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    • 4. 发明授权
    • Semiconductor device having high breakdown voltage and low resistance
and method of fabricating the same
    • 具有高突变电压和低电阻的半导体器件及其制造方法
    • US5164804A
    • 1992-11-17
    • US747016
    • 1991-08-19
    • Tomohide Terashima
    • Tomohide Terashima
    • H01L29/06H01L29/08H01L29/36H01L29/47H01L29/739H01L29/78H01L29/786H01L29/861H01L29/872
    • H01L29/7813H01L29/0634H01L29/0649H01L29/0657H01L29/36H01L29/7395H01L29/7802H01L29/861H01L29/872H01L29/0847Y10S257/927Y10S438/978
    • A P.sup.+ layer (3) and an N.sup.+ layer (1) are provided on the top and bottom surfaces of an N.sup.- layer (21), respectively. An electrode (7) is formed on the P.sup.+ layer (3), while an electrode (8) is formed on the bottom surface of the N.sup.+ layer (1). In a direction from the electrode (7) to the electrode (8), the area of the cross section of the N.sup.- layer (21) is decreased, which cross section is perpendicular to the direction. An N.sup.-- layer (22) is formed complementarily to the N.sup.- layer (21) which is decreased in cross-sectional area. When a potential applied to the electrode (8) is higher than a potential applied to the electrode (7), a depletion layer extends from a PN junction formed by the P.sup.+ layer (3) and the N.sup.- layer (21). Since the impurity concentration of the N.sup.- layer ( 21) is lower than that of the P.sup.+ layer (3), the depletion layer extends substantially to the N.sup.- layer (21). The depletion layer extending to the N.sup.- layer (21) substantially holds the voltage applied across the electrodes (7) and (8). In order to improve a breakdown voltage, the cross-sectional area of the N.sup.- layer (21) is preferably decreased exponentially. A field intensity in the depletion layer extending within the N.sup.- layer (21) hardly depends on a distance from the electrode (7) or (8).
    • 分别在N层(21)的顶表面和底表面上设置P +层(3)和N +层(1)。 在P +层(3)上形成电极(7),同时在N +层(1)的底面上形成电极(8)。 在从电极(7)到电极(8)的方向上,N层(21)的截面的面积减小,该截面垂直于该方向。 N层(22)与N层(21)互补形成,横截面积减小。 当施加到电极(8)的电位高于施加到电极(7)的电位时,耗尽层从由P +层(3)和N层(21)形成的PN结延伸。 由于N层(21)的杂质浓度低于P +层(3)的杂质浓度,所以耗尽层大致延伸到N层(21)。 延伸到N层(21)的耗尽层基本上保持施加在电极(7)和(8)上的电压。 为了提高击穿电压,N层(21)的截面积优选呈指数下降。 在N层(21)内延伸的耗尽层中的场强几乎不依赖于距离电极(7)或(8)的距离。
    • 5. 发明申请
    • SOFT RECOVERY POWER DIODE AND RELATED METHOD
    • 软恢复功率二极管及相关方法
    • WO02001643A2
    • 2002-01-03
    • PCT/US2001/019990
    • 2001-06-22
    • H01L21/329H01L29/861H01L29/00
    • H01L29/861H01L29/36Y10S257/927
    • A semiconductor diode includes a first semiconductor layer including a dopant having a first conductivity type. A second semiconductor layer is adjacent the first semiconductor layer and includes a dopant having the first conductivity type and having a dopant concentration less than a dopant concentration of the first semiconductor layer. Adjacent the second semiconductor layer is a third semiconductor layer including a dopant having the first conductivity type and having a dopant concentration greater than the dopant concentration of the second semiconductor layer. A fourth semiconductor layer is adjacent the third semiconductor layer and includes a dopant of a second conductivity type. Respective contacts are connected to the first and fourth semiconductor layers.
    • 半导体二极管包括具有第一导电类型的掺杂剂的第一半导体层。 第二半导体层与第一半导体层相邻并且包括具有第一导电类型并且具有小于第一半导体层的掺杂剂浓度的掺杂剂浓度的掺杂剂。 与第二半导体层相邻的是第三半导体层,其包括具有第一导电类型并且掺杂剂浓度大于第二半导体层的掺杂剂浓度的掺杂剂。 第四半导体层与第三半导体层相邻并且包括第二导电类型的掺杂剂。 相应的触点连接到第一和第四半导体层。
    • 6. 发明申请
    • SOFT RECOVERY POWER DIODE AND RELATED METHOD
    • 软恢复功率二极管及相关方法
    • WO0201643A3
    • 2002-04-18
    • PCT/US0119990
    • 2001-06-22
    • FAIRCHILD SEMICONDUCTORSHENOY PRAVEEN MURALEEDHARAN
    • SHENOY PRAVEEN MURALEEDHARAN
    • H01L21/329H01L29/861
    • H01L29/861H01L29/36Y10S257/927
    • A semiconductor diode includes a first semiconductor layer including a dopant having a first conductivity type. A second semiconductor layer is adjacent the first semiconductor layer and includes a dopant having the first conductivity type and having a dopant concentration less than a dopant concentration of the first semiconductor layer. Adjacent the second semiconductor layer is a third semiconductor layer including a dopant having the first conductivity type and having a dopant concentration greater than the dopant concentration of the second semiconductor layer. A fourth semiconductor layer is adjacent the third semiconductor layer and includes a dopant of a second conductivity type. Respective contacts are connected to the first and fourth semiconductor layers.
    • 半导体二极管包括包含具有第一导电类型的掺杂剂的第一半导体层。 第二半导体层与第一半导体层相邻并且包括具有第一导电类型并且具有小于第一半导体层的掺杂剂浓度的掺杂剂浓度的掺杂剂。 与第二半导体层相邻的是包括具有第一导电类型并且具有比第二半导体层的掺杂剂浓度更高的掺杂剂浓度的掺杂剂的第三半导体层。 第四半导体层与第三半导体层相邻并且包括第二导电类型的掺杂剂。 各触点连接到第一和第四半导体层。