专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5978222A Semiconductor device and assembly board having through-holes filled with filling core 失效
公开(公告)号：US5978222A
公开(公告)日：1999-11-02
申请号：US924958
申请日：1997-09-08
申请人： Makoto Iijima , Tetsushi Wakabayashi , Toshio Hamano , Masaharu Minamizawa , Masashi Takenaka , Taturou Yamashita , Masataka Mizukoshi
发明人： Makoto Iijima , Tetsushi Wakabayashi , Toshio Hamano , Masaharu Minamizawa , Masashi Takenaka , Taturou Yamashita , Masataka Mizukoshi
IPC分类号： H01L23/12 , H01L21/48 , H01L21/60 , H01L23/10 , H01L23/14 , H01L23/24 , H01L23/31 , H01L23/498 , H01L25/065 , H01L25/18 , H05K3/46 , H05T7/20
CPC分类号： H01L24/81 , H01L21/486 , H01L23/10 , H01L23/142 , H01L23/24 , H01L23/3121 , H01L23/3128 , H01L23/3135 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L23/49838 , H01L25/0655 , H01L25/0657 , H01L25/18 , H05K3/4602 , H01L2224/13147 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/81801 , H01L2225/0651 , H01L2225/06513 , H01L2225/06541 , H01L2225/06582 , H01L2225/06586 , H01L2225/06589 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/16151 , H01L2924/16152 , H01L2924/16195 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H05K2201/0959 , H05K2201/09672
摘要： A semiconductor device includes a board base having through-holes filled with a filling core, an additive layer provided on an upper surface of the board base as well as an upper surface of the filling core wherein the additive layer includes a wiring pattern having one or more paths, a semiconductor chip fixed on an upper surface of the additive layer, and nodes provided on a lower surface of the board base, wherein the one or more paths are laid out without a restriction posed by the through-holes, and are used for electrically connecting the semiconductor chip and the nodes.

2. 发明授权

US5930117A Heat sink structure comprising a microarray of thermal metal heat channels or vias in a polymeric or film layer 失效
标题翻译：散热结构包括聚合物或薄膜层中的热金属热通道或通孔的微阵列
公开(公告)号：US5930117A
公开(公告)日：1999-07-27
申请号：US646522
申请日：1996-05-07
申请人： Glenn W. Gengel
发明人： Glenn W. Gengel
IPC分类号： H01L23/367 , H05T7/20
CPC分类号： H01L23/3677 , H01L2924/0002 , Y10S428/901
摘要： A printed circuit, chip carrier or other substrate for an electronic power circuit can comprise a heat transfer device engineered to dissipate heat generated from the electrical operation of the circuit. The heat transfer characteristic or heat sink capacity of the device results from formation in a polymer film of an array of cylindrical metallic portions in the film that draw heat from the circuit package. We have found that by forming such an array of metallic cylinders wherein each cylinder has a diameter less than about 25 .mu.m, the array defined by a distance on center of about 50-125 .mu.m has a substantial heat transfer characteristic. We have found that when the polymer film has the array of metallic cylinders within the film to a degree that at least about 8%, preferably 10-15% of the surface area of the film is occupied by the metallic cylinder, that the heat transfer characteristics of the film is virtually identical to copper metal. The surprisingly high heat transfer characteristics of the film is surprising and unusual when considering the heat transfer characteristics of the polymeric material surrounding the relatively small proportion of metal. The metallic cylinders are the preferred structure of the metallic portions in the film, however, such cylinders can have some variation of the cylinder structure. Further, any regular array of the cylinders in the film can be used.
摘要翻译：用于电子电源电路的印刷电路，芯片载体或其它基底可以包括设计用于散发由电路的电气操作产生的热量的传热装置。该装置的传热特性或散热能力由膜中的圆柱形金属部分阵列的聚合物膜中形成，从而从电路封装中吸取热量。我们已经发现，通过形成这样的金属圆筒阵列，其中每个圆柱体的直径小于约25μm，由中心距离约为50-125μm限定的阵列具有显着的传热特性。我们已经发现，当聚合物膜在膜内具有金属圆柱体阵列的程度至少大约8％，优选10-15％的薄膜的表面积被金属圆筒占据时，传热膜的特性与铜金属几乎相同。考虑到围绕相对较小比例金属的聚合材料的传热特性，膜的出人意料的高的传热特性是惊人的和不寻常的。金属圆筒是薄膜中金属部分的优选结构，然而，这种圆柱体可以具有气缸结构的一些变化。此外，可以使用膜中的任何规则的圆筒阵列。

3. 发明授权

US5412536A Local condensation control for liquid impingement two-phase cooling 失效
标题翻译：局部冷凝控制液体冲击两相冷却
公开(公告)号：US5412536A
公开(公告)日：1995-05-02
申请号：US218534
申请日：1994-03-28
申请人： Timothy M. Anderson , Gregory M. Chrysler , Richard C. Chu , Robert E. Simons
发明人： Timothy M. Anderson , Gregory M. Chrysler , Richard C. Chu , Robert E. Simons
IPC分类号： H01L23/427 , H05K7/20 , H05T7/20
CPC分类号： H01L23/427 , H01L2224/16225 , Y10S165/908
摘要： Cooling module geometry provides a method for controlling local condensation for liquid impingement two-phase cooling of electrical and/or electronic circuit chips. The method and apparatus described herein uses vapor condensation in the exhaust flow from each chip site within a multi-chip module which utilizes direct liquid impingement with phase change.
摘要翻译：冷却模块几何形状提供了一种用于控制电气和/或电子电路芯片的液体冲击两相冷却的局部冷凝的方法。本文描述的方法和装置在多芯片模块中的每个芯片位置的排气流中使用蒸汽冷凝，其利用具有相变的直接液体冲击。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式