专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

CN103779244A 一种板上芯片封装键合自动生产线有权
公开(公告)号：CN103779244A
公开(公告)日：2014-05-07
申请号：CN201410028407.5
申请日：2014-01-21
申请人：谢创 , 彭捷
发明人：彭捷 , 谢创
IPC分类号： H01L21/60 , H05K3/34
CPC分类号： H01L24/97 , H01L2224/95053 , H05K3/341
摘要：一种板上芯片封装键合自动生产线，属于半导体后封装技术领域，为节省人力资源而发明。其包含最少两台键合机（50）、键合前处理设备、键合后处理设备、有机械手和运输带参与构成的输送装置、以及传感器和控制器；其特征是：所有键合机（50）同向沿一直线排列；于所有键合机的对应位置，键合前运输带（10）和键合后运输带（90）并排分别设置且均平行于该直线；每台键合机配套一个机械手（45），其作业区域涵盖该台键合机的键合工位（501）、键合前运输带（10）和键合后运输带（90）。

2. 发明申请

US20110197429A1 Method of Magnetically Driven Simultaneous Assembly 审中-公开
标题翻译：磁驱动同时装配方法
公开(公告)号：US20110197429A1
公开(公告)日：2011-08-18
申请号：US12705985
申请日：2010-02-16
申请人： Nuggehalli Ravindra
发明人： Nuggehalli Ravindra
IPC分类号： H01S4/00
CPC分类号： H01L21/6835 , H01L24/75 , H01L24/83 , H01L24/95 , H01L2221/68313 , H01L2221/68354 , H01L2224/75102 , H01L2224/7598 , H01L2224/83001 , H01L2224/83143 , H01L2224/83192 , H01L2224/95053 , H01L2224/95085 , H01L2224/95144 , H01L2224/95145 , H01L2924/01023 , H01L2924/01033 , H01L2924/01075 , H01L2924/14 , H01L2924/1461 , Y10T29/49002 , H01L2924/00
摘要： Magnetically Driven Simultaneous Assembly is a method for the integration of devices onto substrates. It is a non-statistical, fully controllable and deterministic, simultaneous method of assembly with error checking and handling that is capable of scalable, versatile, and high-yield integration. The method employs a combination of magnetic and gravitational forces (as well as a bonding agent) to assemble devices onto substrates. Devices, coated with a layer of a soft magnetic material, are moved from an initial to a final location by the action of an array of electromagnets above a template. Various devices of arbitrary geometries, with different physical properties and functionalities, are positioned simultaneously above specific desired locations and dropped onto a template under the action of gravity by locally weakening the applied magnetic field. Desired locations on the template correspond to sites on a substrate that contain recesses matching the specifics of the devices. When all desired devices are placed on top of the template, a substrate is brought into contact with that template and devices are transferred from the template to the substrate (for example, by pressing or by rolling). Devices are physically secured onto a substrate by a bonding agent (such as a layer of an adhesive or a hard magnetic material) applied inside of the recesses. Sensors monitor the accuracy of the placement of devices on a template and provide continuous, real-time feedback to an external control unit that automates the process of assembly. If devices are not situated properly on a template, then a specified technique is employed to correct such errors before the final process transfers the devices onto a substrate, thus assuring an accurate, 100% yield.
摘要翻译：磁驱动同时装配是将装置集成到基板上的一种方法。它是一种非统计的，完全可控的和确定性的，同时的组装方法，具有可扩展，多功能和高产出集成的错误检查和处理能力。该方法采用磁力和重力的组合（以及粘合剂）将装置组装到基底上。涂覆有软磁性材料层的装置通过模板上方的电磁体阵列的作用从初始位置移动到最终位置。具有不同物理性质和功能的任意几何形状的各种装置同时位于特定的所需位置之上并通过局部削弱所施加的磁场而在重力作用下落到模板上。模板上的所需位置对应于基板上包含与设备细节匹配的凹槽的位置。当将所有所需的装置放置在模板的顶部时，使衬底与该模板接触，并且将装置从模板转移到衬底（例如通过压制或通过轧制）。设备通过施加在凹部内部的粘合剂（例如粘合剂层或硬磁性材料层）物理地固定在基底上。传感器监控模板上设备放置的准确性，并为外部控制单元提供连续的实时反馈，从而使组装过程自动化。如果设备没有正确地放置在模板上，那么在最终的工艺将器件转移到衬底上之前，采用指定的技术来纠正这些错误，从而确保了100％的准确率。

3. 发明公开

US20230282611A1 SEMICONDUCTOR DEVICE MANUFACTURING METHOD 审中-公开
公开(公告)号：US20230282611A1
公开(公告)日：2023-09-07
申请号：US18159272
申请日：2023-01-25
申请人： FUJI ELECTRIC CO., LTD.
发明人： Hiroki TAKAHASHI , Tsunehiro NAKAJIMA , Takashi SAITO
IPC分类号： H01L23/00 , H01L25/07 , H01L25/00
CPC分类号： H01L24/83 , H01L24/95 , H01L24/32 , H01L24/29 , H01L25/072 , H01L25/50 , H01L2224/95053 , H01L2224/83054 , H01L2224/83201 , H01L2224/8384 , H01L2224/83815 , H01L2224/83948 , H01L2224/83455 , H01L2924/0132 , H01L2224/83463 , H01L2924/01005 , H01L2224/83439 , H01L2224/83395 , H01L2224/29139 , H01L2224/32225 , H01L2924/13055 , H01L2924/10253 , H01L2924/10272 , H01L2924/13091 , H01L2924/20105 , H01L2924/20106 , H01L24/40 , H01L24/73 , H01L2224/73263 , H01L2224/40225 , H01L2224/73265 , H01L2224/73221 , H01L24/48 , H01L2224/48225 , H01L2224/48106 , H01L24/45 , H01L2224/45144 , H01L2224/45147 , H01L2224/45124 , H01L24/37 , H01L2224/37147 , H01L2224/37655 , H01L2224/37638
摘要： When a semiconductor unit is heated, a heater having a flat heating surface is used for performing heating in a state in which a lower surface of an insulated circuit board is placed on the heating surface. When the semiconductor unit is cooled, a cooler having a cooling surface including a pair of support portions is used for performing cooling in which a lower surface of a pair of outer regions of the insulated circuit board are respectively placed to be contact with the pair of support portions, and in which a central region between the pair of outer regions of the insulated circuit board is pressed downward so as to be downward convex.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式