专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP1467604A2 Techniques for reducing the number of layers in a multilayer signal routing device. 审中-公开
标题翻译：用于减少在多层Signalleitvorrichtung层的数量的技术
公开(公告)号：EP1467604A2
公开(公告)日：2004-10-13
申请号：EP04252038.7
申请日：2004-04-06
申请人： Nortel Networks Limited
发明人： Duxbury, Guy , Wyrzkowska, Aneta , Difilippo, Luigi , Kwong, Herman
IPC分类号： H05K1/11 , H05K3/46
CPC分类号： H05K1/115 , H05K1/0298 , H05K1/112 , H05K3/0005 , H05K3/429 , H05K3/4602 , H05K2201/09227 , H05K2201/09236 , H05K2201/09263 , H05K2201/09509 , H05K2201/09536 , H05K2201/09627 , H05K2201/10734 , Y10T29/49016 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： Techniques for reducing the number of layers in a multilayer signal routing device (10) are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method wherein the multilayer signal routing device (10) has a plurality of electrically conductive signal path layers (16) for routing a plurality of electrical signals thereon. The method may comprise forming a plurality of electrically conductive vias (26) in the multilayer signal routing device for electrically connecting at least two of the plurality of electrically conductive signal path layers (16), wherein the plurality of vias (26) are arranged so as to form at least one channel in at least one other of the plurality of electrically conductive signal path layers (16). The method may also comprise grouping at least a portion of the plurality of electrical signals based at least in part upon their proximity to the at least one channel so that they may be efficiently routed therein.
摘要翻译：用于减少在多层信号路由装置（10）的层的数量的技术是游离缺失盘。在一个特定的示例性实施方式，所述技术可被实现为worin多层信号路由装置（10）具有导电信号路径的层（16），用于在其上的路由的电信号的多个的多个方法。该方法可以包括形成在用于电多层信号路由装置导电过孔（26）的连接的至少两个导电信号路径的层（16）的多个复数，worin通孔的多元性（26）被布置成以在至少一个其它导电信号路径的层（16）的所述多个形成至少一个通道。因此，该方法可以包括在它们靠近所述至少一个信道分组的至少一个在至少部分地基于电信号的多个部分，从而thatthey可以有效地。其中路由。

2. 发明公开

EP1434473A2 Technique for reducing the number of layers in a signal routing device 审中-公开
标题翻译： Techniner zur Verringerung der Anzahl von Schichten in einer Signalleitvorrichtung
公开(公告)号：EP1434473A2
公开(公告)日：2004-06-30
申请号：EP03394085.9
申请日：2003-09-12
申请人： Nortel Networks Limited
发明人： Duxbury, Guy A. , Kwong, Herman , Wyrzykowska, Aneta , Difilippo, Luigi G.
IPC分类号： H05K1/11 , H05K3/46 , H01L23/498
CPC分类号： H05K1/115 , H05K1/0298 , H05K1/112 , H05K3/0005 , H05K3/429 , H05K3/4602 , H05K2201/09227 , H05K2201/09509 , H05K2201/09536 , H05K2201/09627 , H05K2201/10734 , Y10T29/49004 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165
摘要： A technique for reducing the number of layers in a multilayer signal routing device is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for reducing the number of layers in a multilayer signal routing device having a plurality of electrically conductive signal path layers for routing electrical signals to and from at least one electronic component mounted on a surface of the multilayer signal routing device. In such a case, the method comprises routing electrical signals on the plurality of electrically conductive signal path layers in the multilayer signal routing device for connection to and from a high density electrically conductive contact array package based at least in part upon at least one of an electrically conductive contact signal type characteristic and an electrically conductive contact signal direction characteristic.
摘要翻译：公开了一种用于减少多层信号路由设备中的层数的技术。在一个特定示例性实施例中，该技术可以被实现为用于减少具有多个导电信号路径层（16）的多层信号路由设备（10）中的层数的方法，用于将电信号路由至少安装在所述多层信号路由装置（10）的表面上的一个电子部件。在这种情况下，该方法包括在多层信号路由设备（10）中的多个导电信号路径层（16）上布置电信号，用于至少部分地连接到高密度导电触点阵列封装基于导电接触信号型特性和导电接触信号方向特性中的至少一种。

3. 发明公开

EP1515366A3 Techniques for pad arrangements on circuit chips 审中-公开
标题翻译：上电路芯片端子的布置技术
公开(公告)号：EP1515366A3
公开(公告)日：2007-03-21
申请号：EP04394053.5
申请日：2004-08-20
申请人： Nortel Networks Limited
发明人： Kwong, Herman , Soh, Kah Ming , Marcanti, Larry , Wyrzkowska, Aneta , Handforth, Martin
IPC分类号： H01L23/498 , H01L23/482
CPC分类号： H05K1/112 , H01L23/49816 , H01L23/49838 , H01L24/10 , H01L2224/05573 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H05K1/0298 , H05K1/115 , H05K3/0005 , H05K3/429 , H05K3/4602 , H05K2201/09227 , H05K2201/09236 , H05K2201/09263 , H05K2201/09509 , H05K2201/09536 , H05K2201/09627 , H05K2201/10674 , H05K2201/10734 , H01L2924/00 , H01L2224/05599
摘要： Techniques for improved contact mapping in circuit devices are disclosed. In one particular exemplary embodiment, a technique may be realized as a circuit device comprising a circuit chip having a plurality of electrical contacts positioned at a surface of the circuit chip so as to form one or more channels at the surface, the one or more channels being substantially devoid of electrical contacts such that one or more corresponding channels are formed in a chip carrier for routing electrically conductive traces from one or more of the plurality of electrical contacts on a routing layer of the chip carrier.

4. 发明公开

EP1347674A3 Technique for reducing the number of layers in a multilayer circuit board 审中-公开
标题翻译：技术用于降低在多层电路板的层数
公开(公告)号：EP1347674A3
公开(公告)日：2004-08-04
申请号：EP03394028.9
申请日：2003-03-13
申请人： Nortel Networks Limited
发明人： Wyrzykowska, Aneta D. , Difilippo, Luigi G. , Kwong, Herman
IPC分类号： H05K1/11 , H05K3/46
CPC分类号： H05K1/115 , H05K1/0298 , H05K1/112 , H05K3/429 , H05K3/4602 , H05K2201/09227 , H05K2201/09509 , H05K2201/09536 , H05K2201/09627 , H05K2201/10734 , Y10T29/49155
摘要： A technique for reducing the number of layers in a multilayer circuit board is disclosed. The multilayer circuit board (10) has a plurality of electrically conductive signal layers (16) for routing electrical signals to and from at least one electronic component mounted on a surface of the multilayer circuit board (10). The method comprises the steps of: forming a plurality of electrically conductive vias (20,26) in the multilayer circuit board (10) extending from the surface (12) of the multilayer circuit board (10) to at least one of the plurality of electrically conductive signal layers (16); arranging the surface (12) such that a first set of two power/ground pins corresponds to first via and a second set of two power/ground pins corresponds to a second via positioned adjacent the first via, thereby creating a channel on the surface (12) and every layer below which includes a channel on a first (16a) of the plurality of signal layers (16), and routing a first plurality of electrical signals through the channel on the first (16a) of the plurality of electrically conductive signal layers (16).

5. 发明公开

EP1434474A2 Technique for electrically interconnecting electrical signals between an electronic component and a multilayer signal routing device 审中-公开
标题翻译：技术的电子部件和多层Signalleitvorrichtung之间进行电连接的电信号
公开(公告)号：EP1434474A2
公开(公告)日：2004-06-30
申请号：EP03394086.7
申请日：2003-09-12
申请人： Nortel Networks Limited
发明人： Duxbury, Guy , Kwong, Herman , Wyrczykowska, Aneta , Difilippo, Luigi G.
IPC分类号： H05K1/11 , H05K3/46 , H01L23/498
CPC分类号： H05K1/115 , H05K1/0298 , H05K1/112 , H05K3/0005 , H05K3/429 , H05K3/4602 , H05K2201/09227 , H05K2201/09509 , H05K2201/09536 , H05K2201/09627 , H05K2201/10734
摘要： A technique for electrically interconnecting electrical signals between an electronic component and a multilayer signal routing device is disclosed. In one particular exemplary embodiment, the technique may be realized as an interconnect array for electrically interconnecting electrical signals between an electronic component and a multilayer signal routing device having a plurality of electrically conductive signal path layers. In such a case, the interconnect array comprises a plurality of electrically conductive contacts grouped into a plurality of arrangements of electrically conductive contacts, wherein each of the plurality of arrangements of electrically conductive contacts are separated from other adjacent ones of the plurality of arrangements of electrically conductive contacts by a channel that is correspondingly formed in the multilayer signal routing device such that an increased number of electrical signals may be routed therein on the plurality of electrically conductive signal path layers.
摘要翻译：用于电在电子部件互连之间的电信号的技术和多层信号路由装置是游离缺失盘。在一个特定的示例性实施例中，该技术可实现为互连型电阵列（200）在电子元件和具有导电信号路径层上的多个多层信号路由装置互连之间的电信号。在求的情况下，互连阵列（200）包括分组到的导电接触（202）的配置的多个导电触点（202）的多元worin每个（202）导电接触的安排的多个是由信道（206,208）从导电接触（202）的安排的多个其他相邻的分开做在多层信号路由装置搜索对应地形成并在电气信号的数目增加可以在电的多元性。其中路由导电信号路径的层。

6. 发明公开

EP1478215A2 Package modification for channel-routed circuit boards 审中-公开
标题翻译：包修改用于频道指南的电路板
公开(公告)号：EP1478215A2
公开(公告)日：2004-11-17
申请号：EP04394023.8
申请日：2004-05-07
申请人： Nortel Networks Limited
发明人： Difilippo, Luigi , Wyrzykowska, Aneta , Kwong, Herman
IPC分类号： H05K3/30 , H05K3/46
CPC分类号： H05K1/112 , H01L2224/14 , H01L2224/17 , H01L2924/00014 , H05K3/303 , H05K3/4623 , H05K2201/09472 , H05K2201/09518 , H05K2201/09536 , H05K2201/10318 , H05K2201/10424 , H05K2201/10659 , H05K2201/10704 , H05K2201/10734 , Y02P70/613 , Y10T29/4913 , Y10T29/49135 , Y10T29/49139 , Y10T29/49147 , Y10T29/49165 , H01L2224/0401
摘要： A method for implementing a circuit component on a surface of a multilayer circuit board is provided. The circuit component includes a plurality of pins and the circuit board includes a plurality of electrically conductive vias penetrating at least one layer of the circuit board and being arranged so as to form at least one channel for routing one or more traces at one or more signal layers of the circuit board. The method comprises the step of forming at least one pin of the plurality of pins of the circuit component to have a length compatible with a depth of a corresponding via of the circuit board.

7. 发明公开

EP1434473A3 Technique for reducing the number of layers in a signal routing device 审中-公开
标题翻译：技术用于减少Signalleitvorrichtung层的数量
公开(公告)号：EP1434473A3
公开(公告)日：2004-08-04
申请号：EP03394085.9
申请日：2003-09-12
申请人： Nortel Networks Limited
发明人： Duxbury, Guy A. , Kwong, Herman , Wyrzykowska, Aneta , Difilippo, Luigi G.
IPC分类号： H05K1/11 , H05K3/46 , H01L23/498
CPC分类号： H05K1/115 , H05K1/0298 , H05K1/112 , H05K3/0005 , H05K3/429 , H05K3/4602 , H05K2201/09227 , H05K2201/09509 , H05K2201/09536 , H05K2201/09627 , H05K2201/10734 , Y10T29/49004 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165
摘要： A technique for reducing the number of layers in a multilayer signal routing device is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for reducing the number of layers in a multilayer signal routing device (10) having a plurality of electrically conductive signal path layers (16) for routing electrical signals to and from at least one electronic component mounted on a surface of the multilayer signal routing device (10). In such a case, the method comprises routing electrical signals on the plurality of electrically conductive signal path layers (16) in the multilayer signal routing device (10) for connection to and from a high density electrically conductive contact array package based at least in part upon at least one of an electrically conductive contact signal type characteristic and an electrically conductive contact signal direction characteristic.

8. 发明公开

EP1347674A2 Technique for reducing the number of layers in a multilayer circuit board 审中-公开
标题翻译：技术用于降低在多层电路板的层数
公开(公告)号：EP1347674A2
公开(公告)日：2003-09-24
申请号：EP03394028.9
申请日：2003-03-13
申请人： Nortel Networks Limited
发明人： Wyrzykowska, Aneta D. , Difilippo, Luigi G. , Kwong, Herman
IPC分类号： H05K1/11 , H05K3/46
CPC分类号： H05K1/115 , H05K1/0298 , H05K1/112 , H05K3/429 , H05K3/4602 , H05K2201/09227 , H05K2201/09509 , H05K2201/09536 , H05K2201/09627 , H05K2201/10734 , Y10T29/49155
摘要： A technique for reducing the number of layers in a multilayer circuit board is disclosed. The multilayer circuit board has a plurality of electrically conductive signal layers for routing electrical signals to and from at least one electronic component mounted on a surface of the multilayer circuit board. In one embodiment, the technique is realized by a method for reducing the number of layers in a multilayer circuit board, the multilayer circuit board having a plurality of electrically conductive signal layers for routing electrical signals to and from at least one electronic component mounted on a surface of the multilayer circuit board. The method comprises the steps of: forming a plurality of electrically conductive vias in the multilayer circuit board extending from the surface of the multilayer circuit board to at least one of the plurality of electrically conductive signal layers; arranging the surface such that a first set of two power/ground pins corresponds to first via and a second set of two power/ground pins corresponds to a second via positioned adjacent the first via, thereby creating a channel; and routing a first plurality of electrical signals through the channel on the first of the plurality of electrically conductive signal layers.
摘要翻译：一种用于减少在多层电路板的层数技术游离缺失盘。多层电路板（10）具有用于路由的电信号，并从安装在多层电路板（10）的一个表面上的至少一个电子元件的导电信号层上的多个（16）。该方法包括以下步骤：形成导电通孔的多层电路板从多层电路板（10）的表面（12）延伸的多个（20,26）（10）的所述多个所述至少一个导电信号层（16）; 布置（12）检测的表面并在第一组两个电源/接地管脚对应于第一通孔和第二组两个电源/接地管脚通过位于邻近通过，由此产生的表面上的信道（第一对应于第二（12）和每一个低于该包括在第一16A信号层的多元性（16）的导电信号的多个信道），并通过在第一（16a中的信道的路由电信号的第一多个）层层（16）。

9. 发明公开

EP1478215A3 Package modification for channel-routed circuit boards 审中-公开
标题翻译： PackalsmodifizierungfürKanalführungs-Leiterplatten
公开(公告)号：EP1478215A3
公开(公告)日：2006-02-08
申请号：EP04394023.8
申请日：2004-05-07
申请人： Nortel Networks Limited
发明人： Difilippo, Luigi , Wyrzykowska, Aneta , Kwong, Herman
IPC分类号： H05K3/30 , H05K3/46
CPC分类号： H05K1/112 , H01L2224/14 , H01L2224/17 , H01L2924/00014 , H05K3/303 , H05K3/4623 , H05K2201/09472 , H05K2201/09518 , H05K2201/09536 , H05K2201/10318 , H05K2201/10424 , H05K2201/10659 , H05K2201/10704 , H05K2201/10734 , Y02P70/613 , Y10T29/4913 , Y10T29/49135 , Y10T29/49139 , Y10T29/49147 , Y10T29/49165 , H01L2224/0401
摘要： A method for implementing a circuit component (160) on a surface of a multilayer circuit board (110) is provided. The circuit component includes a plurality of pins (162,164,166,168,170,172,174,176) and the circuit board (110) includes a plurality of electrically conductive vias (142,148,150,152,156) penetrating at least one layer of the circuit board (110) and being arranged so as to form at least one channel for routing one or more traces at one or more signal layers of the circuit board (110). The method comprises the step of forming at least one pin (162,168A,170A,172,176A) of the plurality of pins (162,164,166,168,170,172,174,176) of the circuit component (160) to have a length compatible with a depth of a corresponding via (142,148,150,152,156) of the circuit board (110).
摘要翻译：提供一种在多层电路板（110）的表面上实现电路部件（160）的方法。电路部件包括多个引脚（162,164,166,168,170,172,174,176），并且电路板（110）包括穿透电路板（110）的至少一个层的多个导电通孔（142,148,150,152,156），并布置成形成至少一个通道，用于在电路板（110）的一个或多个信号层处布线一个或多个迹线。该方法包括形成电路部件（160）的多个引脚（162,164,166,168,170,172,174,176）的至少一个引脚（162,168A，170A，172,176A）以使其长度与对应的通孔（142,148,150,152,156）的深度相兼容的步骤，的电路板（110）。

10. 发明公开

EP1515366A2 Techniques for pad arrangements on circuit chips 审中-公开
标题翻译： Anordnungstechniken vonAnschlüssenauf Schaltungschips
公开(公告)号：EP1515366A2
公开(公告)日：2005-03-16
申请号：EP04394053.5
申请日：2004-08-20
申请人： Nortel Networks Limited
发明人： Kwong, Herman , Soh, Kah Ming , Marcanti, Larry , Wyrzkowska, Aneta , Handforth, Martin
IPC分类号： H01L23/498 , H01L23/482
CPC分类号： H05K1/112 , H01L23/49816 , H01L23/49838 , H01L24/10 , H01L2224/05573 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H05K1/0298 , H05K1/115 , H05K3/0005 , H05K3/429 , H05K3/4602 , H05K2201/09227 , H05K2201/09236 , H05K2201/09263 , H05K2201/09509 , H05K2201/09536 , H05K2201/09627 , H05K2201/10674 , H05K2201/10734 , H01L2924/00 , H01L2224/05599
摘要： Techniques for improved contact mapping in circuit devices are disclosed. In one particular exemplary embodiment, a technique may be realized as a circuit device comprising a circuit chip having a plurality of electrical contacts positioned at a surface of the circuit chip so as to form one or more channels at the surface, the one or more channels being substantially devoid of electrical contacts such that one or more corresponding channels are formed in a chip carrier for routing electrically conductive traces from one or more of the plurality of electrical contacts on a routing layer of the chip carrier.
摘要翻译：公开了用于改进电路装置中接触映射的技术。在一个特定的示例性实施例中，可以实现一种技术，作为包括电路芯片的电路器件，该电路芯片具有位于电路芯片的表面处的多个电触头，以便在表面上形成一个或多个通道，一个或多个通道基本上没有电触点，使得一个或多个对应的通道形成在芯片载体中，用于从芯片载体的路由层上的多个电触点中的一个或多个电触点路由导电迹线。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式