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    • 4. 发明授权
    • Method of controlled surface texturization of crystalline semiconductor
material
    • 晶体半导体材料的受控表面纹理化方法
    • US4147564A
    • 1979-04-03
    • US852786
    • 1977-11-18
    • Thomas J. MageeRichard R. PettijohnShelley A. StewartMalcolm Thackray
    • Thomas J. MageeRichard R. PettijohnShelley A. StewartMalcolm Thackray
    • H01L31/04H01L21/263H01L21/306H01L31/0236
    • H01L21/263H01L21/30608H01L31/0236Y02E10/547Y10S148/061Y10S430/154
    • A method of forming a microscopically texturized surface on a crystalline semiconductor material is disclosed which method includes the use of a radioactive source for uniformly irradiating the surface. The radioactive source includes a plane surface having a uniform distribution of radioactive material thereon In one arrangement the radioactive source surface area is at least the size of the polished crystalline semiconductor surface to be texturized, and the radioactive source is positioned closely adjacent the polished surface for a predetermined time period for uniform irradiation of the same. If desired, the radioactive source and crystalline surface may be relatively movable during irradiation of the surface, in which case the source may be in the form of an elongated strip of sufficient length to extend beyond opposite edges of the polished surface area to be texturized. In any case, the large-surface area radioactive source produces substantially uniform distribution of damage tracks in the crystalline surface, which surface then is anisotropically etched by use of a suitable etching solution. The damage tracks provide etching sites along which etching proceeds at a greater rate than in the undamaged area. Generally the surface to be texturized comprises the (100) orientation surface of a crystalline semiconductor material, such as silicon, at which surface etching preferentially proceeds for exposure of the (111) planes which intersect the surface with fourfold symmetry. With this method a controllable size distribution of tetrahedra may be formed over a large surface.
    • 公开了一种在结晶半导体材料上形成微观结构化表面的方法,该方法包括使用放射源来均匀地照射该表面。 放射源包括具有均匀分布的放射性材料的平面。在一种布置中,放射源表面积至少要被抛光的晶体半导体表面的尺寸,以被组织化,放射源位于抛光表面附近 用于均匀照射的预定时间段。 如果需要,放射源和晶体表面可在照射表面期间相对移动,在这种情况下,源可以是具有足够长度的细长条形,以延伸超过被抛光表面区域的相对边缘以进行纹理化。 在任何情况下,大面积放射源在结晶表面产生损伤轨迹的基本上均匀的分布,然后通过使用合适的蚀刻溶液各向异性蚀刻该表面。 损伤轨迹提供蚀刻位置,蚀刻以比未损伤区域更大的速率进行。 通常,待纹理化的表面包括晶体半导体材料(例如硅)的(100)取向表面,在该表面处,表面蚀刻优先进行以暴露与四面对称的表面的(111)面。 利用该方法,可以在大的表面上形成四面体的可控尺寸分布。
    • 8. 发明授权
    • Elements and process for recording direct image neutron radiographs
    • 记录直接图像中子射线照片的要素和过程
    • US3887807A
    • 1975-06-03
    • US38110673
    • 1973-07-20
    • EASTMAN KODAK CO
    • POIGNANT JR ROBERT VPRZYBYLOWICZ EDWIN P
    • G01N23/05G01T3/00
    • G01N23/05G01T3/00Y10S430/154
    • An element is provided for recording a direct image neutron radiograph, thus eliminating the need for a transfer step (i.e. the use of a transfer screen). The element is capable of holding an electrostatic charge and comprises a first layer for absorbing neutrons and generating a current by dissipation of said electrostatic charge in proportion to the number of neutrons absorbed, and a second layer for conducting the current generated by the absorbed neutrons, said neutron absorbing layer comprising an insulative layer comprising neutron absorbing agents in a concentration of at least 1017 atoms per cubic centimeter. An element for enhancing the effect of the neutron beam by utilizing the secondary emanations of neutron absorbing materials is also disclosed along with a process for using said device.
    • 提供用于记录直接图像中子射线照片的元件,因此不需要转印步骤(即使用转印屏幕)。 该元件能够保持静电电荷,并且包括用于吸收中子的第一层,并且通过与所吸收的中子的数量成比例地散发所述静电电荷而产生电流,以及用于传导被吸收的中子产生的电流的第二层, 所述中子吸收层包括绝缘层,所述绝缘层包含浓度至少为1017原子/立方厘米的中子吸收剂。 还通过利用中子吸收材料的二次发射来增强中子束的影响的元件以及使用所述装置的方法。