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1. 发明申请

US20040206804A1 Traps for particle entrapment in deposition chambers 审中-公开
标题翻译：用于沉积室中的颗粒捕获的捕集阱
公开(公告)号：US20040206804A1
公开(公告)日：2004-10-21
申请号：US10837555
申请日：2004-04-30
发明人： Jaeyeon Kim , John D. Mize , Terry J. Phelan
IPC分类号： C23C014/32 , B23K028/00
CPC分类号： C23C16/4401 , C23C14/3407 , C23C14/564
摘要： The invention includes deposition apparatuses having reaction chambers and particle-trapping features formed along one or more surfaces within the chambers. In particular aspects, the particle-trapping features can comprise a pattern of bent projections forming receptacles, and can comprise microstructures on the bent projections. The invention also includes methods of forming particle-trapping features by initially forming a pattern of projections, bending the projections, and then exposing the projections to particles to form microstructures on the bent projections.
摘要翻译：本发明包括具有沿腔室内的一个或多个表面形成的反应室和颗粒捕获特征的沉积设备。在特定方面，颗粒捕获特征可以包括形成容器的弯曲突起的图案，并且可以包括弯曲突起上的微结构。本发明还包括通过最初形成突起图案，弯曲突起，然后将突起暴露于颗粒以在弯曲突起上形成微结构而形成颗粒捕获特征的方法。

2. 发明申请

US20040129560A1 Method of bonding sputtering target materials 失效
标题翻译：焊接靶材料的方法
公开(公告)号：US20040129560A1
公开(公告)日：2004-07-08
申请号：US10674281
申请日：2003-09-29
发明人： Charles E. Wickersham JR.
IPC分类号： C23C014/32 , B23K020/08 , B23K020/00 , B23K028/00
CPC分类号： H01J37/3435 , C23C14/3407 , C23C14/3414
摘要： A method of forming a sputtering target is described that involves bonding a backing plate onto a casement having one or more recesses that contain target material to form a bonded target. During the bonding process, the bonded target is optionally vacuum sealed within the recess. The bonded target is then optionally annealed while under vacuum to form an annealed sputtering target. The sputtering target can then be retrieved by removing at least a portion of the casement from the sputtering target in one or several steps. Also described is a casement having one or more recesses containing bonded target material that is optionally vacuum sealed in the casement. The casement, as well as the backing plate that is optionally bonded onto the casement, are further described as well as other options and methods.
摘要翻译：描述了一种形成溅射靶的方法，该方法包括将背板粘合到具有一个或多个含有目标材料的凹部以形成粘合靶的小屋顶上。在接合过程中，粘合靶可选地在凹部内被真空密封。然后在真空下任意地退火接合的靶，以形成退火的溅射靶。然后可以通过以一个或几个步骤从溅射靶去除至少一部分窗口来获取溅射靶。还描述了一种具有一个或多个包含可选择地真空密封在平整物中的结合目标材料的凹部的窗体。进一步描述了平整度以及可选地粘合到窗扇上的背板以及其它选项和方法。

3. 发明申请

US20040056075A1 Welded aluminum alloy structure 失效
标题翻译：焊接铝合金结构
公开(公告)号：US20040056075A1
公开(公告)日：2004-03-25
申请号：US10662836
申请日：2003-09-15
发明人： Iulian Gheorghe
IPC分类号： B23K028/00
CPC分类号： B23K20/122 , B23K2101/18 , B23K2103/10 , C22F1/047 , C22F1/053 , C22F1/057
摘要： A method of welding age-hardenable aluminum alloys to improve strength properties in the heat affected zone and the weld zone, the method comprising the steps of providing precipitation hardenable aluminum alloy members to be welded and subjecting said members to a first aging step for times and temperatures to generated strengthening precipitates. Thereafter, the aged members are welded to provide a welded assembly having a weld zone. The welded members are subjected to a second aging step to reprecipitate strengthening precipitates dissolved in the weld zone.
摘要翻译：一种焊接老化硬化铝合金以提高热影响区和焊接区的强度性能的方法，所述方法包括以下步骤：提供待焊接的可沉淀硬化铝合金构件，并对所述构件进行第一老化步骤，温度产生强化沉淀。此后，老化构件被焊接以提供具有焊接区域的焊接组件。对焊接构件进行第二老化步骤以再沉淀溶解在焊接区中的强化析出物。

4. 发明申请

US20040173666A1 Composite metallic ultrafine particles and process for producing the same 失效
标题翻译：复合金属超微粒及其制造方法
公开(公告)号：US20040173666A1
公开(公告)日：2004-09-09
申请号：US10804085
申请日：2004-03-19
申请人： EBARA CORPORATION
发明人： Akira Fukunaga , Hiroshi Nagasawa , Kaori Kagoshima , Makiko Emoto
IPC分类号： B23K028/00
CPC分类号： H01L21/67167 , B01J13/0043 , B22F1/0018 , B22F1/0059 , B22F1/0062 , B22F9/24 , B22F2998/00 , B82Y30/00 , H01L21/02074 , H01L21/02087 , H01L21/0209 , H01L21/288 , H01L21/3212 , H01L21/67034 , H01L21/67051 , H01L21/6715 , H01L21/67161 , H01L21/67173 , H01L21/67219 , H01L21/76877 , H05K3/102 , Y10T428/2998
摘要： The present invention relates to composite metallic ultrafine particles which have excellent dispersion stability and can be produced on an industrial scale, and a process for producing the same, and a method and an apparatus for forming an interconnection with use of the same. A surface of a core metal produced from a metallic salt, a metallic oxide, or a metallic hydroxide and having a particle diameter of 1 to 100 nm is covered with an organic compound including a functional group having chemisorption capability onto the surface of the core metal.
摘要翻译：本发明涉及具有优异的分散稳定性并且可以以工业规模生产的复合金属超微粒子及其制造方法，以及使用该复合金属超微粒子形成互连的方法和装置。由金属盐，金属氧化物或金属氢氧化物制成的粒径为1〜100nm的核心金属的表面被覆在芯金属表面上的具有化学吸附能力的官能团的有机化合物。

5. 发明申请

US20040159545A1 Method of forming metal blanks for sputtering targets 有权
标题翻译：形成溅射靶金属坯料的方法
公开(公告)号：US20040159545A1
公开(公告)日：2004-08-19
申请号：US10366650
申请日：2003-02-13
发明人： Christopher A. Michaluk
IPC分类号： C23C014/34 , B23K020/08 , B23K028/00 , C25B013/00
CPC分类号： C23C14/3407 , C22F1/00
摘要： The present invention relates to an improvement in the manufacture of metal blanks, discs, and sputtering targets by flattening only one of the two surfaces of a metal plate. The elimination of flattening the metal plate's second surface results in a significant cost reduction. The metal plate of the present invention preferably has a single-side flatness of 0.005 inches or less, which improves the reliability of the bond between the target blank and a backing plate. Preferred metals include, but are not limited to, tantalum, niobium, titanium, and alloys thereof. The present invention also relates to machining the first side of a metal plate, bonding the first side to a backing plate, and then optionally machining the second side of the metal plate.
摘要翻译：本发明涉及通过仅使金属板的两个表面中的一个平坦化来改进金属坯料，圆盘和溅射靶的制造。消除金属板的第二表面变平，导致显着的成本降低。本发明的金属板优选具有0.005英寸或更小的单面平坦度，这提高了目标坯料与背板之间的结合的可靠性。优选的金属包括但不限于钽，铌，钛及其合金。本发明还涉及加工金属板的第一面，将第一面接合到背板上，然后可选地加工金属板的第二面。

6. 发明申请

US20020162741A1 Multi-material target backing plate 审中-公开
标题翻译：多材料目标背板
公开(公告)号：US20020162741A1
公开(公告)日：2002-11-07
申请号：US09846742
申请日：2001-05-01
申请人： Applied Materials, Inc.
发明人： James Van Gogh
IPC分类号： C23C014/34 , B23K020/08 , B23K028/00 , B23K035/36
CPC分类号： H01J37/32871 , C23C14/3407 , H01J37/3435 , H01J2237/022
摘要： A target assembly for a physical vapor deposition system having a target material flux region which produces backscatter particles and a substrate support assembly is provided. In one embodiment, the target assembly comprises a central region and a flange radially extending from the central region. The flange is constructed of a first material and is adapted to support the target assembly within the physical vapor deposition system in a parallel spaced apart relation to the substrate support assembly. A flange cover member is disposed between the flange and the flux region. The flange cover member is constructed of a material having a greater adhesiveness to the backscatter particles than the first material and is permanently secured to the flange. A target member constructed of a sputterable material is disposed between the central region of the target assembly and the flux region of the physical vapor deposition system.
摘要翻译：提供了具有产生反向散射颗粒的靶材料通量区域和基板支撑组件的物理气相沉积系统的目标组件。在一个实施例中，目标组件包括中心区域和从中心区域径向延伸的凸缘。凸缘由第一材料构成，并且适于在物理气相沉积系统内以与基板支撑组件平行的间隔开的关系支撑目标组件。法兰盖构件设置在凸缘和通量区域之间。凸缘盖构件由与第一材料相比对后向散射颗粒具有更大粘附性的材料构成，并且永久地固定在凸缘上。由可溅射材料构成的目标构件设置在目标组件的中心区域和物理气相沉积系统的通量区域之间。

7. 发明申请

US20020033412A1 Pillar connections for semiconductor chips and method of manufacture 有权
标题翻译：半导体芯片的支柱连接和制造方法
公开(公告)号：US20020033412A1
公开(公告)日：2002-03-21
申请号：US09843248
申请日：2001-04-26
发明人： Francisca Tung
IPC分类号： B23K028/00 , B23K001/20 , B23K005/213 , B23K020/24
CPC分类号： H01L24/11 , H01L24/12 , H01L24/16 , H01L2224/05001 , H01L2224/05023 , H01L2224/05568 , H01L2224/1147 , H01L2224/11901 , H01L2224/1308 , H01L2224/13082 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/3511 , H01L2924/00014 , H01L2924/0105 , H01L2224/13099 , H01L2924/00 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/05111 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147
摘要： A flip chip interconnect system comprises an elongated pillar comprising two elongated portions, a first portion including solder with or without lead and a second portion including copper or gold or other material having a higher reflow temperature than the first portion. The second portion is to be connected to the semiconductor chip and has a length preferably of more than 55 microns to reduce the effect of null particles from the solder from affecting electronic devices on the chip. The total length of the pillar is preferably in the range of 80 to 120 microns.
摘要翻译：倒装芯片互连系统包括细长柱，其包括两个细长部分，第一部分包括具有或不具有引线的焊料，以及包括铜或金的第二部分或具有比第一部分更高的回流温度的其它材料。第二部分连接到半导体芯片，其长度优选大于55微米，以减少来自焊料的α粒子影响芯片上的电子器件的影响。柱的总长度优选在80至120微米的范围内。

8. 发明申请

US20020185372A1 Recessed sputter target 有权
标题翻译：嵌入式溅射靶
公开(公告)号：US20020185372A1
公开(公告)日：2002-12-12
申请号：US09870164
申请日：2001-05-30
发明人： Thomas J. Hunt , Holger J. Koenigsmann , Paul S. Gilman
IPC分类号： C23C014/00 , C23C014/34 , B23K028/00
CPC分类号： H01J37/3491 , C23C14/3407
摘要： The method manufactures sputter target assemblies. It first includes the step of manufacturing a target insert. The target insert has a yield strength, a diameter, a height, a planar top surface and a conical-shaped rear surface. Then a backing plate is manufactured. The backing plate has a cylindrical recess that corresponds to the diameter of the target insert. The cylindrical recess has a depth less than the height of the target insert and a yield strength less than the yield strength of the target insert. Finally, pressing the target insert into the cylindrical recess of the backing plate bonds the target insert to the backing plate to form a target assembly. The pressed target assembly contains the target insert with the conical-shaped rear surface.
摘要翻译：该方法制造溅射靶组件。它首先包括制造目标插入物的步骤。目标刀片具有屈服强度，直径，高度，平面顶表面和锥形后表面。然后制造背板。背板具有对应于目标插入物的直径的圆柱形凹部。圆柱形凹槽的深度小于目标刀片的高度，并且屈服强度小于目标刀片的屈服强度。最后，将目标插入件压入背衬板的圆柱形凹槽中，将目标插入件结合到背板上以形成目标组件。压制的目标组件包含具有锥形后表面的目标插入件。

9. 发明申请

US20020134675A1 Insert target assembly and method of making same 审中-公开
公开(公告)号：US20020134675A1
公开(公告)日：2002-09-26
申请号：US10154729
申请日：2002-05-24
申请人： Tosoh SMD. Inc.
发明人： Melvin K. Holcomb , William E. Barnes , Steven L. Bardus
IPC分类号： C23C014/32 , B23K028/00
CPC分类号： H01J37/342 , B23K20/021 , B23K2101/04 , B23K2103/16 , C23C14/34 , C23C14/3407 , Y10T428/12639 , Y10T428/12646 , Y10T428/12653 , Y10T428/12736 , Y10T428/1275 , Y10T428/12771 , Y10T428/12792 , Y10T428/12986
摘要： Method of forming a two-piece hollow cathode sputter target assembly and the assembly formed thereby. The sputter target assembly includes an outer shell having a substantially cylindrical side wall and is composed of a relatively low purity metallic material. A sputtering insert includes a substantially cylindrical side wall and is concentrically received within, and bonded to, the outer shell. The sputtering insert is composed of a relatively high purity metallic material as used for depositing a thin layer or film onto a desired substrate.

10. 发明申请

US20020074381A1 Low temperature methods of bonding components and related structures 有权
标题翻译：粘合部件和相关结构的低温方法
公开(公告)号：US20020074381A1
公开(公告)日：2002-06-20
申请号：US10017350
申请日：2001-12-14
申请人： Unitive International Limited
发明人： Glenn A. Rinne , Krishna K. Nair
IPC分类号： B23K020/00 , B23K028/00
CPC分类号： G02B6/3628 , B23K1/0004 , G02B6/3636 , G02B6/3692
摘要： Methods of bonding two components may include positioning the components relative to one another to obtain a desired orientation. Once the desired orientation is obtained, the components can be bonded in the desired orientation with metal wherein a temperature of both components is maintained below a melting temperature of the metal while bonding. Related structures are also discussed.
摘要翻译：粘合两个部件的方法可以包括相对于彼此定位组件以获得期望的取向。一旦获得了所需的取向，就可以将金属成分按期望的方向与金属结合，其中两种成分的温度在粘合时保持在金属的熔融温度以下。还讨论了相关结构。

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