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    • 6. 发明申请
    • Modular printhead assembly with thermal expansion compensation
    • 具有热膨胀补偿功能的模块化打印头组件
    • US20040246299A1
    • 2004-12-09
    • US10882764
    • 2004-07-02
    • Silverbrook Research Pty Ltd.
    • Kia Silverbrook
    • B41J002/015
    • B41J2/1408B41J2/14024B41J2/145B41J2202/08B41J2202/19B41J2202/20
    • A printhead assembly with an elongate support member and two or more printhead modules detachably mounted in series along the support member, the support member having a structural component for strengthening the member, and a mounting component for mounting the printhead modules; wherein, the mounting component is connected to the structural component to allow relative thermal expansion. By allowing the structural component of the support to thermally expand relative to the mounting component, the structural components can be strong, inexpensive metal despite the co-efficient of thermal expansion (CTE). Only the mounting component need approximate the CTE of the printhead chips to maintain a suitable alignment of the modules.
    • 一种打印头组件,其具有细长的支撑构件和两个或多个打印头模块,所述打印头模块沿支撑构件可分离地安装成串联,所述支撑构件具有用于加强构件的结构部件和用于安装打印头模块的安装部件; 其中,安装部件连接到结构部件以允许相对热膨胀。 通过允许支撑件的结构部件相对于安装部件热膨胀,尽管热膨胀(CTE)是有效的,结构部件可以是坚固的廉价金属。 只有安装部件需要近似于打印头芯片的CTE才能保持模块的适当对准。
    • 10. 发明申请
    • Thin film coating of a slotted substrate and techniques for forming slotted substrates
    • 开槽衬底的薄膜涂层和用于形成开槽衬底的技术
    • US20040067319A1
    • 2004-04-08
    • US10679097
    • 2003-10-03
    • Roberto A. Pugliese JR.Mark H. MacKenzieThomas E. PettitVictorio A. ChavarriaSteven P. StormAllen H. Smith
    • B41J002/015B05D007/00B05D001/36
    • B41J2/1631B41J2/1603B41J2/1626B41J2/1632B41J2/1642B41J2/1646
    • A coated substrate for a center feed printhead has a substrate, a thin film applied over the substrate, and a slot region extending through the substrate and the thin film. A slot is formed through the slot region of the coated substrate. The thin film layer coating minimizes crack formation and/or a chip count in a shelf surrounding the slot through the substrate. In one embodiment, the slot is formed mechanically. In one embodiment, a plurality of thin films is used. The slot region extends through the plurality of thin films. Any combination of thin films may be applied over the substrate. In one embodiment, the thin film is at least one of a metal film, a polymer film, and a dielectric film. In another embodiment, the thin film material is ductile and/or deposited under compression. In one embodiment, the substrate is silicon, and the thin film is an insulating layer grown from the substrate, such as field oxide. In one embodiment, the thin film is PSG. In one embodiment, the thin film is a passivation layer, such as at least one of silicon nitride and silicon carbide. In one embodiment, the thin film is a cavitation barrier layer, such as tantalum.
    • 用于中心进给打印头的涂覆基底具有基底,施加在基底上的薄膜以及延伸穿过基底和薄膜的狭槽区域。 通过涂覆的基底的槽区形成槽。 薄膜层涂层使通过基底的槽周围的搁板中的裂纹形成和/或芯片数量最小化。 在一个实施例中,槽是机械地形成的。 在一个实施例中,使用多个薄膜。 槽区域延伸穿过多个薄膜。 可以将任何薄膜的组合施加在衬底上。 在一个实施例中,薄膜是金属膜,聚合物膜和电介质膜中的至少一种。 在另一个实施例中,薄膜材料在压缩下是延展性的和/或沉积的。 在一个实施例中,衬底是硅,并且薄膜是从衬底生长的绝缘层,例如场氧化物。 在一个实施例中,薄膜是PSG。 在一个实施例中,薄膜是钝化层,例如氮化硅和碳化硅中的至少一种。 在一个实施例中,薄膜是空穴阻挡层,例如钽。