battery cell terminal. In some embodiments, each contact pad is attached to the rest of the conductive layer by a fusible link formed from the same conductive layer as the contact pad. The fusible link controls the current flow to and from this contact pad. The insulating layer is laminated to the conductive layer and provides support to the contacts pads. The insulating layer may also be patterned with openings, which allow forming electrical connections between the contact pads and cell terminals through the insulating layer.
摘要翻译：提供用于互连器件阵列的互连电路以及形成这些互连电路的方法以及将这些电路连接到器件。互连电路可以包括导电层和一个或多个绝缘层。导电层可以被图案化为具有限定接触焊盘的开口，使得每个焊盘被用于连接到互连器件的不同电端子。在一些实施例中，每个接触焊盘通过由与接触焊盘相同的导电层形成的熔丝连接到导电层的其余部分。熔丝连接控制流入和流出该接触垫的电流。绝缘层被层压到导电层并为接触垫提供支撑。绝缘层还可以被图案化为具有开口，这允许通过绝缘层在接触焊盘和电池端子之间形成电连接。

97. 发明公开

EP3100359A4 ATOMIC OSCILLATOR AND PRODUCTION METHOD THEREOF 有权
标题翻译： ATOMOSZILLATOR UND HERSTELLUNGSVERFAHRENDAFÜR
公开(公告)号：EP3100359A4
公开(公告)日：2017-01-25
申请号：EP15742811
申请日：2015-01-26
申请人： RICOH CO LTD
发明人： ADACHI KAZUHIKO , HARASAKA KAZUHIRO , ITOH AKIHIRO
IPC分类号： H03L7/26 , G04F5/14 , H01S1/06 , H05K1/18 , H05K3/34
CPC分类号： H03L7/26 , G04F5/14 , H01L23/345 , H01L2224/45144 , H01L2224/48091 , H01S5/005 , H01S5/02248 , H01S5/02453 , H01S5/183 , H05K1/028 , H05K1/0296 , H05K1/11 , H05K1/189 , H05K3/0052 , H05K2201/052 , H05K2201/055 , H05K2201/056 , H05K2201/09063 , H05K2201/10075 , H05K2201/10174 , H05K2201/2018 , H01L2924/00014 , H01L2924/00

98. 发明公开

EP3107149A1 CIRCUIT IMPRIMÉ FLEXIBLE COMPRENANT UNE ANTENNE DE COMMUNICATION SANS CONTACT ET DISPOSITIF POUR TERMINAL DE PAIEMENT COMPRENANT UN TEL CIRCUIT IMPRIMÉ FLEXIBLE 有权转让
标题翻译：柔性印刷电路板，包括支付终端，包括这样的柔性印刷电路板的非接触式通信天线和组装
公开(公告)号：EP3107149A1
公开(公告)日：2016-12-21
申请号：EP16174869.4
申请日：2016-06-16
申请人： Ingenico Group
发明人： ANDRE, Jérôme , HERNANDEZ, Vincent
IPC分类号： H01Q1/38 , H05K1/02 , H05K1/16 , H04B5/00
CPC分类号： H01Q7/02 , H01Q1/38 , H05K1/028 , H05K1/165 , H05K2201/052 , H05K2201/055 , H05K2201/056 , H05K2201/058 , H05K2201/09063 , H05K2201/09236 , H05K2201/0979 , H05K2201/10098
摘要： L'invention se rapporte à un circuit imprimé flexible (10, 200) de forme longitudinale, comprenant au moins une piste conductrice (101, 201, 202, 203) s'étendant sur la longueur du circuit imprimé flexible, le circuit imprimé flexible comprenant au moins une zone de pliage (105, 205) conformée pour autoriser le passage dudit circuit imprimé flexible d'un état déplié à un état plié dans lequel la piste conductrice forme au moins une boucle d'antenne.
摘要翻译：本发明涉及纵向形状，包括至少一个导电迹线延伸在所述柔性印刷电路的长度的柔性印刷电路板，所述柔性印刷电路板包括至少一个折叠区域形，以便允许所述柔性印刷电路板，以从在展开状态传递给其中导电轨迹形成至少一个天线环的折叠状态。

99. 发明公开

EP3030056A2 APPARATUS TO FORM A RADIUSED BEND IN A FLAT FLEXIBLE CABLE 有权转让
标题翻译： DEVICE FOR形成ROUNDED弯曲的情况下柔性扁平电缆
公开(公告)号：EP3030056A2
公开(公告)日：2016-06-08
申请号：EP15195830.3
申请日：2015-11-23
申请人： Delphi Technologies, Inc.
发明人： BLACKMER, Stephen, C , LIBURDI, Steven, A.
IPC分类号： H05K1/02 , H05K1/14
CPC分类号： H01B13/0036 , H05K1/0281 , H05K1/147 , H05K2201/056 , H05K2201/2027 , Y10T29/532
摘要： An apparatus (10) is configured to shape a flat flexible cable (FFC (12)). The apparatus (10) is configured such that a first end (14) and a second end (16) of the FFC (12) can be positioned, respectively, at a first location (18) and a second location (20) of a circuit board assembly (CBA (22)). The apparatus (10) includes a radiused portion (30) configured to determine a bend radius (28) of the FFC (12) when the FFC (12) is installed into the apparatus (10). The apparatus (10) also includes a clamp portion (32) configured to urge the FFC (12) around the radiused portion (30) when the FFC (12) is installed into the apparatus (10).
摘要翻译：灵活的设备（10）被配置成形状的扁平电缆（FFC（12））。的装置（10）被配置成搜索做了第一端部（14）和FFC的第二端（16）（12）可以被分别定位，在一个第一位置（18）和第二位置（20）电路板组件（CBA（22））。的装置（10）包括当FFC（12）被安装到所述装置（10）被配置为将FFC的确定性矿的弯曲半径（28）（12）弧形部分（30）。因此，该设备（10）包括配置成当所述FFC（12）被安装到所述装置（10）以促使FFC（12）的弧形部分（30）周围的夹持部分（32）。

100. 发明授权

EP2467001B1 Schaltungsanordnung mit mindestens zwei Teilmoduln 有权
标题翻译：至少有两个子模块电路装置
公开(公告)号：EP2467001B1
公开(公告)日：2014-08-27
申请号：EP11188754.3
申请日：2011-11-11
申请人： SEMIKRON Elektronik GmbH & Co. KG
发明人： Beckedahl, Peter , Bogen, Ingo , Ehler, Ralf , Knebel, Markus
IPC分类号： H05K1/14
CPC分类号： H05K1/144 , H05K1/148 , H05K2201/042 , H05K2201/056 , H05K2201/2018 , H05K2203/166 , H05K2203/167

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式