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1. 发明公开

EP1135012A3 Method of manufacturing printed circuit board 有权
标题翻译：制造印刷电路板的方法
公开(公告)号：EP1135012A3
公开(公告)日：2003-09-17
申请号：EP01105897.1
申请日：2001-03-09
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Kawamoto, Eiji , Yamane, Shigeru , Takenaka, Toshiaki
IPC分类号： H05K3/40
CPC分类号： H05K3/4069 , H05K3/0032 , H05K2201/0355 , H05K2203/0191 , H05K2203/1461 , Y10T29/49117 , Y10T29/49155 , Y10T29/49156 , Y10T29/49163 , Y10T29/49165
摘要： A method of manufacturing a printed circuit board comprising the steps of: (a) disposing a first release film (2a) on the surface of a substrate (1) and a second release film (2b) on the back of the substrate (1), (b) forming a through-hole (3) in the first release film (2a), the second release film (2b), and the substrate (1), (c) filling conductive paste (4) into a through-hole (3), (d) removing the first release film (2a) and the second release film (2b) from the substrate (1) with the through-hole (3) filled with the conductive paste (4), (e) placing a first metallic member (5a) on the surface of the substrate (1) with the release films removed and placing a second metallic member (5b) on the back of the substrate (1); (f) compressing under heat the substrate (1) with the first metallic member (5a) and the second metallic member (5b) disposed thereon, and (g) forming a desired circuit pattern (6a,6b) on the first metallic member (5a) and the second metallic member (5b). The thickness of the first release film (2a) is greater than the thickness of the second release film (2b), and when the first release film (2a) is peeled, a first projected paste portion (4a) is formed projecting from the surface of the substrate (1) having the through-hole (3), and a second projected paste portion (4b) is formed projecting from the back of the substrate (1) having the through-hole (3). Each of the metallic members (5a,5b) is connected to the projected paste portions (4a,4b).
摘要翻译：一种制造印刷电路板的方法，包括以下步骤：（a）在衬底（1）的背面上的衬底（1）和第二离型膜（2b）的表面上设置第一离型膜（2a），（b）在第一离型膜（2a），第二离型膜（2b）和基板（1）中形成通孔（3），（c）将导电膏（4）填充到通孔（3），（d）用填充有导电糊（4）的通孔（3）从基板（1）上除去第一离型膜（2a）和第二离型膜（2b），（e）（1）表面上的第一金属构件（5a），去除释放膜并将第二金属构件（5b）放置在基底（1）的背面上; （f）在其上设置有第一金属构件（5a）和第二金属构件（5b）的情况下对基板（1）进行加热压缩，以及（g）在第一金属构件上形成期望的电路图案（6a，6b） 5a）和第二金属构件（5b）。第一离型膜（2a）的厚度大于第二离型膜（2b）的厚度，并且当第一离型膜（2a）被剥离时，形成第一突出膏部分（4a），其从表面（3）的基板（1）的背面突出形成第二凸部（4b），该第二凸部（4b）从具有通孔（3）的基板（1）的背面突出。每个金属构件（5a，5b）连接到凸出的膏体部分（4a，4b）。

2. 发明授权

EP1780034B1 Printing plate, printing board, and printing method for printed board 有权
标题翻译：印刷板，电路板和印刷方法的印刷电路板
公开(公告)号：EP1780034B1
公开(公告)日：2008-09-10
申请号：EP07000982.4
申请日：2003-09-19
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Takenaka, Toshiaki , Nishi, Toshihiro , Komoda, Hideaki , Kondo, Toshikazu , Nakamura, Shinji
IPC分类号： B41N1/24 , B41M1/12 , B41F15/34 , H05K1/11 , H05K3/12
CPC分类号： H05K3/1225 , B41F15/36 , B41F35/003 , B41M1/12 , B41N1/24 , B41N1/248 , H05K3/0052 , H05K3/4053 , H05K3/4069 , H05K2201/09063 , H05K2201/09709 , H05K2203/0191

3. 发明公开

EP1054582A3 Mask film, its manufacturing method, and manufacturing method of circuit board using the same 有权
标题翻译：掩模膜，其生产方法，和用于生产使用相同的电路板
公开(公告)号：EP1054582A3
公开(公告)日：2005-09-07
申请号：EP00110617.8
申请日：2000-05-18
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Takenaka, Toshiaki , Kondo, Toshikazu , Kishimoto, Kunio , Nakamura, Shinji , Echigo, Fumio
IPC分类号： H05K3/40
CPC分类号： H05K3/4069 , H05K2201/0355 , H05K2203/0191 , H05K2203/0522 , H05K2203/1461 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155
摘要： The manufacturing method of circuit board of the invention includes the steps of (a) forming a mask film (10), in which the mask film comprises a base material (1), a parting layer (2) and a non-parting portion (3) placed on the base material (1), (b) adhering the mask film (10a,10b) to both sides of a prepreg sheet (21), in which the parting layer (2) and non-parting portion (3) are adhered to the prepreg sheet (21), (c) forming a penetration hole (23) in specified positions of the prepreg sheet (21) having the mask film (10a,10b), (d) filling the penetration holes (23) with conductive paste (24) from the mask film side, using the mask film (10a,10b) as the mask, (e) parting the mask film (10a,10b) from the prepreg sheet (21), (f) overlaying metal foils (25a,25b) on both sides of the prepreg sheet (21), (g) heating and pressing the prepreg sheet (21) having the metal foils (25a,25b), and adhering the prepreg sheet (21) and metal foils (25a,25b) mutually, so that the metal foils (25a,25b) placed at both sides are connected electrically with each other through the conductive paste (24) filling up the penetration hole, and (h) etching the metal foils (25a,25b) selectively to form circuit patterns (26a,26b).

4. 发明公开

EP1109429A2 A method of manufacturing a circuit board and its manufacturing apparatus 有权
标题翻译：用于制造电路板装置的方法，及为此
公开(公告)号：EP1109429A2
公开(公告)日：2001-06-20
申请号：EP00126465.4
申请日：2000-12-07
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Kishimoto, Kunio , Nishii, Toshihiro , Takenaka, Toshiaki , Nakamura, Shinji , Miura, Akihiro
IPC分类号： H05K3/40 , H05K3/00
CPC分类号： H05K3/4069 , H05K3/0032 , H05K3/0055 , H05K3/0088 , H05K2201/0355 , H05K2203/0191 , H05K2203/0257 , H05K2203/0285 , H05K2203/0786 , H05K2203/081 , H05K2203/1461 , Y10S134/902 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167 , Y10T428/13
摘要： It is possible to obtain a clean high-quality circuit board by removing affected material and foreign matter produced when a hole is formed. A manufacturing method of the circuit board includes (a) preparing a film-coated board material by bonding a film material as a mask to a board material, (b) forming a hole in the film-coated board material by applying a laser beam thereto, and (c) selectively removing the unnecessary material sticking to the film-coated board material from the film-coated board material by supersonic cleaning without peeling the film material off the board material. Unnecessary material such as foreign matter is produced when the hole is formed, and the unnecessary material sticks to the board material. After removal of such unnecessary material, a conductive material is disposed in the hole, using the film material as a mask, and the film material is later removed from the board material.

5. 发明授权

EP1054582B1 Mask film, its manufacturing method, and manufacturing method of circuit board using the same 有权
标题翻译：掩模膜，其生产方法，和用于生产使用相同的电路板
公开(公告)号：EP1054582B1
公开(公告)日：2006-09-27
申请号：EP00110617.8
申请日：2000-05-18
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Takenaka, Toshiaki , Kondo, Toshikazu , Kishimoto, Kunio , Nakamura, Shinji , Echigo, Fumio
IPC分类号： H05K3/40
CPC分类号： H05K3/4069 , H05K2201/0355 , H05K2203/0191 , H05K2203/0522 , H05K2203/1461 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155

6. 发明公开

EP1109429A3 A method of manufacturing a circuit board and its manufacturing apparatus 有权
标题翻译： Verfahren zur Herstellung einer Leiterplatte und Vorrichtungdafür
公开(公告)号：EP1109429A3
公开(公告)日：2003-09-17
申请号：EP00126465.4
申请日：2000-12-07
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Kishimoto, Kunio , Nishii, Toshihiro , Takenaka, Toshiaki , Nakamura, Shinji , Miura, Akihiro
IPC分类号： H05K3/40 , H05K3/00
CPC分类号： H05K3/4069 , H05K3/0032 , H05K3/0055 , H05K3/0088 , H05K2201/0355 , H05K2203/0191 , H05K2203/0257 , H05K2203/0285 , H05K2203/0786 , H05K2203/081 , H05K2203/1461 , Y10S134/902 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167 , Y10T428/13
摘要： It is possible to obtain a clean high-quality circuit board by removing affected material and foreign matter produced when a hole is formed. A manufacturing method of the circuit board includes (a) preparing a film-coated board material (51) by bonding a film material (4a,4b) as a mask to a board material (1), (b) forming a hole (10) in the film-coated board material (51) by applying a laser beam (9) thereto, and (c) selectively removing the unnecessary material (11,12) sticking to the film-coated board material (51) from the film-coated board material (51) by supersonic cleaning without peeling the film material (4a,4b) off the board material. After removal of such unnecessary material, a conductive material (14) is disposed in the hole (10), using the film material (4a,4b) as a mask, and the film material (4a,4b) is later removed from the board material (1).
摘要翻译：通过去除受影响的材料和形成孔时产生的异物，可以获得清洁的高质量电路板。电路板的制造方法包括：（a）通过将作为掩模的膜材料（4a，4b）粘合到基板材料（1）上来制备薄膜包覆板材料（51），（b）形成孔（10））通过在其上施加激光束（9）而在薄膜包覆板材料（51）中，以及（c）从薄膜包覆板材料（51）上选择性地去除粘附到薄膜基板材料（51）上的不需要的材料（11,12）通过超声波清洗而不将膜材料（4a，4b）从基板材料剥离。在去除这种不必要的材料之后，使用膜材料（4a，4b）作为掩模将导电材料（14）设置在孔（10）中，然后将膜材料（4a，4b）从板上去除材料（1）。

7. 发明公开

EP1180920A2 Circuit board and method of manufacturing same 有权
标题翻译：电路板及其制造方法
公开(公告)号：EP1180920A2
公开(公告)日：2002-02-20
申请号：EP01119121.0
申请日：2001-08-08
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Takenaka, Toshiaki , Nishii, Toshihiro , Yamane, Shigeru , Nakamura, Shinji , Komoda, Hideaki , Kishimoto, Kunio
IPC分类号： H05K3/40 , H05K3/46
CPC分类号： H05K3/462 , H05K1/0268 , H05K3/386 , H05K3/4069 , H05K3/4652 , H05K2201/0195 , H05K2201/0355 , H05K2201/10378 , H05K2203/0191 , H05K2203/066 , H05K2203/1461 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： A circuit board having stable connection resistance can be obtained. The multi-layer circuit board includes the steps of making through-holes in a incompressible substrate having films on either side thereof via a bonding layer; filling conductive paste into the through-holes; removing the films from the substrate; laminating metallic foils to either side of the substrate and heating same under pressures to harden the bonding layer, bonding the metallic foils to the substrate and electrically connecting the sides of the substrate to each other; and forming a circuit pattern by machining the metallic foils.
摘要翻译：可以获得具有稳定连接电阻的电路板。多层电路板包括以下步骤：通过粘合层在具有在其任一侧上的膜的不可压缩基板中形成通孔; 将导电膏填充到通孔中; 从基底上去除膜; 将金属箔层压到衬底的任一侧并在压力下对其加热以硬化结合层，将金属箔结合到衬底并将衬底的侧面彼此电连接; 并通过机械加工金属箔形成电路图案。

8. 发明公开

EP1780034A1 Printing plate, printing board, and printing method for printed board 有权
标题翻译： Druckplatte，Leiterplatte und Druckverfahrenfüreine Leiterplatte
公开(公告)号：EP1780034A1
公开(公告)日：2007-05-02
申请号：EP07000982.4
申请日：2003-09-19
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Takenaka, Toshiaki , Nishi, Toshihiro , Komoda, Hideaki , Kondo, Toshikazu , Nakamura, Shinji
IPC分类号： B41N1/24 , B41M1/12 , B41F15/34 , H05K1/11 , H05K3/12
CPC分类号： H05K3/1225 , B41F15/36 , B41F35/003 , B41M1/12 , B41N1/24 , B41N1/248 , H05K3/0052 , H05K3/4053 , H05K3/4069 , H05K2201/09063 , H05K2201/09709 , H05K2203/0191
摘要： The present invention aims to provide a printing plate capable of preventing paste of high viscosity adhering to an edge of a squeegee from being transferred to and left on a through hole of a printed circuit board when the paste is being filled by a squeegeeing method. The printing plate has a metal sheet (3) provided with a squeegee cleaning section (7) formed thereon and fixed to the back surface of a slanting area (5) of mask (2) attached to a plate framework (1). The through hole of the printed circuit board is filled with paste only after paste of high viscosity adhering to the edge of the squeegee is removed by the squeegee cleaning section (7), to prevent the paste from being left on the through hole, and thereby achieving the printed circuit board of excellent quality.
摘要翻译：本发明的目的在于提供一种印刷板，其能够防止粘贴在刮板的边缘上的高粘度浆料通过刮板方法被填充而转移到印刷电路板的通孔上并留在印刷电路板的通孔上。印版具有设置有形成在其上的刮板清洁部（7）的金属片（3），并固定在安装在板框架（1）上的掩模（2）的倾斜区域（5）的背面。印刷电路板的通孔只有在通过刮板清洁部分（7）除去粘附到刮板的边缘的高粘度的浆料之后才能填充糊料，以防止糊料留在通孔上，从而实现印刷电路板质量优良。

9. 发明公开

EP1180921A2 Multi-layer circuit board and method of manufacturing the same 审中-公开
标题翻译：一种多层印刷电路板和它们的制备方法
公开(公告)号：EP1180921A2
公开(公告)日：2002-02-20
申请号：EP01117144.4
申请日：2001-07-13
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Takenaka, Toshiaki , Nishii, Toshihiro , Yamane, Shigeru , Nakamura, Shinji , Komoda, Hideaki , Kishimoto, Kunio
IPC分类号： H05K3/46
CPC分类号： H05K3/4614 , H05K3/4069 , H05K3/4652 , H05K2201/0195 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , Y10T29/49126 , Y10T29/49155
摘要： An inner layer circuit board with a convex inner layer circuit pattern having a predetermined thickness, a prepreg sheet having conductive material disposed in a plurality of through-holes and metallic foil are laminated to a substrate, and the laminated board is heated under pressures. After that, a laminated circuit pattern is formed by machining the metallic foil. In such multi-layer circuit board, a smoothing layer is disposed on a concave portion where no inner layer circuit pattern of the inner layer circuit board is formed. In this way, the conductive materials disposed in a plurality of through-holes are uniformly compressed. As a result, the connection resistance between the inner circuit pattern and the laminated circuit pattern becomes stabilized.

10. 发明公开

EP1180921A3 Multi-layer circuit board and method of manufacturing the same 审中-公开
标题翻译： Mehrschichtige Leiterplatte und Verfahren zu deren Herstellung
公开(公告)号：EP1180921A3
公开(公告)日：2005-12-07
申请号：EP01117144.4
申请日：2001-07-13
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Takenaka, Toshiaki , Nishii, Toshihiro , Yamane, Shigeru , Nakamura, Shinji , Komoda, Hideaki , Kishimoto, Kunio
IPC分类号： H05K3/46
CPC分类号： H05K3/4614 , H05K3/4069 , H05K3/4652 , H05K2201/0195 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , Y10T29/49126 , Y10T29/49155
摘要： An inner layer circuit board (20) with a convex inner layer circuit pattern having a predetermined thickness, a prepreg sheet (10a,10b) having conductive material (4) disposed in a plurality of through-holes and metallic foil (8a,8b) are laminated and the laminated board is heated under pressures. After that, a laminated circuit pattern (9a,9b) is formed by machining the metallic foil (8a,8b). In such multi-layer circuit board (30), a smoothing layer (7) is disposed on a concave portion where no inner layer circuit pattern (6a,6b) of the inner layer circuit board (20) is formed. In this way, the conductive materials (4) disposed in a plurality of through-holes are uniformly compressed. As a result, the connection resistance between the inner circuit pattern (6) and the laminated circuit pattern (9) becomes stabilized.
摘要翻译：具有预定厚度的凸形内层电路图案的内层电路板（20），具有设置在多个通孔中的导电材料（4）的预浸料片（10a，10b）和金属箔（8a，8b）层压，层压板在压力下加热。之后，通过加工金属箔（8a，8b）形成层压电路图案（9a，9b）。在这种多层电路板（30）中，在不形成内层电路板（20）的内层电路图案（6a，6b）的凹部上设置平滑层（7）。以这种方式，布置在多个通孔中的导电材料（4）被均匀地压缩。结果，内部电路图案（6）和层压电路图案（9）之间的连接电阻变得稳定。

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