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    • 2. 发明公开
    • Semiconductor element, and method of forming silicon-based film
    • Halbleiterbauelement und Herstellungsverfahrenfüreinen ium焓薄膜
    • EP1241711A2
    • 2002-09-18
    • EP02005536.4
    • 2002-03-11
    • CANON KABUSHIKI KAISHA
    • Kondo, TakaharuOkabe, ShotaroSano, MasafumiSakai, AkiraHayashi, Ryo.Sugiyama, Suichiro
    • H01L31/0368H01L31/075H01L31/18
    • H01L29/66765H01L29/045H01L29/78618H01L29/78678H01L29/78696H01L31/03685H01L31/075H01L31/182Y02E10/545Y02E10/546Y02E10/548Y02P70/521Y10T428/261
    • The present invention provides a semiconductor element comprising a semiconductor junction composed of silicon-based films, the element being characterized in that at least one of the silicon-based films contains a microcrystal, and microcrystal located in at least one interface region of the silicon-based films containing the microcrystal has no orientation property. Further, the present invention provides a semiconductor element comprising a semiconductor junction composed of silicon-based films, wherein at least one of the silicon-based films contains a microcrystal, and the orientation property of the microcrystal in the silicon-based film containing the microcrystal changes in a film thickness direction of the silicon-based film containing the microcrystal. In order to provide an inexpensive silicon-based film showing excellent performance, the present invention provides a silicon-based film having a shortened tact time, an increased film forming rate, and excellent characteristics, and a semiconductor element including this silicon-based film, and a semiconductor element using this silicon-based film and having excellent adhesion and environmental resistance.
    • 本发明提供了一种半导体元件,其包括由硅基膜构成的半导体结,该元件的特征在于,至少一个硅基膜含有微晶体,微晶体位于硅基膜的至少一个界面区域中, 含有微晶的基膜不具有取向性。 此外,本发明提供了一种半导体元件,其包括由硅基膜构成的半导体结,其中至少一个硅基膜含有微晶,并且微晶体在含有微晶体的硅基膜中的取向性能 包含微晶的硅基膜的膜厚度方向的变化。 为了提供一种表现出优异性能的廉价的硅基膜,本发明提供了一种具有缩短的制作时间,提高的成膜速度和优异特性的硅基膜,以及包括该硅基膜的半导体元件, 以及使用该硅系膜的半导体元件,具有优异的粘附性和耐环境性。