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    • 3. 发明授权
    • Polyetherimide and/or polysulphone, aromatic polyamine-modified epoxy resin and thermoplastic
    • 聚醚酰亚胺和/或聚砜,芳族聚胺改性环氧树脂和热塑性塑料
    • US06548608B2
    • 2003-04-15
    • US09838264
    • 2001-04-20
    • Yves CamberlinJacky GrenierJacques ValletAnthony BonnetJean-Pierre PascaultMohamed Taha
    • Yves CamberlinJacky GrenierJacques ValletAnthony BonnetJean-Pierre PascaultMohamed Taha
    • B32B1704
    • C08L63/00C08G59/5033Y10T428/24994C08L81/00C08L79/08
    • A polymer composition comprises at least one thermoplastic polymer selected from the group formed by polyetherimides and polysulphones, at least one epoxy resin modified by at least one aromatic polyamine, and at least one other thermoplastic selected from the group consisting of a polyphenylene ether, a polyphenylene sulfide and an aromatic polyether. The epoxy resin is formed from at least one polyepoxide containing at least 2 epoxy groups in its molecule and the aromatic polyamine contains at least two primary amine groups in its molecule and preferably at least one alkyl substituent containing 1 to 12 carbon atoms located alpha to one of the amino groups. The molar ratio of the polyamine to the epoxy is such that, each amino group corresponds to 1.6 to 2.6 epoxy groups. The thermoplastic polymer content is preferably about 15% to 98% by weight with respect to the total weight of the polymer composition; the amount of epoxy resin modified by at least one aromatic polyamine is about 2% to 85% by weight with respect to the total weight of the polymer composition.
    • 聚合物组合物包含至少一种选自由聚醚酰亚胺和聚砜形成的基团的热塑性聚合物,至少一种由至少一种芳族多胺改性的环氧树脂和至少一种选自聚苯醚,聚亚苯基 硫化物和芳香族聚醚。 环氧树脂由其分子中至少含有至少2个环氧基的聚环氧化物形成,并且芳族多胺在其分子中含有至少两个伯胺基团,优选至少一个含有1至12个碳原子的烷基取代基位于一个 的氨基。 多胺与环氧的摩尔比使得每个氨基相当于1.6-2.6个环氧基。 相对于聚合物组合物的总重量,热塑性聚合物含量优选为约15%至98%重量; 由至少一种芳族多胺改性的环氧树脂的量相对于聚合物组合物的总重量为约2重量%至85重量%。
    • 10. 发明授权
    • Damping resin composition and damping resin article for structure using the resin composition
    • 使用树脂组合物的结构用阻尼树脂组合物和阻尼树脂制品
    • US06803414B2
    • 2004-10-12
    • US10132178
    • 2002-04-26
    • Takeshi HonjoHarushige YamamuraTai UrujiMasayoshi YamaguchiYusuke KoizumiHiroshi Hayashi
    • Takeshi HonjoHarushige YamamuraTai UrujiMasayoshi YamaguchiYusuke KoizumiHiroshi Hayashi
    • B32B1704
    • C08L71/02C08F283/01C08F283/065C08F290/06C08G65/3322C08L51/08C08L67/06Y10T428/24994C08L2666/02C08L2666/18C08L71/00
    • A damping resin composition is provided which includes bifunctional diacrylate or bifunctional dimethacrylate (A) expressed by the formula (1) below, and an unsaturated polyester resin (B+C) containing an unsaturated polyester (B) and a cross-linking monomer (C), and/or an epoxy acrylate resin (B′+C) containing an epoxy acrylate (B′) and a cross-linking monomer (C), wherein the bifunctional diacrylate or bifunctional dimethacrylate (A) is contained in an amount of 15 to 85% by weight, and the unsaturated polyester resin (B+C) or the epoxy acrylate resin (B′+C) or a mixture (B″+C) thereof that contains the unsaturated polyester resin (B+C) in an amount of 5 to 95% by weight and the epoxy acrylate resin (B′+C) in an amount of 95 to 5% by weight is contained in an amount of 85 to 15% by weight, the bifunctional diacrylate or bifunctional dimethacrylate (A) being expressed by: CH2=CR2CO−(R1O)n−OCOCR2=CH2  (1) where n is integer that is equal to or greater than 2, R1 is an alkylene or polymethylene chain having 2 to 13 carbon atoms, and R2 is hydrogen or a methyl group. Also provided is a damping resin article for a structure that is formed from the above damping resin composition by various molding methods.
    • 提供一种阻尼树脂组合物,其包含由下式(1)表示的双官能二丙烯酸酯或双官能二甲基丙烯酸酯(A)和含有不饱和聚酯(B)和交联单体(C)的不饱和聚酯树脂(B + C) )和/或含有环氧丙烯酸酯(B')和交联单体(C)的环氧丙烯酸酯树脂(B'+ C),其中双官能二丙烯酸酯或双官能二甲基丙烯酸酯(A)的含量为15 至85重量%,含有不饱和聚酯树脂(B + C)的不饱和聚酯树脂(B + C)或环氧丙烯酸酯树脂(B'+ C)或其混合物(B“+ C) 双重功能性二丙烯酸酯或双官能二甲基丙烯酸酯(以下称为双官能二丙烯酸酯或双官能二甲基丙烯酸酯)的含量为5〜95重量%,环氧丙烯酸酯树脂(B'+ C)的含量为95〜5重量% A)表示为:其中n是等于或大于2的整数,R1是具有2至13个汽车的亚烷基或聚亚甲基链 有机原子,R2为氢或甲基。 还提供了一种通过各种成型方法由上述阻尼树脂组合物形成的用于结构的阻尼树脂制品。