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1. 发明授权

US06764379B2 Method and system for endpoint detection 有权
标题翻译：端点检测方法和系统
公开(公告)号：US06764379B2
公开(公告)日：2004-07-20
申请号：US09729441
申请日：2000-12-04
申请人： Moshe Finarov
发明人： Moshe Finarov
IPC分类号： B24B4912
CPC分类号： B05C11/1005 , B24B37/013 , B24B49/04 , B24B49/12
摘要： A method and system are presented for monitoring a process sequentially applied to a stream of substantially identical articles by a processing tool, so as to terminate the operation of the processing tool upon detecting an end-point signal corresponding to a predetermined value of a desired parameter of the article being processed. The article is processed with the processing tool. Upon completing the processing in response to the end-point signal generated by an end-point detector continuously operating during the processing of the article, integrated monitoring is applied to the processed article to measure the value of the desired parameter. The measured value of the desired parameter is analyzed to determine a correction value thereof to be used for adjusting the end-point signal corresponding to the predetermined value of the desired parameter for terminating the processing of the next article in the stream.
摘要翻译：提出了一种方法和系统，用于通过处理工具监视顺序地施加到基本上相同的物品流的处理，以便在检测到对应于期望参数的预定值的终点信号时终止处理工具的操作的被处理物品。文章用处理工具处理。一旦响应由在物品处理过程中持续运行的端点检测器产生的终点信号完成处理，则将综合监控应用于经处理的物品以测量所需参数的值。分析所需参数的测量值以确定其用于调整对应于期望参数的预定值的终点信号的修正值，以终止流中下一个物品的处理。

2. 发明授权

US06705922B1 Method and apparatus for polishing a semiconductor substrate wafer 失效
标题翻译：用于研磨半导体衬底晶片的方法和装置
公开(公告)号：US06705922B1
公开(公告)日：2004-03-16
申请号：US09635191
申请日：2000-08-09
申请人： Takashi Inbe
发明人： Takashi Inbe
IPC分类号： B24B4912
CPC分类号： B24B37/042 , B24B49/12
摘要： A semiconductor substrate wafer 2 is supported on a wafer-supporting table 3 so that a surface to be polished is directed upward, a polishing roller 1 is bring to contact with the surface to be polished of the semiconductor substrate wafer 2, and the polishing roller is rolled over the wafer under a pressure whereby a scattering of polishing to the surface of the semiconductor substrate wafer can be eliminated while productivity is increased.
摘要翻译：半导体衬底晶片2被支撑在晶片支撑台3上，使得待抛光的表面向上指向，抛光辊1与半导体衬底晶片2的被抛光表面接触，并且抛光辊在压力下滚动晶片，从而可以消除在半导体衬底晶片的表面上抛光的散射，同时提高生产率。

3. 发明授权

US06682397B2 Machining device for processing metal hanging rod of blinds 失效
标题翻译：百叶窗金属吊杆加工装置
公开(公告)号：US06682397B2
公开(公告)日：2004-01-27
申请号：US10166110
申请日：2002-06-11
申请人： Leslie Nien
发明人： Leslie Nien
IPC分类号： B24B4912
CPC分类号： B24B19/02 , B44B3/04 , B44B3/06
摘要： A machining device for processing metal hanging rod of blinds having a machine platform, two fixing bases, and a retaining unit. A top of the machine platform has a holding groove for the two fixing bases. A middle section of the machine platform has an internally threaded hole for a reversible bolt of a motor. A bottom of the machine platform has a registration groove for the retaining unit to be guided via bearings. The fixing bases, each having a spring and a tapered pivot support, are adjustable to fit the length of a metal hanging rod. A sand wheel, contacting the metal hanging rod at one point and turned on to vibrate said springs, cuts out an interlaced wavy pattern on a periphery of the metal hanging rod. Alternatively, two concentric sand wheels form two contact points, producing double-layered interlaced wavy pattern on the metal hanging rod.
摘要翻译：一种用于加工具有机器平台，两个固定底座和保持单元的百叶窗金属吊杆的加工装置。机器平台的顶部具有用于两个固定基座的保持槽。机器平台的中间部分具有用于电动机的可逆螺栓的内螺纹孔。机器平台的底部具有用于保持单元通过轴承引导的对准槽。每个具有弹簧和锥形枢转支撑件的固定基座可调节以适应金属吊杆的长度。一个砂轮，在一点接触金属吊杆并打开以振动所述弹簧，在金属吊杆的周边切出隔行波浪图案。或者，两个同心砂轮形成两个接触点，在金属悬挂杆上产生双层隔行波浪图案。

4. 发明授权

US06739945B2 Polishing pad with built-in optical sensor 有权
标题翻译：抛光垫，内置光学传感器
公开(公告)号：US06739945B2
公开(公告)日：2004-05-25
申请号：US09970252
申请日：2001-09-29
申请人： David G. Halley , Gregory L. Barbour , Ben Smedley , Stephen H. Wolf
发明人： David G. Halley , Gregory L. Barbour , Ben Smedley , Stephen H. Wolf
IPC分类号： B24B4912
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the detector detects the reflected light. The electrical signal produced by the detector is conducted to a hub located at the central aperture of the polishing pad. The disposable polishing pad is removably connected, both mechanically and electrically to the hub. The hub contains electronic circuitry that is concerned with supplying power to the optical sensor and with transmitting the electrical signal to a non-rotating station. Several techniques are described for accomplishing these tasks. The system permits continuous monitoring of an optical characteristic of a surface that is being polished, even while the polishing machine is in operation, and permits the end point of the polishing process to be determined.
摘要翻译：包括光源和检测器的光学传感器位于抛光垫的空腔内，以面对被抛光的表面。来自光源的光从被抛光的表面反射并且检测器检测到反射光。由检测器产生的电信号被传导到位于抛光垫的中心孔处的毂。一次性抛光垫可机械地和电气地连接到轮毂上。集线器包含电子电路，其涉及向光学传感器供电并且将电信号传送到非旋转站。描述了几种完成这些任务的技术。该系统即使在抛光机正在运行中也能够持续地监测正被抛光的表面的光学特性，并允许确定抛光过程的终点。

5. 发明授权

US06716085B2 Polishing pad with transparent window 有权
标题翻译：带透明窗的抛光垫
公开(公告)号：US06716085B2
公开(公告)日：2004-04-06
申请号：US10035391
申请日：2001-12-28
申请人： Andreas Norbert Wiswesser , Boguslaw A. Swedek
发明人： Andreas Norbert Wiswesser , Boguslaw A. Swedek
IPC分类号： B24B4912
CPC分类号： B24B37/205
摘要： A polishing solution is dispensed onto a polishing pad that has a polishing surface, a substrate is brought into contact with the polishing surface, relative motion is created between the substrate and the polishing pad, a light beam is directed through a window in the polishing pad to impinge the substrate, and an intensity of a reflected light beam from the substrate is monitored. The polishing solution has a first refractive index, and the window has a second index of refraction that is approximately equal to the first index of refraction.
摘要翻译：将抛光液分配到具有研磨面的研磨垫上，使基板与研磨面接触，在基板和研磨垫之间产生相对运动，将光束朝向抛光垫中的窗口以撞击基板，并且监测来自基板的反射光束的强度。抛光溶液具有第一折射率，并且窗口具有大致等于第一折射率的第二折射率。

6. 发明授权

US06517417B2 Polishing pad with a transparent portion 失效
标题翻译：具有透明部分的抛光垫
公开(公告)号：US06517417B2
公开(公告)日：2003-02-11
申请号：US09792813
申请日：2001-02-24
申请人： William D. Budinger , John V. H. Roberts
发明人： William D. Budinger , John V. H. Roberts
IPC分类号： B24B4912
CPC分类号： B24B37/205 , B24B37/26 , B24B49/12 , B24D13/14 , C09G1/02
摘要： A transparent portion of a polishing pad in the solid phase has an index of refraction nearly matched to the index of refraction of a fluid polishing composition for chemical mechanical polishing, which minimizes scattering of an optical beam at an interface of the transparent portion and the polishing composition.
摘要翻译：固相中的抛光垫的透明部分具有几乎与用于化学机械抛光的流体抛光组合物的折射率匹配的折射率，其使透光部分的界面处的光束的散射最小化和抛光组成。

7. 发明授权

US06780085B2 Fiber optical sensor embedded into the polishing pad for in-situ, real-time, monitoring of thin films during the chemical mechanical planarization process 失效
标题翻译：纤维光学传感器嵌入抛光垫，用于在化学机械平面化过程中实时，实时监测薄膜
公开(公告)号：US06780085B2
公开(公告)日：2004-08-24
申请号：US09991122
申请日：2001-11-23
申请人： Stephan H. Wolf
发明人： Stephan H. Wolf
IPC分类号： B24B4912
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： An apparatus is disclosed which improves the optical monitoring of semi-conductor wafers undergoing chemical mechanical planarization. The apparatus consists of two assemblies. Firstly, a fiber optical wave-guide assembly installed within the polishing pad during the pad's construction. This assembly forms an integrated optical waveguide originating from the center of rotation of the polishing pad and terminating at a location within the wafer track. Secondly, a vacuum hub, tube, and angular encoder assembly, which provides light coupling to the center of rotation of the polishing pad and also provides resolution of the angular position and speed of the polishing pad, polishing table, and optical waveguide.
摘要翻译：公开了改进对经历化学机械平面化的半导体晶片的光学监测的装置。该装置由两个组件组成。首先，在衬垫施工期间安装在抛光垫内的光纤光波导组件。该组件形成源自抛光垫的旋转中心并且终止于晶片轨道内的位置的集成光波导。其次，提供与抛光垫的旋转中心的光耦合的真空轮毂，管和角度编码器组件，并且还提供抛光垫，抛光台和光波导的角位置和速度的分辨率。

8. 发明授权

US06461222B1 Planarizing and polishing apparatus and planarizing and polishing method 有权
标题翻译：平面抛光装置及平面抛光方法
公开(公告)号：US06461222B1
公开(公告)日：2002-10-08
申请号：US09539379
申请日：2000-03-31
申请人： Shuzo Sato
发明人： Shuzo Sato
IPC分类号： B24B4912
CPC分类号： B24B51/00 , B24B37/042 , B24B49/04 , B24B49/12
摘要： There is provided a planarizing and polishing apparatus and a planarizing and polishing method for measuring the polishing conditions of a polishing work during the polishing process in view of obtaining a fault-free polishing work. The planarizing and polishing apparatus is provided with a detecting unit for detecting a change in surface reflectivity of the polishing work and a control unit for recognizing the additional polishing part of the polishing work based on the detected value from the detecting unit and then automatically generating, for the feedback purpose, the polishing conditions of the additional polishing part and the portion other than the additional polishing part.
摘要翻译：为了获得无故障的抛光工作，提供了一种用于在抛光过程中测量抛光工作的抛光条件的平面化和抛光装置和平面化和抛光方法。该平面化抛光装置设置有用于检测抛光工件的表面反射率变化的检测单元和用于基于来自检测单元的检测值识别抛光工作的附加抛光部分的控制单元，为了反馈目的，附加抛光部分的抛光条件和除了附加抛光部分之外的部分。

9. 发明授权

US06439962B1 Cleaning apparatus 有权
标题翻译：清洁装置
公开(公告)号：US06439962B1
公开(公告)日：2002-08-27
申请号：US09238612
申请日：1999-01-28
申请人： Koji Ato
发明人： Koji Ato
IPC分类号： B24B4912
CPC分类号： B24B37/345 , B08B1/04 , B08B3/02 , B08B2203/0288 , H01L21/67046 , H01L21/67051 , H01L21/67259
摘要： An apparatus performs at least one of cleaning and drying a semiconductor wafer while rotating the semiconductor wafer. The apparatus has a rotating mechanism for rotating the semiconductor wafer, and a sensor for detecting a reference position such as a notch or an orientation flat of the semiconductor wafer. The semiconductor wafer may be stopped from rotating to align the reference position with a predetermined position based on an output signal from the sensor.
摘要翻译：一种装置在半导体晶片旋转的同时执行清洗和干燥半导体晶片中的至少一个。该装置具有用于旋转半导体晶片的旋转机构和用于检测诸如半导体晶片的凹口或取向平面的基准位置的传感器。可以基于来自传感器的输出信号，使半导体晶片停止旋转以使基准位置与预定位置对准。

10. 发明授权

US06805613B1 Multiprobe detection system for chemical-mechanical planarization tool 有权
标题翻译：化学机械平面化工具多点探测系统
公开(公告)号：US06805613B1
公开(公告)日：2004-10-19
申请号：US09690521
申请日：2000-10-17
申请人： Matthew Weldon , Thomas Laursen , Malcolm Grief , Paul Holzapfel , Mark A. Meloni , Robert Eaton
发明人： Matthew Weldon , Thomas Laursen , Malcolm Grief , Paul Holzapfel , Mark A. Meloni , Robert Eaton
IPC分类号： B24B4912
CPC分类号： B24B37/105 , B24B37/013 , B24B37/30 , B24B49/10 , B24B49/12 , B24B49/14 , H01L21/67253
摘要： The invention is a method and apparatus for planarizing a wafer. Discrete measurements are taken across the surface of the wafer at a desired spatial density. The measurements may be generated using a flash lamp to reflect a light signal off the surface of the wafer with a spectrometer analyzing the reflected light. A plurality of probes may be used at different locations to shorten the time necessary for taking measurements across the full front surface of the wafer and for allowing a plurality of areas to be sampled substantially simultaneously. A control system receives the measurements and their corresponding locations. The control system is then able to analyze the data looking for areas or bands on the front surface of the wafer that need an increase or decrease in material removal rate. The control system is then able to adjust one or more planarization parameters to improve the process for the current wafer or for future wafers.
摘要翻译：本发明是用于平坦化晶片的方法和装置。以期望的空间密度跨越晶片的表面进行离散测量。可以使用闪光灯产生测量值，以用分析反射光的光谱仪将光信号从晶片的表面反射出来。可以在不同位置使用多个探针，以缩短在晶片的整个正面进行测量所需的时间，并允许多个区域基本上同时采样。控制系统接收测量及其对应位置。然后，控制系统能够分析寻找需要材料去除速率增加或减少的晶片正面上的区域或频带的数据。控制系统然后能够调整一个或多个平坦化参数以改善当前晶片或将来晶片的工艺。

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