专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06176947B1 Lead-free solders 有权
标题翻译：无铅焊料
公开(公告)号：US06176947B1
公开(公告)日：2001-01-23
申请号：US09417169
申请日：1999-10-12
申请人： Jennie S. Hwang , Zhenfeng Guo
发明人： Jennie S. Hwang , Zhenfeng Guo
IPC分类号： C22C700
CPC分类号： C22C13/00 , B23K35/262
摘要： Disclosed is a high strength, high fatigue resistance, and high wetting lead-free solder alloy comprising effective amounts of tin, copper, silver, bismuth, indium, and antimony and having a melting temperature between 175-215° C.
摘要翻译：公开了一种高强度，高抗疲劳性和高润湿无铅焊料合金，其包含有效量的锡，铜，银，铋，铟和锑，并且具有175-215℃的熔融温度。

2. 发明授权

US06312499B1 Method for stabilization of liquid mercury 失效
标题翻译：液态汞稳定化方法
公开(公告)号：US06312499B1
公开(公告)日：2001-11-06
申请号：US09564330
申请日：2000-05-03
申请人： Amirali G. Rehmat , Anil Goyal , Douglas H. Laird
发明人： Amirali G. Rehmat , Anil Goyal , Douglas H. Laird
IPC分类号： C22C700
CPC分类号： C22C7/00 , B22F2999/00 , C22C1/0425 , B22F9/082
摘要： A method for stabilization of liquid mercury in which powdered copper particles are cleaned with a chemically reactive fluid suitable for removing surface oxidation from the surface. “Clean” powdered copper particles are mixed with liquid mercury to form a powdered copper/liquid mercury mixture. The mixture is then hardened to form an amalgam. Amalgams in which the amount of mercury is greater than 50% by weight of the total amalgam may be produced in accordance with the method of this invention.
摘要翻译：用于稳定液态汞的方法，其中粉末状铜颗粒用适于从表面除去表面氧化的化学反应性流体清洁。 “清洁”的粉末状铜颗粒与液态汞混合形成粉末状的铜/液态汞混合物。然后将混合物硬化以形成汞齐。其中汞的量大于总汞齐的50重量％的汞合金可以根据本发明的方法生产。

3. 发明授权

US06231691B1 Lead-free solder 失效
标题翻译：无铅焊料
公开(公告)号：US06231691B1
公开(公告)日：2001-05-15
申请号：US08796471
申请日：1997-02-10
申请人： Iver E. Anderson , Robert L. Terpstra
发明人： Iver E. Anderson , Robert L. Terpstra
IPC分类号： C22C700
CPC分类号： B23K35/262
摘要： A Sn—Ag—Cu eutectic alloy is modified with one or more low level and low cost alloy additions to enhance high temperature microstructural stability and thermal-mechanical fatigue strength without decreasing solderability. Purposeful fourth or fifth element additions in the collective amount not exceeding about 1 weight % (wt. %) are added to Sn—Ag—Cu eutectic solder alloy based on the ternary eutectic Sn—4.7%Ag—1.7%Cu (wt. %) and are selected from the group consisting essentially of Ni, Fe, and like-acting elements as modifiers of the intermetallic interface between the solder and substrate to improve high temperature solder joint microstructural stability and solder joint thermal-mechanical fatigue strength.
摘要翻译： Sn-Ag-Cu共晶合金用一种或多种低水平和低成本的合金添加剂进行改性，以提高高温微结构稳定性和热机械疲劳强度，而不降低可焊性。基于三元共晶Sn-4.7％Ag-1.7％Cu（重量％），Sn-Ag-Cu共晶焊料合金中加入总量不超过约1重量％（重量％）的有目的的第四或第五元素添加量），并且选自基本上由Ni，Fe和类似作用元素组成的组，作为焊料和衬底之间的金属间界面的改性剂，以改善高温焊点微结构稳定性和焊点热 - 机械疲劳强度。

4. 发明授权

US06224690B1 Flip-Chip interconnections using lead-free solders 失效
标题翻译：使用无铅焊料的倒装芯片互连
公开(公告)号：US06224690B1
公开(公告)日：2001-05-01
申请号：US08614984
申请日：1996-03-12
申请人： Panayotis Constantinou Andricacos , Madhav Datta , Hariklia Deligianni , Wilma Jean Horkans , Sung Kwon Kang , Keith Thomas Kwietniak , Gangadhara Swami Mathad , Sampath Purushothaman , Leathen Shi , Ho-Ming Tong
发明人： Panayotis Constantinou Andricacos , Madhav Datta , Hariklia Deligianni , Wilma Jean Horkans , Sung Kwon Kang , Keith Thomas Kwietniak , Gangadhara Swami Mathad , Sampath Purushothaman , Leathen Shi , Ho-Ming Tong
IPC分类号： C22C700
CPC分类号： C22C13/02 , B23K2035/008 , B32B15/01 , C22C13/00 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/05166 , H01L2224/05171 , H01L2224/05572 , H01L2224/05647 , H01L2224/05655 , H01L2224/11 , H01L2224/11849 , H01L2224/119 , H01L2224/13 , H01L2224/13022 , H01L2224/13099 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01061 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/30107 , H01L2224/05552 , H01L2924/00 , H01L2924/00014 , H01L2924/01074 , H01L2924/013 , H01L2924/01026
摘要： An interconnection structure suitable for the connection of microelectronic circuit chips to packages is provided by this invention. In particular, the invention pertains to the area-array or flip-chip technology often called C4 (controlled collapse chip connection). The structure comprises an adhesion/barrier layer deposited on a passivated substrate (e.g., a silicon wafer), optionally an additional adhesion layer, a solderable layer of a metal selected from the group consisting of Ni, Co, Fe, NiFe, NiCo, CoFe and NiCoFe on the adhesion/barrier layer, and a lead-free solder ball comprising tin as the predominate component and one or more alloying elements selected from Bi, Ag, and Sb, and further optionally including one or more elements selected from the group consisting of Zn, In, Ni, Co and Cu.
摘要翻译：适用于将微电子电路芯片连接到封装件的互连结构由本发明提供。特别地，本发明涉及通常称为C4（可控崩溃芯片连接）的区域阵列或倒装芯片技术。该结构包括沉积在钝化衬底（例如，硅晶片）上的粘附/阻挡层，任选附加的粘合层，选自Ni，Co，Fe，NiFe，NiCo，CoFe的金属的可焊层和NiCoFe，以及包含锡作为主要成分的无铅焊球和选自Bi，Ag和Sb的一种或多种合金元素，并且还可任选地包括一种或多种选自以下的元素：的Zn，In，Ni，Co和Cu。

5. 发明授权

US06190606B1 Solid amalgamating compositions for the preparation of dental amalgams, amalgam forming compositions containing them, methods for producing dental amalgams with them and dental amalgams produced thereby 失效
标题翻译：用于制备牙科汞合金的固体合并组合物，含有它们的汞合金组合物，用它们生产牙科汞合金的方法和由此制备的牙科汞合金
公开(公告)号：US06190606B1
公开(公告)日：2001-02-20
申请号：US09133688
申请日：1998-08-13
申请人： Alberto Kaufman , Baruch Kopeliovich , Moshe Zalsman
发明人： Alberto Kaufman , Baruch Kopeliovich , Moshe Zalsman
IPC分类号： C22C700
CPC分类号： A61K6/05 , C22C5/04 , C22C5/06 , C22C7/00 , C22C13/00
摘要： The present invention concerns totally solid amalgamating compositions particularly useful in the preparation of dental amalgams for filling cavities and similar dental applications, comprising one or more solid amalgamating alloys, metals and/or intermetallic compounds or combinations thereof, amalgam forming compositions containing such totally solid amalgamating compositions, methods for producing dental amalgams with such totally solid amalgamating compositions or amalgam forming compositions containing them, and denial amalgams produced thereby.
摘要翻译：本发明涉及特别可用于制备用于填充空腔和类似牙齿应用的牙科汞合金的完全固体合并组合物，其包含一种或多种固体合金合金，金属和/或金属间化合物或其组合，所述汞合金形成组合物含有这样的完全固体合并组合物，用这种完全固体合并组合物生产牙科汞合金的方法或含有它们的形成汞齐的组合物，以及由此制备的否认汞齐。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式