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    • 6. 发明授权
    • Multi-element induction device having common armature and power-factor adjusters
    • 具有普通武器和功率因数调节器的多元感应装置
    • US3688192A
    • 1972-08-29
    • US3688192D
    • 1970-12-03
    • WESTINGHOUSE ELECTRIC CORP
    • RAMSEY JAMES E JR
    • G01R11/40G01R11/22
    • G01R11/40
    • An induction watthour meter has multiple elements or electromagnets for applying torques to a common electroconductive armature. An element is provided with an E-shaped voltage electromagnet having a voltage pole and two auxiliary poles in a common plane. A power-factor compensator employs a magnetic path extending between the voltage pole and the auxiliary poles through a soft magnetic block attached to the voltage pole. This magnetic path is linked with an electro-conductive loading element. An adjustment is effected by rotation of a screw about an axis parallel to the common plane. The block also establishes another magnetic path which locates the element torque within a desired range.
    • 感应电度表具有用于向公共导电衔铁施加扭矩的多个元件或电磁体。 元件设置有在公共平面中具有电压极和两个辅助极的E形电压电磁体。 功率因数补偿器采用通过连接在电压极上的软磁块在电压极与辅助极之间延伸的磁路。 该磁路与导电加载元件连接。 通过围绕平行于公共平面的轴旋转螺钉来进行调整。 该块还建立另一磁路,其将元件扭矩定位在期望的范围内。
    • 7. 发明授权
    • Annular rotor disk for electric meter
    • 电表环形转子盘
    • US4673874A
    • 1987-06-16
    • US711643
    • 1985-03-14
    • Harold L. Stucker
    • Harold L. Stucker
    • G01R11/09G01R11/19G01R11/22G01R11/02
    • G01R11/19G01R11/09G01R11/22
    • A disk for an electric meter includes a solid annulus of a conductive material with a center of the annulus filled with a non-conducting material. The non-conducting material is preferably molded in place both to capture the annulus and to secure a disk shaft into a unitary assembly. The annulus distorts eddy currents at distances from sets of potential and current stators of the electric meter to minimize radial components of eddy currents in the vicinity of neighboring sets of potential and current stators. The reduced radial components of eddy currents reduces the constructive or destructive interaction of the eddy currents with their neighboring sources of flux. Increasing the angular separation of the sets of potential and current stators further reduces interaction.
    • 用于电表的盘包括具有填充有非导电材料的环形空间中心的导电材料的固体环形区域。 非导电材料优选地被模制在适当位置以捕获环空并将盘轴固定成单一组件。 环形区域在距离电表的电位和当前定子的距离之间扭曲涡流,以使邻近电位和当前定子附近的涡流的径向分量最小化。 涡流减小的径向分量减少了涡流与其相邻的磁通源的建构性或破坏性相互作用。 增加潜在和当前定子组的角度间隔进一步降低了相互作用。
    • 8. 发明授权
    • Wafer test method capable of completing a wafer test in a short time
    • 能够在短时间内完成晶片试验的晶圆试验方法
    • US5841713A
    • 1998-11-24
    • US111158
    • 1998-07-07
    • Tetsunori Maeda
    • Tetsunori Maeda
    • G01R11/22G01R31/3185G06F11/22H01L21/66G11C7/00
    • G01R31/318505G01R31/318511G06F11/2273
    • On carrying out a wafer test for a plurality of semiconductor wafers, N in number, each having a plurality of chips, an initial wafer test is carried out for all of the semiconductor wafers to produce an initial wafer test result representing that each chip of each of the semiconductor wafers is any one of a good chip, a defective chip, and a predictive good chip which is predicted as the good chip if subjected to trimming. Subsequently, each of the predictive good chips is subjected to the trimming to be repaired as the good chips. After that, a final wafer test (8001-8012) is carried out for a reduced number M (M being a positive integer less than N) of sampled wafers sampled among the semiconductor wafers to produce a final wafer test result representing that each chip of each of the sampled wafers is any one of the good chip and the defective chip. The initial wafer test result for the semiconductor wafers except the sampled wafers is modified into a modified wafer test result for the semiconductor wafers except the sampled wafers so that each chip represented as the predictive good chip by the initial wafer test result is also represented as the good chip by the modified wafer test result. An entire wafer test result for all of the semiconductor wafers is produced by adding the modified wafer test result to the final wafer test result.
    • 在对多个半导体晶片进行晶片测试的情况下,每个具有多个芯片的数量为N,对所有半导体晶片进行初始晶片测试,以产生初始晶片测试结果,表示每个半导体晶片的每个芯片 的半导体晶片是好的芯片,有缺陷的芯片和预测好的芯片中的任何一个,如果进行修整则被预测为好的芯片。 随后,将每个预测好的芯片作为好的芯片进行修整以进行修复。 之后,对在半导体晶片中取样的采样晶片的数目M(M为小于N的正整数)进行最终晶片测试(8001-8012),以产生最终晶片测试结果,表示每个芯片的 每个采样的晶片都是好的芯片和有缺陷的芯片中的任何一个。 除了采样晶片之外的半导体晶片的初始晶片测试结果被修改为除了采样晶片之外的半导体晶片的修改的晶片测试结果,使得通过初始晶片测试结果表示为预测良好芯片的每个芯片也表示为 通过改进的晶圆测试结果可以获得良好的芯片。 通过将修改的晶片测试结果添加到最终的晶片测试结果中,可以产生所有半导体晶片的整个晶片测试结果。