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    • 9. 发明公开
    • HIGH-FREQUENCY MODULE
    • 高频模块
    • EP2763323A1
    • 2014-08-06
    • EP12835495.8
    • 2012-09-21
    • Murata Manufacturing Co., Ltd.
    • MURASE, HisanoriHAYAKAWA, MasashiUEJIMA, Takanori
    • H04B1/40
    • H04B1/44H03H7/466H03H9/725H04B1/006H04B1/0064
    • A high-frequency module (10) includes a first switch element (21) and a second switch element (22) that are mounted on a multilayer body (100). The first switch element (21) is equipped with a common terminal (Pc1) and individual terminals (Pi11, Pi12, Pi13 and Pi14). The second switch element (22) is equipped with a common terminal (Pc2) and individual terminals (Pi21, Pi22, Pi23 and Pi24). The individual terminals (Pi11, Pi12, Pi13, Pi21, Pi22 and Pi23) are connected to any of SAW filters (411, 412, 421 and 422) mounted on the multilayer body (100) or low loss filters (31 and 32) formed inside the multilayer body (100). The individual terminals (Pi14 and Pi24) are grounded by being connected to an inner layer ground electrode (DPG01) inside the multilayer body (100) by conductive via holes (131 and 132).
    • 高频模块(10)包括安装在多层体(100)上的第一开关元件(21)和第二开关元件(22)。 第一开关元件(21)配备有公共端子(Pc1)和单独端子(Pi11,Pi12,Pi13和Pi14)。 第二开关元件(22)配备有公共端子(Pc2)和单独端子(Pi21,Pi22,Pi23和Pi24)。 各个端子(Pi11,Pi12,Pi13,Pi21,Pi22和Pi23)连接到安装在多层体(100)上的SAW滤波器(411,412,421和422)或者形成在低损耗滤波器(31和32) 在多层体(100)内部。 各个端子(Pi14和Pi24)通过导电通孔(131和132)连接到多层体(100)内的内层接地电极(DPG01)而接地。