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1. 发明授权

US5315753A Method of manufacture of high dielectric antenna structure 失效
标题翻译：高介电天线结构的制造方法
公开(公告)号：US5315753A
公开(公告)日：1994-05-31
申请号：US13590
申请日：1993-02-04
申请人： Paul C. Jensen , David W. Paananen
发明人： Paul C. Jensen , David W. Paananen
IPC分类号： H01Q9/04 , H01P11/06
CPC分类号： H01Q9/0407 , H01Q9/0442 , Y10T29/49016
摘要： The present invention discloses a method for manufacturing a high dielectric antenna structure. In one embodiment, one or more high dielectric film layers are applied to a dielectric base layer by silk-screening to yield a dielectric structure having a dielectric constant greater than that of the dielectric base layer. After firing, a patch antenna element having a predetermined configuration is disposed on the top surface of the dielectric structure by silk-screening a conductive paste thereupon and firing. A ground plane is disposed on the bottom surface of the dielectric structure by silk-screening a conductive paste thereupon and firing. A pre-drilled dielectric base layer may be employed with registered holes defined in the various silk-screened layers to provide access for an RF feed means, or alternatively, a feed hole can be bored through the antenna structure to permit interconnection between an RF feed means and the patch antenna element. For multiple-frequency applications, additional stacked dielectric structures and patch antenna elements can be manufactured according to the disclosed method, with the uppermost patch antenna element being interconnected with the RF feed means.
摘要翻译：本发明公开了一种高介电天线结构的制造方法。在一个实施例中，通过丝网筛选将一个或多个高电介质膜层施加到电介质基底层，以产生介电常数大于介电基底层的介电常数的电介质结构。在烧制之后，通过丝网印刷导电膏并进行烧制，将具有预定构造的贴片天线元件设置在电介质结构的顶表面上。通过丝网印刷导电膏并进行烧制，将接地平面设置在电介质结构的底表面上。可以使用预先钻孔的电介质基层，其中限定在各种丝网层中的注册孔以提供对RF馈送装置的访问，或者可以通过天线结构钻出馈送孔，以允许RF馈送装置和贴片天线元件。对于多频应用，可以根据所公开的方法制造附加的堆叠介质结构和贴片天线元件，其中最上面的贴片天线元件与RF馈送装置互连。

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