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    • 9. 发明公开
    • SELF-ALIGNED COVERAGE OF OPAQUE CONDUCTIVE AREAS
    • SELBSTAUSRICHTENDE ABDECKUNGFÜROPAKELEITFÄHIGEBEREICHE
    • EP2609641A1
    • 2013-07-03
    • EP11749931.9
    • 2011-07-29
    • Koninklijke Philips Electronics N.V.Philips Intellectual Property & Standards GmbH
    • HARTMANN, SörenRICKERS, ChristophBOERNER, Herbert, FriedrichLIFKA, HerbertSCHWAB, Holger
    • H01L51/52
    • H01L21/707H01L51/00H01L51/5212
    • The invention relates to a method enabling to apply cheap manufacturing techniques for producing reliable and robust organic thin film device (EL) comprising the steps of providing (P) a transparent substrate (1) at least partly covered with a first layer stack comprising at least one transparent layer (2), preferably an electrically conductive layer, and a pattern of first and second opaque conductive areas (31, 32) deposited on top of the transparent layer (2), depositing (D) a photoresist layer (4) made of an electrically insulating photoresist resist material on top of the first layer stack at least fully covering the second opaque conductive areas (32), illuminating (IL) the photoresist layer (4) through the transparent substrate (1) with light (5) of a suitable wavelength to make the photoresist material soluble in the areas (43) of the photoresist layer (4) having no opaque conductive areas (31, 32) underneath, removing (R) the soluble areas (43) of the photoresist layer (4), heating (B) the areas (42) of the photoresist layer (4) remaining on top of at least the second opaque conductive areas (32) to re-flow the photoresist layer (4) to cover the edges (E) of the second opaque conductive areas (32) in contact to the transparent layer (2), and hardening (H) the remaining areas (42) of the photoresist layer (4). The invention further relates to a conductive component (CC) for use in these organic thin film devices (EL) and to the organic thin film devices (EL) itself.
    • 本发明涉及一种能够应用便宜的制造技术来制造可靠和有力的有机薄膜器件(EL)的方法,该方法包括以下步骤:提供(P)至少部分被第一层堆叠覆盖的透明衬底(1) 一个透明层(2),优选导电层,以及沉积在透明层(2)的顶部上的第一和第二不透明导电区域(31,32)的图案,沉积(D)制成的光致抗蚀剂层(4) 至少完全覆盖所述第二不透明导电区域(32)的第一层堆叠顶部上的电绝缘光致抗蚀剂材料,通过所述透明基板(1)照射(IL)所述光致抗蚀剂层(4),所述光(5) 使光致抗蚀剂材料溶解在下面没有不透明导电区域(31,32)的光致抗蚀剂层(4)的区域(43)中的合适波长,去除光致抗蚀剂层(4)的可溶性区域(43) ),他 (B)至少第二不透明导电区域(32)的顶部上的光致抗蚀剂层(4)的区域(42),以重新流过光致抗蚀剂层(4)以覆盖第二不透明导电区域(32)的边缘(E) 与透明层(2)接触的不透明导电区域(32),以及硬化(H)光刻胶层(4)的剩余区域(42)。 本发明还涉及用于这些有机薄膜器件(EL)和有机薄膜器件(EL)本身的导电元件(CC)。