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2. 发明授权

US06677681B2 Carrier substrate and carrier assembly using residual organic compounds to facilitate gate break 有权
标题翻译：载体衬底和载体组件使用残留的有机化合物来促进浇口断裂
公开(公告)号：US06677681B2
公开(公告)日：2004-01-13
申请号：US10172157
申请日：2002-06-14
申请人： Richard W. Wensel
发明人： Richard W. Wensel
IPC分类号： H01K21302
CPC分类号： H01L21/565 , H01L2224/48227 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/12044 , H01L2924/3025 , H01L2924/00
摘要： An encapsulant molding technique used in chip-on-board encapsulation wherein a residual organic compound layer on the surface of a substrate is used to facilitate removal of unwanted encapsulant material. An organic compound layer which inherently forms on the substrate during the fabrication of the substrate or during various chip attachment processes is masked in a predetermined location with a mask. The substrate is then cleaned to remove the organic compound layer. The mask protects the masked portion of the organic material layer which becomes a release layer to facilitate gate break. An encapsulant mold is placed over the substrate and chip and an encapsulant material is injected into the encapsulant mold cavity through an interconnection channel. The release layer is formed in a position to reside as the bottom of the interconnection channel. Preferably, the interconnection channel has a gate adjacent the encapsulant mold cavity. The encapsulant material solidifies and the encapsulant mold is removed, wherein the gate forms an indentation abutting the cavity. Excess encapsulant solidified in the interconnection channel is leveraged from the surface of the substrate and broken free at the indentation. The remaining release layer may then be removed.
摘要翻译：用于板上封装封装的密封剂模制技术，其中使用衬底表面上的残余有机化合物层来促进去除不需要的密封剂材料。在制造衬底期间或在各种芯片附接过程期间固有地在衬底上形成的有机化合物层被掩模在预定位置。然后清洗基材以除去有机化合物层。掩模保护有机材料层的掩蔽部分，该有机材料层成为剥离层以便于断裂。将密封剂模具放置在衬底和芯片上方，并且通过互连通道将密封剂材料注入到密封剂模腔中。释放层形成在作为互连通道的底部的位置。优选地，互连通道具有邻近密封模腔的门。密封剂材料固化并且去除密封剂模具，其中门形成邻接空腔的凹陷。在互连通道中凝固的过量的密封剂从基材的表面被利用，并在压痕处断裂。然后可以除去剩余的释放层。

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