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1. 发明公开

EP3282455A1 RESISTOR DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：电阻器装置及其制造方法
公开(公告)号：EP3282455A1
公开(公告)日：2018-02-14
申请号：EP16183502.0
申请日：2016-08-10
申请人： Walsin Technology Corporation
发明人： Wang, Kao-Yuan , Chuang, Nai-Chuan , Wei, Shih-Long
IPC分类号： H01C17/24 , H01C1/148
CPC分类号： H01C17/24 , H01C1/148 , H01C17/006 , H01C17/281
摘要： The present invention provides a wafer resistor device and a manufacturing method thereof. The manufacturing method of the wafer resistor device comprises the following steps: a first cutting step of magnetically attracting a magnetic metal contact of the wafer resistor device to cut a resistive layer for a first time; a second step of magnetically attracting the magnetic metal contact of the wafer resistor device to cut the resistive layer for a second time. Through the above steps, each wafer resistor device is heading in the same direction during the cutting steps to allow the cutting marks to appear in the same position on each wafer resistor device to reduce the amount of variation of the resistance value of each resistor due to the cutting steps.
摘要翻译：本发明提供一种晶圆电阻器装置及其制造方法。晶片电阻装置的制造方法包括以下步骤：第一切割步骤，磁性吸引晶圆电阻装置的磁性金属接点，以第一次切割电阻层; 第二步骤，磁性吸引晶片电阻器装置的磁性金属触点以第二次切割电阻层。通过上述步骤，每个晶片电阻器件在切割步骤期间以相同的方向前进，以允许切割标记出现在每个晶片电阻器件上的相同位置，以减少每个电阻器的电阻值的变化量，这是由于切割步骤。

2. 发明公开

EP3480845A1 LEADLESS ELECTRONIC COMPONENT AND AN ENCAPSULATION METHOD THEREOF 有权
公开(公告)号：EP3480845A1
公开(公告)日：2019-05-08
申请号：EP18173384.1
申请日：2018-05-19
申请人： Walsin Technology Corporation
发明人： Wang, Kao-Yuan , Chuang, Nai-Chuan , Wei, Shin-Long
IPC分类号： H01L23/31 , B29C45/14 , H01C17/02 , H01F27/29 , H01L21/56
摘要： An encapsulation method of electronic components comprises steps as follows: preparing electronic components with cylindrical bodies wherein a cylindrical body has front and rear ends made of metals and a middle end made of ceramics and the front end or the rear end features an outer diameter greater than the middle end of the cylindrical body; preparing a mould consisting of upper and lower moulds; encasing the cylindrical bodies inside the upper and lower moulds, injecting heated and softened protective materials into the mould in which protective materials as protective layers are coated on the cylindrical bodies; injecting the cylindrical bodies removed from the upper and lower moulds into a roller in which excessive protective layers on the front and rear ends of the cylindrical bodies are de-coated.

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