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    • 1. 发明授权
    • Light emitting apparatus and method for mounting light emitting device
    • 发光装置及其发光装置的安装方法
    • US06369506B1
    • 2002-04-09
    • US09448899
    • 1999-11-29
    • Toshio Hata
    • Toshio Hata
    • H01S162
    • H01L33/62H01L2224/16H01L2224/16245H01L2224/48091H01L2224/48247H01L2224/48465H01L2224/49107H01L2924/01039H01L2924/12041H01S5/02244H01L2924/00014H01L2924/00
    • According to one aspect of the present invention, there is provided a light emitting apparatus including: a light emitting device for emitting light; and a first lead frame and a second lead frame on which the light emitting device is mounted. In this apparatus, the light emitting device includes: a substrate which is light transmissive, the substrate defining an output surface; a semiconductor layer formed on the substrate which includes a light emitting layer made of a nitride semiconductor; a first electrode provided lower than a plane running parallel through the light emitting layer with respect to the substrate; and a second electrode provided higher than the plane running parallel through the light emitting layer with respect to the substrate; the first lead frame includes a first lead pad section to which the first electrode is connected; the second lead frame includes a second lead pad section to which the second electrode is connected; at least one of the first and second lead frames includes a die pad section on which the substrate is mounted; and the die pad section does not substantially cover the first output surface.
    • 根据本发明的一个方面,提供了一种发光装置,包括:发光装置; 以及安装有发光装置的第一引线框架和第二引线框架。 在该装置中,发光装置包括:基板,其是透光的,所述基板限定输出表面; 形成在基板上的半导体层,其包括由氮化物半导体构成的发光层; 设置在相对于所述基板平行于所述发光层延伸的平面的第一电极; 以及第二电极,其设置成高于平行于所述发光层相对于所述衬底延伸的平面; 第一引线框架包括第一引线焊盘部分,第一电极连接到第一引线焊盘部分; 所述第二引线框架包括连接所述第二电极的第二引线焊盘部分; 所述第一引线框架和所述第二引线框架中的至少一个包括其上安装所述基板的管芯焊盘部分; 并且芯片焊盘部分基本上不覆盖第一输出表面。