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    • 4. 发明授权
    • Method of forming an array of electron emitters
    • 形成电子发射体阵列的方法
    • US5455196A
    • 1995-10-03
    • US214926
    • 1994-03-17
    • Gary A. Frazier
    • Gary A. Frazier
    • H01J1/304H01J9/02H01J29/04H01J31/20H01L21/465
    • H01J29/04H01J1/3042H01J31/203H01J9/025H01J2201/319Y10S148/172
    • A method of forming an array of electron field emitters at a face of a semiconductor layer is disclosed. The method includes the steps of: providing a semiconductor workpiece having a plurality of field emitter sites on a face thereof; for each site, forming a conductive column having a base coupled to the site and an upstanding end opposed to the base; for each conductive column, forming a metallic column on the upstanding end of the conductive column; depositing an electrically conductive polymer layer over the workpiece; etching the electrically conductive polymer layer to selectively expose the metallic columns; placing the workpiece in an electrolytic etchant solution capable of etching the metallic columns; applying an electric potential between the conductive polymer layer and an anode electrode in the etchant to etch the metallic columns into a respective plurality of sharp emitter tips; and removing the conductive polymer layer. Where the metallic column is tungsten, an aqueous solution of potassium hydroxide is disclosed as an etchant. Where the metallic column is a platinum-iridium alloy, an aqueous solution of calcium chloride and hydrochloric acid is disclosed as an etchant.
    • 公开了一种在半导体层的表面形成电子场发射体阵列的方法。 该方法包括以下步骤:提供在其表面上具有多个场发射器位置的半导体工件; 形成一个导电柱,该导电柱具有连接到该位置的底座和一个与底座相对的直立端; 对于每个导电柱,在导电柱的直立端上形成金属柱; 在工件上沉积导电聚合物层; 蚀刻导电聚合物层以选择性地暴露金属柱; 将工件放置在能够蚀刻金属柱的电解蚀刻溶液中; 在蚀刻剂中的导电聚合物层和阳极电极之间施加电势,以将金属柱蚀刻成相应的多个尖锐的发射极尖端; 并除去导电聚合物层。 当金属柱是钨时,公开了氢氧化钾的水溶液作为蚀刻剂。 当金属柱是铂 - 铱合金时,公开了氯化钙和盐酸的水溶液作为蚀刻剂。
    • 5. 发明授权
    • Method of making an array of electron emitters
    • 制造电子发射体阵列的方法
    • US5318918A
    • 1994-06-07
    • US814960
    • 1991-12-31
    • Gary A. Frazier
    • Gary A. Frazier
    • H01J1/304H01J9/02H01J29/04H01J31/20H01L21/335H01L21/283
    • H01J29/04H01J1/3042H01J31/203H01J9/025H01J2201/319Y10S148/172
    • This is a method of forming an array of electron emitters at the face of a semiconductor layer. The method comprises the steps of depositing a layer of polycrystalline silicon on a face of a semiconductor workpiece; doping the polycrystalline silicon layer to render the polycrystalline silicon layer conductive; and for each of a plurality of emitter cells, performing an orientation-dependent polycrystalline silicon etch to define a pyramid for the cell having a base affixed to the workpiece and an upstanding tip opposed to the base. Preferably the method also includes the steps of forming a field effect transistor at the face of the workpiece prior to the depositing of the layer, with the pyramid having a base in conductive contact with the drain of the transistor. The polycrystalline silicon layer may be doped in situ after deposition.
    • 这是在半导体层的表面形成电子发射体阵列的方法。 该方法包括以下步骤:在半导体工件的表面上沉积多晶硅层; 掺杂多晶硅层以使多晶硅层导电; 并且对于多个发射极单元中的每一个,执行取向相关多晶硅蚀刻以限定用于具有固定到工件的基部的单元和与基座相对的直立尖端的金字塔。 优选地,该方法还包括以下步骤:在沉积层之前在工件的表面处形成场效应晶体管,金字塔具有与晶体管的漏极导电接触的基极。 多晶硅层可以沉积后原位掺杂。