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    • 8. 发明专利
    • APPARATUS AND METHOD FOR MANAGING BATTERY PERFORMANCE OF A WIRELESS DEVICE
    • IL186087D0
    • 2008-01-20
    • IL18608707
    • 2007-09-19
    • QUALCOMM INC
    • G01R20100101
    • Apparatus, methods, and programs that determine and manage battery performance characteristics of a wireless device. Embodiments include a wireless device having a computer platform with a processing engine operable to generate a plurality of battery performance data associated with activities on the wireless device. The wireless device further includes a battery performance module operable, based on a received battery performance configuration, to collect selected ones of the plurality of battery performance data. The embodiments may also include an apparatus operable to generate the battery performance configuration, and operable to receive the collected battery performance data and to generate a performance report characterizing the battery performance of the wireless device. Further, embodiments of the apparatus may also generate and transmit to the wireless device a new device operational configuration, based on the collected battery performance data, effective to change the battery performance of the wireless device.
    • 9. 发明专利
    • MINI WAVE SOLDERING SYSTEM AND METHOD FOR SOLDERING WIRES AND PIN CONFIGURATIONS
    • IL185860D0
    • 2008-01-06
    • IL18586007
    • 2007-09-10
    • MEDCONX INC
    • G01R20100101
    • A mini wave solder system includes a dielectric substrate having a hole defined therethrough, a conductive heat transfer pad, and a conductive retention pad. A conductive material is associated with the hole. The heat transfer pad and retention pad are disposed adjacent to the hole and the retention pad has a thermally activated conductive material positioned thereon. The heat transfer pad, retention pad, and hole are in thermal communication with each other. A method for coupling a component to a substrate utilizing this system is also described. A wire termination system includes a dielectric substrate having a surface, a conductive material disposed on the surface of the dielectric substrate comprising a retention pad and a heat transfer pad in thermal communication with each other, and a thermally activated conductive material positioned on the retention pad. When heat is applied to the heat transfer pad, thermal energy travels to the retention pad to melt the thermally activated conductive material in order to secure a component to the conductive material. A method for coupling a component to a dielectric substrate in a wire termination system is also described. A pin connection system for coupling a pin to a dielectric substrate is also described. The pin connection system includes a dielectric substrate having a hole and electrical traces defined on a surface of the substrate, a pin positioned in the hole, and a connection solder disposed on a top surface of the pin. The pin has at least one radial protrusion disposed on an outer periphery thereof for perpendicularly aligning the pin with the substrate and for retaining the pin in the substrate in a substantially immobile manner. The connection solder at least one of strengthens the mechanical connection of the pin to the substrate and electrically connects the pin to the traces on the substrate.