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1. 发明申请

US20020189850A1 Resin-molded board 审中-公开
标题翻译：树脂模板
公开(公告)号：US20020189850A1
公开(公告)日：2002-12-19
申请号：US10162584
申请日：2002-06-06
申请人： Canon Kabushiki Kaisha
发明人： Yukio Yokoyama , Keisuke Someya
IPC分类号： H05K001/05
CPC分类号： H05K3/3447 , H05K1/0212 , H05K3/202 , H05K3/28 , H05K3/3468 , H05K2201/0394 , H05K2201/09063 , H05K2201/09118 , H05K2201/09781
摘要： There is provided a resin-molded board that enables soldering of electronic components to the metal frame of the resin-molded board to be carried out well, with no increase in production cost. A metal frame is comprised of a plurality of frame parts that form an electric circuit pattern, and a resin layer is molded onto the metal frame. The resin layer has provided in a surface thereof first openings for soldering electronic components onto the metal frame, each of the first openings having exposed therein a corresponding one of the frame parts, and second openings associated with the first openings, respectively, for maintaining a temperature at the first openings at not less than a predetermined temperature when soldering the electronic components onto the metal frame in the first openings using a flow soldering method.
摘要翻译：提供了一种树脂模制板，其能够将电子部件焊接到树脂模制板的金属框架上，并且不会增加生产成本。金属框架由形成电路图案的多个框架部件构成，并且树脂层被模制到金属框架上。树脂层在其表面上设置有用于将电子部件焊接到金属框架上的第一开口，每个第一开口分别暴露有相应的一个框架部件和与第一开口相关联的第二开口，用于保持使用流动焊接方法将电子部件焊接到第一开口中的金属框架上时，在不小于预定温度的第一开口处的温度。

2. 发明申请

US20040188134A1 Method for preparing copper foil with insulating layer and cooper foil with insulating layer prepared by the method, and printed wiring board using the cooper foil with insulating layer 有权
标题翻译：通过该方法制备具有绝缘层的铜箔和具有绝缘层的铜箔的方法，以及使用具有绝缘层的铜箔的印刷线路板
公开(公告)号：US20040188134A1
公开(公告)日：2004-09-30
申请号：US10250649
申请日：2003-07-07
发明人： Tetsuro Sato , Noriyuki Nagashima
IPC分类号： H05K001/05 , B32B015/04 , B32B031/06 , B32B031/12
CPC分类号： H05K3/4655 , H05K1/0366 , H05K3/384 , H05K3/4652 , H05K2201/0195 , H05K2201/0358 , H05K2203/0307 , Y10T428/31678 , Y10T428/31681
摘要： To provide a method of manufacturing a material which can make a skeletal component as thin as possible to be contained in an insulating layer in a manufactured copper clad laminate and can securely prevent the direct contact between the nodular treatment surface of the attached copper foil and a skeletal component. In order to attain the object, here is adopted nulla method of manufacturing a copper foil with an insulating layer 1 which method is a method of manufacturing a copper foil provided with a semi-cured insulating resin layer containing a skeletal component on one side surface of the copper foil, and is characterized in that: a first thermosetting resin layer 3 in an uncured or semi-cured state is provided on one side surface of a copper foil 2; a nonwoven fabric 5 or a woven cloth 5 to be a skeletal component is press-bonded onto a first thermosetting resin layer 3; a second thermosetting resin layer 7 is formed on a surface of a press-bonded nonwoven fabric 5 or woven cloth 5; and a semi-cured insulating layer containing the nonwoven fabric 5 or the woven cloth 5 is formed on one side surface of the copper foil 2 by drying into a semi-cured state.null
摘要翻译：为了提供一种能够使制造的覆铜层压板的绝缘层中含有尽可能薄的骨架成分的材料的制造方法，能够可靠地防止附着的铜箔的结节处理面与骨骼成分。为了达到此目的，这里采用“一种具有绝缘层1的铜箔的制造方法”，该方法是在一个侧面上设置有含有骨架成分的半固化绝缘树脂层的铜箔的制造方法的特征在于：在铜箔2的一个侧面上设置有未固化或半固化状态的第一热固性树脂层3，作为骨架的无纺布5或编织布5 将组分压合在第一热固性树脂层3上;第二热固性树脂层7形成在压合无纺布5或织布5的表面上;以及半固化绝缘层，其包含无纺织物5或通过干燥成半固化状态，在铜箔2的一个侧面上形成编织布5。

3. 发明申请

US20040182601A1 Substrate for circuit wiring 有权
标题翻译：电路布线基板
公开(公告)号：US20040182601A1
公开(公告)日：2004-09-23
申请号：US10723349
申请日：2003-11-25
发明人： Hiromichi Watanabe , Yoshifumi Fukatsu , Hideaki Kaino
IPC分类号： H05K001/03 , H05K001/05
CPC分类号： H05K3/284 , H01L23/49894 , H01L2924/0002 , H05K1/056 , H05K2201/0209 , H05K2201/0212 , H01L2924/00
摘要： The present invention concerns a substrate for circuit wiring in which an electronic component is mounted, by soldering, to a wiring pattern formed on an insulated layer deposited over a metallic substrate. A silica-based filler and a rubber-based filler are added in the insulated layer to reduce the linear thermal expansion of the layer and increase its elastic modulus. The mounting portion of an electronic component is molded with a resin material to which a silica-based filler has been added, and which thus has a coefficient of linear thermal expansion smaller than the coefficient of linear thermal expansion of the insulated layer. This serves to alleviate the stress caused by the linear thermal expansion of the metallic substrate, and thereby to prevent separation from occurring between the insulated layer and the metallic substrate, as well as between the insulated layer and the wiring pattern, when subjected to a high-temperature environment.
摘要翻译：本发明涉及一种用于电路布线的基板，其中通过焊接将电子部件安装到沉积在金属基板上的绝缘层上形成的布线图案。在绝缘层中添加二氧化硅系填料和橡胶类填料，以减少层的线性热膨胀并提高其弹性模量。电子部件的安装部分用添加有二氧化硅基填料的树脂材料模制，因此具有比绝热层的线性热膨胀系数小的线性热膨胀系数。这用于减轻金属基板的线性热膨胀引起的应力，从而防止在绝缘层和金属基板之间以及绝缘层和布线图案之间发生分离时，当受到高温度环境。

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