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    • 4. 发明公开
    • LED LIGHTING APPARATUS
    • LED照明设备
    • EP3101337A1
    • 2016-12-07
    • EP14880324.0
    • 2014-04-23
    • Shanghai Sansi Electronic Engineering Co., LtdShanghai Sansi Science and Technology Development Co., LtdJiashan Sansi Photoelectric Technology Co., Ltd
    • CHEN, BishouXU, LiWANG, PengLI, Sheng
    • F21V29/00F21V3/02F21V23/00
    • F21V29/74F21K9/232F21K9/235F21K9/238F21V3/02F21V3/06F21V19/003F21V29/506F21V29/83F21Y2115/10H05K1/00
    • An LED lighting device includes a base (1), an LED light-emitting unit (2) and a lamp shade (3), wherein the LED light-emitting unit (2) and the lamp shade (3) are arranged on the base (1); the lamp shade (3) is a solid component made of a thermally-conductive material; the lamp shade (3) covers the LED light-emitting unit (2); and the inner surface of the lamp shade (3) has a light distribution surface (31) and a thermally-conductive surface (32). The LED lighting device employs a solid material having better thermal conductivity as the lamp shade (3), therefore, heat generated by the LED light-emitting unit not only can be dissipated via the base (1), but also can be transferred outwards via the lamp shade (3), thus allowing the entire device to dissipate heat in all directions, improving the heat dissipation performance of the device, and prolonging the service life of the device; due to the improvement of the heat dissipation performance, the lighting device of higher power can be manufactured without increasing the size of the device, and the lighting brightness of the device is improved, while the use range and flexibility of the LED lighting device are improved in life and industrial use.
    • 一种LED照明装置,包括底座(1),LED发光单元(2)和灯罩(3),LED发光单元(2)和灯罩(3)设置在底座 (1); 灯罩(3)是由导热材料制成的固体部件; 灯罩(3)覆盖LED发光单元(2); 并且灯罩(3)的内表面具有配光表面(31)和导热表面(32)。 该LED照明装置采用导热性较好的固体材料作为灯罩(3),因此LED发光单元产生的热量不仅可以通过底座(1)散发,还可以通过底座 灯罩(3),使整个装置散热全方位,提高了装置的散热性能,延长了装置的使用寿命; 由于散热性能的提高,可以在不增加装置尺寸的情况下制造更高功率的照明装置,并且提高装置的照明亮度,同时提高LED照明装置的使用范围和灵活性 在生活和工业中使用。
    • 9. 发明公开
    • NOVEL LED LIGHTING APPARATUS
    • 新颖的LED照明设备
    • EP3101332A1
    • 2016-12-07
    • EP14880067.5
    • 2014-04-23
    • Shanghai Sansi Electronic Engineering Co., LtdShanghai Sansi Science and Technology Development Co., LtdJiashan Sansi Photoelectric Technology Co., Ltd
    • CHEN, BishouXU, LiPAN, HuiCUI, Jiaguo
    • F21K9/232F21V3/04F21V29/506F21V29/85F21Y115/10
    • F21V29/83F21K9/232F21V3/06F21V23/023F21V29/506F21V29/86F21Y2115/10
    • An LED lighting device includes a base, light-emitting chips, a circuit coating and a lamp shade, wherein the base has a hollow structure; the circuit coating is directly coated on the upper surface of the base; the light-emitting chips are directly adhered to the base, and connected with each other through the circuit coating; the lamp shade is arranged on the base and covers the light-emitting chips and the circuit coating. The inner surface of the lamp shade includes a light distribution surface and a thermally-conductive surface, wherein the thermally-conductive surface is at least located at a central region and an edge region of the inner surface. The LED lighting device employs a solid material having better thermal conductivity as the lamp shade, and simultaneously employs a hollow base and cooling holes; therefore, heat generated by the chips can be transferred outwards via the base and the lamp shade, and then taken away by air flowing through the hollow structure and the through holes, thus allowing the entire device to dissipate heat in all directions, improving the heat dissipation performance of the device.
    • 一种LED照明装置,包括基座,发光芯片,电路涂层和灯罩,所述基座具有中空结构, 电路涂层直接涂覆在基座的上表面上; 发光芯片直接粘附在基体上,并通过电路涂层相互连接; 灯罩设置在基座上并覆盖发光芯片和电路涂层。 灯罩的内表面包括配光表面和导热表面,其中导热表面至少位于内表面的中心区域和边缘区域。 该LED照明装置采用导热性较好的固体材料作为灯罩,同时采用中空底座和散热孔, 因此,芯片产生的热量可以通过底座和灯罩向外传递,然后通过空气流过中空结构和通孔而被带走,从而允许整个装置在各个方向散热,从而提高热量 设备的散热性能。